A Shadow Moire Technique by Optional Multiple Light Sources for BGA Coplanarity Measurement

１ＩｎｔｒｏｄｕｃｔｉｏｎＳｈａｄｏｗｍｏｉｒｅｉｎｔｅｒｆｅｒｏｍｅｔｒｙｉｓａｗｈｏｌｅｆｉｅｌｄｎｏｎｃｏｎｔａｃｔ３Ｄｍｅａｓｕｒｅｍｅｎｔｔｅｃｈｎｉｑｕｅ．ＩｔｉｓｆｉｒｓｔａｐｐｌｉｅｄｂｙＨ．Ｔａｋａｓａｋｉ［１］ｉｎ１９７０．Ｉｎ...     

工艺条件对 BGA 焊点电性能的影响

研究不同的焊接温度及焊接时间对ＢＧＡ焊点电性能和疲劳特性的影响．测试了不同焊接条件和热处理下焊点的电阻及其与温度的关系,并比较了不同样品在热冲击前后的电性能．实验发现在２３０℃下保温３００ｓ,焊接的焊点具有良好的电性能和疲劳特性,且在ｌ００℃下热处理ｌ５ｍｉｎ后样品的电性能和疲劳特性都有较大提高．     

焊点/底充胶夹层等效弹性常数的简化分析

将高阶逐层离散层板模型和均匀化理论相结合,应用于具有非完全(单层内)周期性微结构的多层结构,用解析法分析了电子封装结构中由焊点和底充胶构成的非均质夹层的等效弹性常数．计算结果与已有结果进行了比较,验证了文中分析方法的有效性和简便性．     

Research on the fault diagnosis technology of intermittent connection failure belonging to FPGA solder-joints in BGA package

A new method to detect intermittent faults in FPGA (field programmable gate array) of BGA (ball grid array) packages is presented. Inject proper current into measured IO port via sensor circuit, the intermittent faults will arouse impedance of the solder-joint to change intermittently, the voltage of solder-joint will also change intermittently, the fault information can be obtained through regulating the voltage signal. Compared with current monitoring method based on degradation model, this scheme is more reliable and accurate. It can prevent the catastrophic faults caused by failure of the FPGA solder-joints effectively, as well as economize the maintenance cost.     

无铅BGA封装可靠性的跌落试验及焊接界面微区分析

通过进行BGA封装的可靠性力学试验(高加速度跌落试验),研究了机械冲击和应力对无铅BGA封装焊点的可靠性的影响,并通过对失效BGA封装焊点的微观结构和成分的SEM/EDX分析,寻找影响焊点可靠性的主要因素,研究结果表明,焊点的失效模式较为复杂,而在多数情况下,焊点的疲劳失效与焊接界面处的金属间化合物IMC层断裂有关,并对无铅焊料IMC的性质也作了研究.     

Application of structured lighting sensor for online measurement

On the background of increasing request for stringent quality improvement and rising productivity, requirements for online measurement systems are growing as well. Among all the measurement tools, the vision system is considered as the most appropriate tool to provide proper accuracy, high speed, low cost, and 100% online inspection. Structure lighting sensor is the most popular method used in vision system. In this paper, the theory of vision system based on structure lighting is introduced. The measurement application to the seamless steel tube is introduced particularly. Another typical application, the online measurement on car body using structure lighting, is also illustrated.     

Development of a BGA Package Based on Si Interposer with Through Silicon Via

A ball grid array (BGA) package based on Si interposer with through silicon via (TSV) was designed. Thermal behaviors of the designed BGA with Si interposer has been analyzed and compared to a conventional BGA with BT substrate in the approach of finite element modeling (FEM). The Si interposer with TSV was then fabricated and the designed BGA package was demonstrated. The designed BGA package includes a 100 μm thick Si interposer, which has redistribution copper traces on both sides. Through vias with 25 to 40 μm diameter were fabricated on the Si interposer using deep reactive ion etching (DRIE), plasma enhanced chemical vapor deposition (PECVD), copper electroplating and chemical mechanical polishing (CMP), etc. TSV in the designed interposer is used as electrical interconnections and cooling channels. 5 mm by 5 mm and 10 mm by 10 mm thermal chips were assembled on the Si interposer.     

六西格玛在F半导体公司BGA产品质量改进的应用

BGA(Ball Grid Array球栅阵列封装)是一项被广泛应用的高密度封装技术。对BGA产品制造来说,过程中的最容易出现次品的环节是植球工序。本文采用六西格玛管理的DMAIC流程,通过控制胶量厚度和植球偏移量这两点对提高植球成功率最有影响的因素,对影响BGA产品制造过程中植球工序的设备能力进行了改进,取得良好的效果。     

BGA焊点空洞缺陷的数学形态学分析

BGA焊点焊接过程中容易产生气泡,形成空洞缺陷,检测时如何自动分析一直是个难题。提出使用Otsu算法分割焊球,使用数学形态学中的开闭运算、顶帽变换提取空洞缺陷的技术方案,实现每个焊点空洞缺陷的准确提取和自动分析。实验结果表明,提出的技术方案鲁棒性强,可应用于BGA焊点的空洞缺陷检测。     

Significant isostatic imbalance near the seismic gap between the M8.0 Wenchuan and M7.0 Lushan earthquakes

A gravity network with 302 observation points has been established in the western Sichuan Foreland Basin （SFB） to explore Bouguer gravity anomalies （BGAs）. Our observational results reveal that the BGAs are negative as a whole, with a maximum value of -220 mGal （10^-5m s^-2） at the northwest region of the study area. The real Moho depths beneath the SFB revealed by BGA data change smoothly from 39.5 km in the southeast to 43.7 km in the northwest of the monitoring region. However, the isostatic ones deduced from Airy isostatic model and topographical data vary approximately 39.5-42.0 km. The maximum differences of 2.7 km between the real and isostatic Moho depths are found near the seismic gap between the M8.0 Wenchuan and M7.0 Lushan earthquakes, where the crust is in the greatest isostatic imbalance of the monitoring region. Analysis of the isostatic state indicates that the deep dynamic environment near the seismic gap between these two earthquakes indicates an M ≥ 7.0 earthquake in the future. This study indicates that we can use isostasy as a potential approach to study the dynamic process of crustal material movement and to analyze regional potential seismic risks.