IRS辅助的SWIPT系统中基于能效优先的波束成形设计与优化

以智能反射面(intelligent reflecting surface,IRS)辅助的无线携能通信(simultaneous wireless information and power transfer,SWIPT)系统为背景,研究了该系统中基于能效优先的多天线发送端有源波束成形与IRS无源波束成形联合设计与优化方法。以最大化接收端的最小能效为优化目标,构造在发送端功率、接收端能量阈值、IRS相移等多约束下的非线性优化问题,用交替方向乘子法(alternating direction method of multipliers,ADMM)求解。采用Dinkelbach算法转化目标函数,通过奇异值分解(singular value decomposition,SVD)和半定松弛(semi-definite relaxation,SDR)得到发送端有源波束成形向量。采用SDR得到IRS相移矩阵与反射波束成形向量。结果表明,该系统显著降低了系统能量收集(energy harvesting,EH)接收端的能量阈值。当系统总电路功耗为?15 dBm时,所提方案的用户能效为300 KB/J。当IRS反射阵源数与发送天线数均为最大值时,系统可达最大能效。     

基于物联网的智慧林业可持续发展策略研究

随着我国科技的不断进步,在“互联网+”大数据的背景下,林业的智慧化发展是必经之路。虽然我国智慧林业的发展已经取得了一定的突破,但是仍然存在着许多问题。基于此,文章在物联网技术的基础上,对智慧林业的可持续发展策略进行探讨。     

浅析智能网联汽车感知系统电磁兼容性

本文将就智能网联汽车感知系统中的电子兼容技术进行深入的分析和探究。     

Intelligent Information‐Centric Networking routing scheme under imprecise information

Information‐Centric Networking (ICN) has been accepted to overcome some weaknesses of the current Internet architecture, showing that “what is being exchanged” is more important than “who are exchanging information.” Given the inadequate considerations on Quality of Service (QoS) and energy saving in ICN routing, we propose in this paper a routing algorithm to enhance the two aspects. At first, on one hand, Cauchy distribution is used as a fuzzy model to evaluate users' QoS requirements, such as bandwidth, delay, and error rate; on the other hand, we formulate energy saving problem to evaluate the green quality of routing algorithm. Then, we design a link selection approach by considering QoS and energy saving, which belongs to a multi‐objective decision problem resolved by intelligent drops algorithm. Finally, we implement the proposed algorithm and compare it with the famous adaptive forwarding mechanism in terms of some significant metrics, and the experimental results reveal that the proposed algorithm is more efficient.     

Recent breakthroughs of antibacterial and antiviral protective polymeric materials during COVID-19 pandemic and after pandemic: Coating,packaging, and textile applications

The global epidemic owing to COVID-19 has generated awareness to ensuring best practices for avoiding the microorganism spread. Indeed, because of the increase in infections caused by bacteria and viruses such as SARS-CoV-2, the global demand for antimicrobial materials is growing. New technologies by using polymeric systems are of great interest. Virus transmission by contaminated surfaces leads to the spread of infectious diseases, so antimicrobial coatings are significant in this regard. Moreover, antimicrobial food packaging is beneficial to prevent the spread of microorganisms during food processing and transportation. Furthermore, antimicrobial textiles show an effective role. We aim to provide a review of prepared antimicrobial polymeric materials for use in coating, food packaging, and textile during the COVID-19 pandemic and after pandemic.     

电信企业实施智能化小区建设可行性分析

随着智能住宅的普及，电信参与智能化小区建设日益显现出其重要性。本通过对智能化小区进行介绍，论述了电信实施智能化小区建设的优势和问题。     

嵌入式数字智能涡街流量计的设计开发

针对目前涡街流重计存在精度不高的问题，采用Toeplitz自相关矩阵近似的准牛顿算法，对涡街传感器输出信号进行数字信号处理。针对客户超低功耗的要求，开发设计以超低功耗的混合信号处理器(MSP430F149)为微处理器，以采用KS0713为控制器的LCD为液晶显示模块，符合HART总线协议的嵌入式智能涡街流量计。     

MEMS封装技术研究进展

介绍了MEMS封装技术的特点、材料以及新技术,包括单片全集成MEMS封装、多芯片组件(MCM)封装、倒装芯片封装、准密封封装和模块式MEMS封装等。文中还介绍了MEMS产品封装实例。     

智能光网络控制平面技术

光网络的智能化是下一代光网络发展的主要趋势,在对智能光网络发展背景进行分析的基础上,对光网络控制平面技术进行了讨论,重点分析了光网络控制平面的功能模型、主要功能、应用协议和控制平面的可靠性等问题。     

Low temperature delamination of plastic encapsulated microcircuits

Plastic encapsulated microcircuits (PEMs) are increasingly being used in applications requiring operation at temperatures lower than the manufacturer’s recommended minimum temperature, which is 0°C for commercial grade components and −40°C for industrial and automotive grade components. To characterize the susceptibility of PEMs to delamination at these extreme low temperatures, packages with different geometries, encapsulated in both biphenyl and novolac molding compounds, were subjected to up to 500 thermal cycles with minimum temperatures in the range −40 to −65°C in both the moisture saturated and baked conditions. Scanning acoustic microscopy revealed there was a negligible increase in delamination at the die-to-encapsulant interface after thermal cycling for the 84 lead PQFPs encapsulated in novolac and for both 84 lead PQFPs and 14 lead PDIPs encapsulated in biphenyl molding compound. Only the 14 lead novolac PDIPs exhibited increased delamination. Moisture exposure had a significant effect on the creation of additional delamination.