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Pattern transition of temperature distribution at Czochralski silicon melt surface
Authors:M. Tanaka   M. Hasebe  N. Saito
Affiliation:

a Crystal Growth Technology and Planning Group, NSC Electron Corporation, 3434 Shimata, Hikari, Yamaguchi 743, Japan

b Advanced Technology Research Laboratories, Nippon Steel Corporation, 3434 Shimata, Hikari, Yamaguchi 743, Japan

c Fuji Research Laboratory, Tokai Carbon Co., Ltd., 394-1 Subashiri, Oyama-cho, Sunto-Gun, Shizuoka 410-14, Japan

Abstract:The melt surface temperature in Czochralski silicon growth was studied by CCD camera observation. The thermal radiation energy from the melt surface was converted into temperature by the blackbody calibration method and was recorded with a VCR as two-dimensional color images. The experimental results without a crystal revealed that the temperature distribution at the melt surface can change in four patterns depending on the crucible rotation rate: axisymmetric spoke pattern at low rotation rates, n-folded and island patterns at medium rotation rates, and cellular patterns at high rotation rates. To predict the fluid motion from the experimental observations, three-dimensional time-dependent numerical simulations of the silicon melt flow were executed. As a result, a qualitative transition model for the temperature distribution and the Czochralski silicon melt flow was derived.
Keywords:
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