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1.
在管式反应器中采用苯甲酸、聚乙二醇、固体古马隆树脂(S)、液体古马隆树脂(L)为添加剂来降低煤沥青中有害物质苯并芘的含量,以期使得煤沥青可绿色化应用。采用紫外-可见分光光度计分析煤沥青中苯并芘含量。考察了反应温度、反应时间、添加剂添加量、催化剂等工艺条件对添加剂脱除煤沥青中苯并芘的影响。结果表明,不同工艺条件能降低煤沥青中苯并芘的含量。在优化条件下,不同添加剂对苯并芘脱除率由高到低依次为:液体古马隆树脂、聚乙二醇、苯甲酸和固体古马隆树脂。分析其反应机理,这与催化剂的酸性相关,发生亲电取代反应。结果表明,液体古马隆树脂(L)在催化剂存在下对煤沥青中苯并芘脱除率可达73.0%,显示了良好的应用前景。 相似文献
2.
This paper overviews the electro-optical and thermal performances of different types of infrared detectors manufactured by
Sofradir. The detector’s fabrication processes and detector’s performance are shortly described. New staring arrays are more
compact and offer system solutions required by infrared market. Special attention is directed to some reliability advantages
of new dewar design. Finally, the development trends for highest resolution infrared detector are discussed.
The paper presented there appears in Infrared Photoelectronics, edited by Antoni Rogalski, Eustace L. Dereniak, Fiodor F. Sizov, Proc. SPIE Vol. 5957, 59570U (2005). 相似文献
3.
王振宇 《电气电子教学学报》2002,24(6):43-45
多级并接型权电阻解码网络结构简单,分析方便,文章给出了普通的和BCD码多级并接型权电阻解码网络,推导出了各级与运放的连接电阻的通用公式,并用EWB软件进行了电路模拟,这种方法对自行设计权电阻DAC有一定的参考价值。 相似文献
4.
用分数延迟改进基音预测的CELP编码方案 总被引:2,自引:0,他引:2
在CELP编码器中,通常用延迟为抽样间隔整数倍的长项预测器表征浊音语音的准周期性,然而在低比特率,这种限制降低了编码器的性能。本文在介绍了CELP编码器原理及激励码本构成后,重点研究了一种新型的基音预测方法;分数延迟基音预测,计算机模拟结果表明,这种方法能对浊音进行更准确的表达,尤其对女性讲话者明显改善了语音质量。 相似文献
5.
In this work we consider computing and continuing connecting orbits in parameter dependent dynamical systems. We give details
of algorithms for computing connections between equilibria and periodic orbits, and between periodic orbits. The theoretical
foundation for these techniques is given by the seminal work of Beyn in 1994, “On well-posed problems for connecting orbits
in dynamical systems”, where a numerical technique is also proposed. Our algorithms consist of splitting the computation of
the connection from that of the periodic orbit(s). To set up appropriate boundary conditions, we follow the algorithmic approach
used by Demmel, Dieci, and Friedman, for the case of connecting orbits between equilibria, and we construct and exploit the
smooth block Schur decomposition of the monodromy matrices associated to the periodic orbits. Numerical examples illustrate
the performance of the algorithms.
This revised version was published online in July 2006 with corrections to the Cover Date. 相似文献
6.
还原温度对超细K-Co-Mo催化剂合成低碳醇性能的影响 总被引:2,自引:0,他引:2
用溶胶-凝胶法合成了K-Co-Mo催化剂.样品经不同温度还原后,用于低碳醇的合成.XRD和HRTEM结果表明,样品是超细粒子,粒子尺寸为2~5nm.考察了催化剂的还原温度和反应条件对催化剂性能的影响.实验结果表明,还原温度对催化剂的活性有较大的影响,最佳还原温度为500℃.最佳反应温度范围为310~330℃.升高压力和空速可以提高醇的收率和选择性.在空速14400h-1,压力6.0MPa和温度310℃的条件下,醇的选择性为55.8%,收率为520.0g/(kg·h),MeOH/C2+OH为0.27.催化剂稳定性良好,在200h的寿命实验中,活性基本不变.与文献中催化剂相比,超细K-Co-Mo催化剂对合成醇具有较高的活性和选择性,尤其是对C2+OH的合成明显高于其他合成醇催化剂体系. 相似文献
7.
ABSTRACT Novel chiral three-ring (R) enantiomers were synthesised using optically active (R)-(?)-2-octanol. Properties, such as the sequence of phases, the transition temperatures and enthalpies, were tested by a polarising optical microscope and differential scanning calorimeter. An antiferroelectric smectic phase (SmCA*) with a direct transition from the antiferroelectric to the isotropic phase (SmCA*-Iso) was observed for three esters with an achiral C3F7CH2O(CH2)3O– terminal chain. Bi- and multicomponent mixtures with a broad temperature range of the antiferroelectric phase and good electro-optical properties were formulated. Helical pitch of pure esters and mixtures was measured by spectrophotometry method. 相似文献
8.
The history and present state of the art in the chemistry of mesophase pitch, which is an important precursor for carbon fiber and other high-performance industrial carbons, are reviewed relative to their structural properties. The structural concepts in both microscopic and macroscopic views are summarized in terms of the sp(2) carbon hexagonal plane as a basic unit common to graphitic materials, its planar stacking in clusters, and cluster assembly into microdomains and domains, the latter of which reflect the isochromatic unit of optical anisotropy. Such a series of structural units is described in a semiquantitative manner corresponding to the same units of graphitic materials, although the size and stacking height of the hexagonal planes (graphitic sheets) are very different. Mesophase pitch is a liquid crystal material whose basic structural concepts are maintained in the temperature range of 250 to 350 degrees C. The melt flow and thermal properties are related to its micro- and mesoscopic structure. The structure of mesophase-pitch-based carbon fiber of high tensile strength, modulus, and thermal conductivity has been formed through spinning, and has inherited the same structural concepts of mesophase pitch. Stabilization settles the structure in successive heat treatments up to 3000 degrees C. Carbonization and graphitization enable growth of the hexagonal planes and their stacking into units of graphite. Such growth is governed and controlled by the alignment of micro- and mesoscopic structures in the mesophase pitch, which define the derived carbon materials as nanostructural materials. Their properties are controlled by the nanoscopic units that are expected to behave as nanomaterials when appropriately isolated or handled. 相似文献
9.
M. Bigas 《Microelectronics Journal》2006,37(4):308-316
Environmental concerns as well as legal constraints have been pushing research on flip chip technology towards the development of lead-free solders and also to new deposition techniques [Z.S. Karim, R. Schetty, Lead-free bump interconnections for flip-chip applications, in: IEEE/CPMT 1nternational Electronics Manufacturing Technology Symposium, 2000, pp. 274-278, P. Wölflick, K. Feldmann, Lead-free low-cost flip chip process chain: layout, process, reliability, in: IEEE International Electronics Manufacturing Technology (IEMT) Symposium, 2002, pp. 27-34, M. McCormack, S. Jin, The design and properties of new, pb-free solder alloys, in: IEEE/CPMT International Electronics Manufacturing Technology Symposium, 1994, pp. 7-14, T. Laine-Ylijoki, H. Steen, A. Forsten, Development and validation of a lead-free alloy for solder paste applications. IEEE Transactions on Components, Packaging, and Manufacturing technology, 20(3) (1997) 194-198, D. Frear, J. Jang, J. Lin, C. Zhang, Pb-free solders for flip-chip interconnects, JOM, 53(6) (2001) 28-32].Binary and ternary tin alloys are promising candidates to substitute lead-content components. In this paper, we describe an electroplating technique for high density FlipChip packaging [M. Bigas, E. Cabruja, Electrodeposited Sn/Ag for flip chip connection, CDE (2003)]. An analysis using Auger Electron Spectroscopy (AES) together with additional Energy Dispersive Xray analysis (EDS) tests and Scanning Electron Microscope (SEM) analysis have been performed to optimize the reflow process of the electrodeposited bumps. 相似文献
10.