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Describing Hydrodynamic Particle Removal from Surfaces Using the Particle Reynolds Number 总被引:1,自引:0,他引:1
The fundamental processes related to the removal of fine particles from surfaces in a hydrodynamic flow field are not adequately understood. A critical particle Reynolds number approach is proposed to assess these mechanisms for fine particles when surface roughness is small compared to particle diameter. At and above the critical particle Reynolds number, particle removal occurs, while below the critical value, particles remain attached to a surface. The system under consideration consists of glass particles adhering to a glass surface in laminar channel flow. Our results indicate rolling is the removal mechanism, which is in agreement with the literature. Theoretical results of the critical particle Reynolds number model for rolling removal are in general agreement with experimental data when particle size distribution, particle and surface roughness, and system Hamaker constant are taken into account. 相似文献
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简要论述了互连工艺中铜布线取代铝布线的必然趋势,以及铜布线片化学机械抛光(CMP)后进行清洗的必要性。在集成电路制造的过程中,漏电流的危害已经引起了广泛关注。在CMP过程中产生的三种主要表面缺陷对漏电流都有一定的影响,但其中重金属离子对漏电流的影响是最大的。通过使用不同浓度的FA/O螯合剂对铜布线片进行清洗,从而得出最佳的去除金属离子降低漏电流的清洗浓度。为了防止FA/O螯合剂对铜线条造成腐蚀,采用在清洗液中加入缓蚀剂苯并三氮唑(BTA)来有效控制铜线条的表面腐蚀,从而得到理想的清洗结果。25℃时,加入20 mmol/L BTA的体积分数为0.4%的FA/O螯合剂降低漏电流的效果最佳。 相似文献
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