Intermetallic compounds formed at the interface between liquid indium and copper substrates

The interfacial reactions between liquid In and Cu substrates at temperatures ranging from 175°C to 400°C are investigated for the applications in bonding recycled sputtering targets to their backing plates. Experimental results show that a scallop-shaped Cu₁₆In₉ intermetallic compound is found at the Cu/In interface after solder reactions at temperatures above 300°C. A double-layer structure of intermetallic compounds containing scallop-shaped Cu₁₁In₉ and continuous CuIn is observed after the Cu/In interfacial reaction at temperatures below 300°C. The growth of all these intermetallic compounds follows the parabolic law, which implies that the growth is diffusion-controlled. The activation energies for the growth of Cu₁₆In₉, Cu₁₁In₉, and CuIn intermetallic compounds calculated from the Arrhenius plot of growth reaction constants are 59.5, 16.9, and 23.5 kJ/mole, respectively.     

Preparation and Mechanical Properties of Fe3Al Nanostructured Intermetallics

Nanostructured Fe₃Al intermetallic compounds were produced by using hydrogen arc plasma method. The transmission electron microscopy experiments showed that the average particle size of the as-synthesized was about 40-nm. The change in hardness of Fe₃Al nanostructured intermetallic compounds with annealing temperatures was observed and evaluated.     

Microstructure and thermal behavior of Sn-Zn-Ag solders

The microstructure and thermal behavior of the Sn-Zn-Ag solder were investigated for 8.73–9% Zn and 0–3.0% Ag. The scanning electron microscopy (SEM) analysis shows the Ag-Zn compound when the solder contains 0.1% Ag. X-ray diffraction (XRD) analysis results indicate that Ag₅Zn₈ and AgZn₃ become prominent when the Ag content is 0.3% and above. Meanwhile, the Zn-rich phase is refined, and the Zn orientations gradually diminish upon increase in Ag content. The morphology of the Ag-Zn compound varies from nodular to dendrite structure when the Ag content increases. The growth of the Ag-Zn compounds is accompanied by the diminishing of the eutectic structure of the Sn-9Zn solder. Differential scanning calorimetry (DSC) investigation reveals that the solidus temperature of these solders exists at around 198°C. A single, sharp exothermic peak was found for the solders with Ag content less than 0.5%. Liquidus temperatures were identified with the DSC analysis to vary from 206°C to 215°C when the Ag content ranges from 1.0% to 3.0%     

Morphology of intermetallic compounds formed between lead-free Sn-Zn based solders and Cu substrates

The morphologies of intermetallic compounds formed between Sn-Zn based solders and Cu substrates were investigated in this study. The investigated solders were Sn-9Zn, Sn-8.55Zn-0.45Al, and Sn-8.55Zn-0.45Al-0.5Ag. The experimental results indicated that the Sn-9Zn solder formed Cu₅Zn₈ and CuZn₅ compounds on the Cu substrate, while the Al-containing solders formed the Al_4.2Cu_3.2Zn_0.7 compound. The addition of Ag to the Sn-8.55Zn-0.45Al solder resulted in the formation of the AgZn₃ compound at the interface between the Al_4.2Cu_3.2Zn_0.7 compound and the solder. Furthermore, it was found that the cooling rate of the specimen after soldering had an effect on the quantity of AgZn₃ compound formed at the interface. The AgZn₃ compound formed with an air-cooling condition exhibited a rougher surface and larger size than with a water-quenched condition. It was believed that the formation of the AgZn₃ compound at the interface occurs through heterogenous nucleation during solidification.     

Effect of Stress State on Growth of Interfacial Intermetallic Compounds Between Sn-Ag-Cu Solder and Cu Substrates Coated with Electroless Ni Immersion Au

Excessive intermetallic compound (IMC) growth in solder joints will significantly decrease the reliability of the joints. IMC growth is known to be influenced by numerous factors during the component fabrication process and in service. It is reported that, other than temperature and holding time, stress can also influence the IMC growth behavior. However, no existing method can be used to study the effect of stress state on IMC growth in a controlled manner. This paper presents a novel method to study the effect of stress on interfacial IMC growth between Sn-Ag-Cu solder and a Cu substrate coated with electroless Ni immersion Au (ENIG). A C-ring was used and in-plane bending induced tensile and compressive stresses were applied by tightening the C-ring. Results revealed that in-plane compressive stress led to faster IMC growth as compared with in-plane tensile stress.     

Electrocatalytic activity of ordered intermetallic PtSb for methanol electro-oxidation

Ordered intermetallic PtSb had been synthesized by arc-melted and then sintering treatment. The electro-oxidation of liquid methanol on PtSb was investigated at room temperature by cyclic voltammetry and chronoamperometry. The results are compared to those at a polycrystalline platinum electrode surface. It was found that PtSb intermetallic was catalytically more active than pure platinum according to the onset potential and current density. X-ray diffraction (XRD) and XPS technologies had been used to investigate the crystal structure and electron effect.     

Hydrogenation of fullerites in the presence of intermetallic compounds or metals

Fullerene hydrides containing 24–26 H atoms per fullerene molecule were obtained by hydrogenation of solid-phase mixtures of fullerenes with either intermetallic compounds LaNi₅, LaNi_4.65Mn_0.35, CeCo₃ or V and Pd metals with gaseous hydrogen at 1.0–2.5 MPa and 573–673 K. These fullerene hydrides decompose at 800 K with evolution of H₂. Upon subsequent heating to 1000 K, vanadium reacts with fullerene to yield a cubic phase of vanadium carbide. The intermetallic compounds react with fullerene with the formation of a metallic phase of the 3d-metal and destruction of fullerene. Palladium does not react with fullerene. Translated fromIzvestiya Akademii Nauk. Seriya Khimicheskaya, No. 4, pp. 679–683, April, 1997.     

Residence times in kink sites and Markov chain model of alloy and intermetallic compound deposition

The concept of the residence time τ_ksp of an atom in a kink site has recently been suggested to understand the processes in electrochemical deposition of alloys and intermetallic compounds. Different kink sites with different residence times must be defined for alloys and intermetallic compounds. Based on this model, the finite Markov chain theory is applied to describe the selectivity of the growth process. An analytical relationship between the alloy composition and the metal ion concentrations in the electrolyte is derived. General model parameters are ratios g _i = K _ii/K _ij of equilibrium constants of the reaction of electrolyte ions with different kink sites on the surface (i, j representing different alloy components). These ratios are called selectivity constants. For simple conditions, the equation g _i ≈ τ_ii/τ_ij connects the g _i values with the residence times. The theory is tested in the deposition of alloys Co-Ni (anomalous co-deposition) and Ni-Mo (induced co-deposition). Additionally, Bi₂Te₃, an example of stoichiometric semiconductor deposition, is treated. Published in Russian in Elektrokhimiya, 2006, Vol. 42, No. 10, pp. 1216–1223. The text was submitted by the authors in English.     

Condensed rare-earth metal-rich tellurides. Extension of layered Sc6PdTe2-type compounds to yttrium and lutetium analogues and to Y7Te2, the limiting binary member

Six isotypic R₆ZTe₂ phases have been synthesized in Ta at elevated temperatures and characterized by single crystal X-ray refinements for R=Y, Z=Rh, Pd, Ag, Y and for R=Lu, Z=Cu, Ag. All crystallize in the Sc₆PdTe₂-type structure, Pnma, Z=4, a∼21.5 Å, b∼4.1 Å, c∼11.4 Å. The results can be viewed as the replacement of Te3 atoms in the parent isotypic Sc₂Te (or in the hypothetical Y₂Te or Lu₂Te analogues) by the above the Z, the Y example giving the new binary phase Y₇Te₂. The shorter (and stronger) metal-metal bonds concentrate in the region of metal (Z, Y) substitution, as revealed by larger integrated crystal orbital Hamilton population (ICOHP) values derived from linear muffin-tin-orbital (LMTO) calculations. Partial densities-of-states data for Y₇Te₂ reflect a similar behavior. Individual R-R bond distances are seen to deviate appreciably from the more fundamental overlap population measures for each.     

Direct Growth of Uniform Bimetallic Core-Shell or Intermetallic Nanoparticles on Carbon via a Surface-Confinement Strategy for Electrochemical Hydrogen Evolution Reaction

Due to the surface inhomogeneity of the solid supports, direct growth of uniform bimetallic nanoparticles (NPs) with controllable structure and size thereon is particularly challenging. Herein, a surface-confinement strategy is reported to directly prepare ultrafine bimetallic Pt M NPs (MFe, Cu, and Co) with structure of core-shell or intermetallic compounds on an N functionalized carbon support (NC). It is found that the N species of NC support can atomically disperse metal cations of precursors, which largely renders uniform nucleation and growth of bimetallic NPs and fine structure modulation of them. In another regard, metal transfer is confined to a narrow region on NC via N-mediation, hence greatly favoring localized particle growth and formation of ultrafine bimetallic NPs. Remarkably, the ultrafine 3.1 ± 0.7 nm intermetallic Pt₃Fe NPs on NC displayed excellent catalytic activity and durability toward electrochemical hydrogen evolution reaction.