Alkoxide Derived SrBi2Ta2O9 Phase Pure Powder and Thin Films

Phase pure powder and thin films of the novel ferroelectric materials SrBi₂Ta₂O₉ (SBT) have been prepared using the organic precursors. The xero-gel formed was dried and characterized using TGA and DTA to determine the organic burn out and crystallization temperature of SBT. Powder X-ray diffraction was used systematically to check the crystallinity of SBT. Phase pure SBT powder was formed as low as 650°C and thin films at 600°C in comparison to other earlier reported work. SEM micrographs show a grain size of ≈0.1 μm and show crack free films with a film thickness of 2 μm.     

无铅焊膏用助焊剂的制备与研究

无铅焊膏用助焊剂需要一定的黏性,选择有机酸和有机胺混合作为活性物质,配合一定量的松香配制出一种助焊剂。通过控制助焊剂中松香的含量,降低不挥发物的含量,减少残留物对元器件的腐蚀。依据标准对所配制的助焊剂进行了性能测试,并与一种松香含量较高的助焊剂比较。结果表明:助焊剂的松香含量降低约10%,在260℃焊接后不挥发物含量降低了近6%,黏度较好,无卤化物,无毒,环保,符合焊膏用助焊剂的要求。     

非挥发性记忆体Read Disturb测试方法的研究

DDF是一种高容量的NAND Flash。以DDF产品为例,研究和讨论了它的Read Disturb测试方法。受测试时间的限制,只能选择局部的存储区间进行DDF的Read Disturb测试。这样局部区间的测试结果是否能够代表整个芯片的性能,设计了一套实验,对这个课题进行了研究和讨论。依据非挥发性记忆体产品的特性,主要以阈值电压的分布为参考来评价DDF芯片性能的一致性和性能恶化趋势的一致度。最后的实验结果证明了这种测试方法的正确性和合理性。这种分析方法也可以用于其他非挥发性记忆体产品的其他可靠性测试项目的评估。     

Preparation and Ferroelectric Properties of YMnO3 Thin Films with c-Axis Preferred Orientation by the Sol-Gel Method

Hexagonal YMnO₃ has a ferroelectric property with an optimal remanent polarization along the c-axis. The c-axis oriented YMnO₃ thin films with a small leakage current were prepared by the sol-gel dipping method. The c-axis orientation of the films was promoted by the addition of diethanolamine to the Mn precursor solution. A heat treatment with multiple steps led to a dense film structure with fine grains. The dense structure resulted in the decrease of the leakage current. Furthermore, when the films were heat-treated in a vacuum, the leakage current became considerably small and the ferroelectricity of the YMnO₃ thin films was observed even at room temperature.     

Versatile threshold voltage control of OTFTs via discontinuous pn-heterojunction formation

We demonstrate the versatility of the threshold voltage control for organic thin-film transistors (OTFTs) based on formation of discontinuous pn-heterojunction on the active channel layer. By depositing n-type dioctyl perylene tetracarboxylic diimide molecules discontinuously onto base p-type pentacene thin films (the formation of the discontinuous pn-heterojunction), a positive shift of the threshold voltage was attained which enabled realizing a depletion-mode transistor from an original enhancement-mode pristine pentacene transistor. Careful control of the threshold voltage based on this method led assembling a depletion-load inverter comprising a depletion-mode transistor and an enhancement-mode transistor connected in series that yielded tunable signal inversion voltage approaching 0 V. In addition, the tunability could be applied to improve the program/erase signal ratio for non-volatile transistor memories by more than 4 orders of magnitude compared to reference memory devices made of pristine pentacene transistors.     

Thin reduced graphene oxide interlayer with a conjugated block copolymer for high performance non-volatile ferroelectric polymer memory

Polymer ferroelectric-gate field effect transistors (Fe-FETs) employing ferroelectric polymer thin films as gate insulators are highly attractive as a next-generation non-volatile memory. For minimizing gate leakage current of a device which arises from electrically defective ferroelectric polymer layer in particular at low operation voltage, the materials design of interlayers between the ferroelectric insulator and gate electrode is essential. Here, we introduce a new solution-processed interlayer of conductive reduced graphene oxides (rGOs) modified with a conjugated block copolymer, poly(styrene-block-paraphenylene) (PS-b-PPP). A FeFET with a solution-processed p-type oligomeric semiconducting channel and ferroelectric poly(vinylidene fluoride-co-trifluoroethylene) (PVDF-TrFE) insulator exhibited characteristic source–drain current hysteresis arising from ferroelectric polarization switching of a PVDF-TrFE insulator. Our PS-b-PPP modified rGOs (PMrGOs) with conductive moieties embedded in insulating polymer matrix not only significantly reduced the gate leakage current but also efficiently lowered operation voltage of the device. In consequence, the device showed large memory gate voltage window and high ON/OFF source–drain current ratio with excellent data retention and read/write cycle endurance. Furthermore, our PMrGOs interlayers were successfully employed to FeFETs fabricated on mechanically flexible substrates with promising non-volatile memory performance under repetitive bending deformation.     

Design and scaling of nano-electro-mechanical non-volatile memory (NEMory) cells

Design and scaling of the NEMory cell have been discussed. Based on analytical simulation using a simple parallel-plate approximation, scaling guideline is derived in terms of pull-in, release voltage, pull-in time and release time. It has been proved that beam length is the most dominant factor which increases operating voltage with scaling-down. Beam and air gap thickness also need to be scaled down in order to lower operating voltage while improving operating speed.     

SONOS非易失性存储器件研究进展

随着半导体存储器件的小型化、微型化,传统多晶硅浮栅存储因为叠层厚度过大,对隧穿氧化层绝缘性要求过高而难以适应未来存储器的发展要求。最近,基于绝缘性能优异的氮化硅的SONOS非易失性存储器件,以其相对于传统多晶硅浮栅存储器更强的电荷存储能力、易于实现小型化和工艺简单等特性而重新受到重视。文章论述了SONOS非易失性存储器件的存储原理和存储性能的影响因素研究进展,并在材料、工艺与结构设计等方面对SONOS存储器件性能改进的研究进展情况进行了分析和讨论。     

适用于无源射频标签的低功耗单栅非挥发性存储器

针对低成本、低功耗无源射频电子标签,采用SMIC 0.18μm标准CMOS工艺设计实现了单栅、576bit的非挥发性存储器.存储器单元基于双向Fowler-Nordheim隧穿效应原理并采用普通的pMOS晶体管实现;编程/擦写时间为10ms/16bit.芯片实现块编程和擦写功能,通过提出一种新型的敏感放大器而实现了读功耗的优化.在电源电压为1.2V,数据率为640kHz时,读操作平均消耗电流约为0.8μA.     

High-Throughput Screening for Phase-Change Memory Materials

Phase change memory (PCM) is an emerging non-volatile data storage technology concerned by the semiconductor industry. To improve the performances, previous efforts have mainly focused on partially replacing or doping elements in the flagship Ge-Sb-Te (GST) alloy based on experimental “trial-and-error” methods. Here, the current largest scale PCM materials searching is reported, starting with 124 515 candidate materials, using a rational high-throughput screening strategy consisting of criteria related to PCM characteristics. In the results, there are 158 candidates screened for PCM materials, of which ≈68% are not employed. By further analyses, including cohesive energy, bond angle analyses, and Born effective charge, there are 52 materials with properties similar to the GST system, including Ge₂Bi₂Te₅, GeAs₄Te₇, GeAs₂Te₄, so on and other candidates that have not been reported, such as TlBiTe₂, TlSbTe₂, CdPb₃Se₄, etc. Compared with GST, materials with close cohesive energy include AgBiTe₂, TlSbTe₂, As₂Te₃, TlBiTe₂, etc., indicating possible low power consumption. Through further melt-quenching molecular dynamic calculation and structural/electronic analyses, Ge₂Bi₂Te₅, CdPb₃Se₄, MnBi₂Te₄, and TlBiTe₂ are found suitable for optical/electrical PCM applications, which further verifies the effectiveness of this strategy. The present study will accelerate the exploration and development of advanced PCM materials for current and future big-data applications.