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Green solvent approach for printable large deformation thermoplastic elastomer based piezoresistive sensors and their suitability for biomedical applications 下载免费PDF全文
Bruna F. Gonçalves Pedro Costa Juliana Oliveira Sylvie Ribeiro Vitor Correia Gabriela Botelho Senentxu Lanceros‐Mendez 《Journal of Polymer Science.Polymer Physics》2016,54(20):2092-2103
Composites based on biocompatible thermoplastic elastomer styrene‐ethylene/butylene‐styrene (SEBS) as matrix and multi‐walled carbon nanotubes (MWCNT) as nanofillers show excellent mechanical and piezoresistive properties from low to large deformations. The MWCNT/SEBS composites have been prepared following a green solvent approach, to extend their range of applicability to biomedical applications. The obtained composites with 2, 4, and 5 wt % MWCNT content provide suitable piezoresistive response up to 80% deformation with a piezoresistive sensibility near 2.7, depending on the applied strain and MWCNT content. Composite sensors were also developed by spray and screen printing and integrated with an electronic data acquisition system with RF communication. The possibility to accurately control the composites properties and performance by varying MWCNT content, viscosity, and mechanical properties of the polymer matrix, shows the large potential of the system for the development of large deformation printable piezoresistive sensors. © 2016 Wiley Periodicals, Inc. J. Polym. Sci., Part B: Polym. Phys. 2016 , 54, 2092–2103 相似文献
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柔性压阻式传感器具有结构简单、易于制备、检测范围广等优势, 在可穿戴电子器件领域中扮演着非常重要的角色. 在制备柔性压阻式传感器的众多方法中, 溶液法由于操作简单、反应条件温和、材料的适用性广泛、易于规模化制备等优势, 成为极具发展前景的制备工艺. 在此基础上, 如何进一步提高柔性压阻式传感器的力学与电学性能也成为研究者们更加关注的话题. 另外, 制备图案化、微型化、规模化的传感器阵列为柔性压阻式传感器的应用范围拓展了新的道路. 本综述首先介绍了柔性压阻式传感器的工作原理与性能指标, 同时讨论了其性能指标对传感器在实际应用中的影响. 随后, 简单介绍了其构成材料, 并通过梳理近年来溶液法制备柔性传感器的研究成果, 选取了几种典型的溶液法制备方法进行重点介绍, 指出其具备的优势及目前存在的问题. 最后, 对溶液法制备柔性传感器的发展方向进行总结与展望. 相似文献
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硅压阻式传感器的温度特性及其补偿 总被引:2,自引:0,他引:2
基于硅压阻式传感器的工艺过程与后续电路设计 ,讨论了减小其温度影响的措施。文中对在相同的硅基底上 ,采用诸如扩散、离子注入、薄膜淀积以及溅射等不同加工工艺制作实现的不同的压敏电阻特性 ,特别是温度特性进行了探讨和比较。针对一种具体的硅杯结构的压阻式传感器 ,设计、选择了加工工艺 ,给出了压敏电阻的近似温度补偿公式 ,讨论了传感器补偿电路的实现方案 相似文献
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A novel algorithmic method, based on the different stress distribution on the surface of thin film in an SOI microstructure, is put forward to calculate the value of the silicon piezoresistance on the sensitive film. In the proposed method, we take the Ritz method as an initial theoretical model to calculate the rate of piezoresistance ΔR/R through an integral (the closed area Ω where the surface piezoresistance of the film lies as the integral area and the product of stress σ and piezoresistive coefficient π as the integral object) and compare the theoretical values with the experimental results. Compared with the traditional method, this novel calculation method is more accurate when applied to calculating the value of the silicon piezoresistance on the sensitive film of an SOI pieoresistive pressure sensor. 相似文献
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Ziya Wang Xiao Guan Huayi Huang Haifei Wang Waner Lin Zhengchun Peng 《Advanced functional materials》2019,29(11)
A soft piezoresistive sensor with its unique characteristics, such as human skin, light weight, and multiple functions, yields a variety of possible practical applications to skin‐attachable electronics, human–machine interfaces, and electronic skins. However, conventional filler‐matrix piezoresistive sensors often suffer from unsatisfactory sensitivity or insufficient measurement range, as well as significant cross‐correlation between out‐of‐plane pressure and in‐plane extension. Here, a stretchable piezoresistive sensor (SPS) is realized by combining a hierarchically porous sensing element with a multimodulus device architecture via a full 3D printing process. As a result, the sensor exhibits high sensitivity (5.54 kPa?1), large measurement range (from 10 Pa to 800 kPa), limited cross‐correlation, and excellent durability. Meanwhile, benefiting from the porous structure and mechanical mismatch design, which efficiently distributes the stress away from the sensing element, the device experiences only 7% resistance change at 50% stretching. This approach is employed to rapidly program and readily manufacture stylish, all‐in‐one, functional devices for various applications, demonstrating that the technique is promising for customized stretchable electronics. 相似文献
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