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| 取代表面涂（镀）覆而改进的有机可焊性保护剂 | |
| 引用本文： | 丁志廉.取代表面涂（镀）覆而改进的有机可焊性保护剂[J].印制电路信息,2005(1):52-57. |
| 作者姓名： | 丁志廉 |
| 摘 要： | 该文综述了新一代OSP的优点和应用效果。 |
| 关 键 词： | 苯并咪唑OSP 苯基咪唑OSP 沉积残留物 离子清洁度 |
Improved Organic Solderability Preservatives(OSPs) for Surface Finishes |
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| Ding Zhilian.Improved Organic Solderability Preservatives(OSPs) for Surface Finishes[J].Printed Circuit Information,2005(1):52-57. | |
| Authors: | Ding Zhilian |
| Institution: | Ding Zhilian |
| Abstract: | This article summarizes the benefits and application effect of latest generation OSP. |
| Keywords: | benzimidazole OSP phenylimidazole OSP deposited residues ionic cleanliness |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ | |