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1.
2.
The feature scale planarization of the copper chemical mechanical planarization (CMP) process has been characterized for two
copper processes using Hitachi 430-TU/Hitachi T605 and Cabot 5001/Arch Cu10K consumables. The first process is an example
of an abrasive-free polish with a high-selectivity barrier slurry, while the second is an example of a conventional abrasive
slurry with a low-selectivity barrier slurry. Copper fill planarization has been characterized for structures with conformal
deposition as well as with bumps resulting from bottom-up fill. Dishing and erosion were characterized for several structures
after clearing. The abrasive-free polish resulted in low sensitivity to overpolish and low saturation levels for dishing and
erosion. Consequently, this demonstrated superior performance when compared to the International Technology Roadmap for Semiconductors
(ITRS) 2000 roadmap targets for planarization. While the conventional slurry could achieve the 0.13-μm technology node requirements,
the abrasive-free polish met the planarization requirements beyond the 0.10-μm technology node. 相似文献
3.
4.
Raymond Mackay Jie Zhang Qi Wu Yuzhuo Li 《Colloids and surfaces. A, Physicochemical and engineering aspects》2004,250(1-3):343-348
The longitudinal relaxation times (T1) of water in concentrated silica and alumina slurries were measured as a function of solids content. It was shown that the results could be fit very well with a two-phase fast-exchange model between free and surface-bound water. As expected, values of T1 for bound water were in the order of 20–2000 times lower than that for free water, indicating a higher effective viscosity of the surface-bound water. The strength of the interaction depended on the particular surface, and all of the aluminas examined interacted more strongly with water than the two silicas studied, which themselves differed considerably. The chemical mechanical polishing (CMP) removal rate of tantalum by silica slurries was shown to be directly correlated with the interaction parameters, derived from the NMR relation times rather than with total surface hydroxyl group concentration. 相似文献
5.
Chemical mechanical polishing of polymer films 总被引:2,自引:0,他引:2
Strategies to reduce capacitance effects associated with shrinking integrated circuit (IC) design rules include incorporating
low resistivity metals and insulators with low dielectric values, or “low-κ” materials. Using such materials in current IC
fabrication schemes necessitates the development of reliable chemical mechanical polishing (CMP) processes and process consumables
tailored for them. Here we present results of CMP experiments performed on FLARE™ 2.0 using a specialized zirconium oxide
(ZrO2) polishing slurry. FLARE™ 2.0 is a poly(arylene) ether from AlliedSignal, Inc. with a nominal dielectric constant of 2.8.
In addition, we provide insight into possible removal mechanisms during the CMP of organic polymers by examining the performance
of numerous abrasive slurries. Although specific to a limited number of polymers, the authors suggest that the information
presented in this paper is relevant to the CMP performance of many polymer dielectric materials. 相似文献
6.
用于铜的化学机械抛光液的研究 总被引:2,自引:0,他引:2
文中介绍了一种以碱性抛光液对铜进行全局平面化的方法 ,讨论了以 Si O2 水溶胶为磨料的抛光液在Cu-CMP过程中的化学 (络合 )作用及反应机理 ,并给出了抛光液的配比及上机实验结果。结果表明 :该抛光液用于对带有阻挡层和介质层的铜抛光 ,达到了对铜层的高去除速率和高选择比 ,取得了较好的全局平面化效果 相似文献
7.
外加无机电解质对煤浆性质调控作用的研究 总被引:6,自引:1,他引:6
考察了数种无机电解质对煤浆分散体系流变特性的影响。结果发现,煤浆的流变特性不仅与电解质种类有关,还取决于煤质特征。某些煤适,适量的无机电解质可使浆体的屈报胀塑料转化为屈服假塑性。 相似文献
8.
9.
水合醋酸铈直接热分解制备超细氧化铈及其抛光性能 总被引:3,自引:0,他引:3
Ultra fine ceria was prepared by calcining hydrate cerium acetate. The effects of pyrolysis temperature on the particle size, morphology, specific surface area and loose packing density of ceria were investigated, and the removal rate of optical glasses polishing by ceria was determined. The results show that with the increase of pyrolysis temperature, the loose deposit density and crystallinity increases and the specific surface area decreases, however, the particle size decreases firstly and then increases, the minimum medium particle size D50 is 0.47 μm at pyrolysis temperature of 1 000 ℃. The SEM images of ceria prepared by the decomposition at 800 ℃ or at 1 100 ℃ show porous powders or quasi-sphere small particles with loosely agglomeration, respectively. It was found that the removal rate varied with pyrolysis temperature in preparation of ceria and the property of glass polished. The removal rate for three kinds of glasses was in the order of ZF7> F1> K9, and the maximum value appeared at around 1 000 ℃ for ZF7 and F1, and at around 1 100 ℃ for K9. 相似文献
10.
Ignacio López-García Mateo Sánchez-Merlos Manuel Hernández-Córdoba 《Spectrochimica Acta Part B: Atomic Spectroscopy》1997,52(14):378-2092
A graphite furnace atomic absorption spectrometric procedure for the determination of mercury is presented, in which the samples are suspended in a solution containing hydrofluoric and nitric acids. Silver nitrate (4% m/v) and potassium permanganate (3%) are incorporated, in the order specified, and aliquots are directly introduced into the graphite furnace. A fast heating programme with no conventional pyrolysis step is used. The detection limit for mercury in a 125 mg ml−1 suspension is 0.1 μg g−1. Calibration is performed by using aqueous standards. The reliability of the procedure is proved by analysing certified reference materials. 相似文献