排序方式: 共有61条查询结果,搜索用时 15 毫秒
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射频芯片内DCXO的晶体振荡主电路设计 总被引:1,自引:0,他引:1
描述了一种射频芯片内数控晶体振荡器(DCXO)的振荡主电路设计,以Deep-N-Well CMOS工艺的PMOS为主工作管,采用Santos(改进Colpitts)结构、非对称差分式振幅控制环,避免了因Vt依赖工艺与温度等而产生的可靠启振问题.该10MHz DCXO振荡器主电路,采用TSMC Mixed/RF 0.18μm CMOS工艺,在2V电源电压下,仿真得到输出特性为:振幅峰峰值0.8V,平均电流2.9mA,相位噪声-140dBc/Hz@1kHz,-173dBc/Hz@1MHz,启动时间约2.8毫秒,可作为DCXO核心振荡模块. 相似文献
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提出了一种基于偏置模式的热电偶用V—PWM转换器的设计方法和应用电路。这种方式的转换器,可同时完成对微弱电压的积分方式放大及脉宽调制,且具有抗干扰性能优越、放大倍数高、转换精度高、线路简单等特点。特别适用于输出电压很微弱的热电偶温度传感器;结合AT89C2051单片机,可设计出性能稳定、电路简单、成本低且可检测0~1000℃的宽范围温度控制器。 相似文献
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Design and Evaluation of Adiabatic Arithmetic Units 总被引:1,自引:0,他引:1
Micah C. Knapp Peter J. Kindlmann Marios C. Papaefthymiou 《Analog Integrated Circuits and Signal Processing》1997,14(1-2):71-79
Adiabatic design is an attractive approach to reducingenergy consumption in VLSI circuits after exhausting the potentialof conventional energy-saving techniques. Despite the plethoraof adiabatic logic architectures that have been proposed in recentyears, several practical considerations in the design of nontrivialadiabatic circuits remain largely unexplored. Moreover, it isstill unclear whether adiabatic circuits of significant sizeand complexity can achieve substantial savings in energy dissipationover corresponding conventional designs. We recently designedseveral low-power arithmetic units using a dual-rail adiabaticlogic design style. We also designed static CMOS versions ofthese units and compared their energy dissipation with theircorresponding adiabatic designs. In this paper we describe ourimplementations, discuss architecture and logic-level issuesrelated to our adiabatic designs, and present the findings ofour empirical comparison. Our results suggest that adiabaticlogic can be used for the implementation of relatively complexVLSI circuits that dissipate significantly less energy than theircorresponding CMOS designs. 相似文献
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介绍了一种带USB接口的光的155Mb/s码型发生器。伪随机码和其他格式的码型由PC产生通过USB接口进入双口RAM,再经串并变换后由光发射模块发射。该系统可方便地设定各种格式的码型,并同时具备光接口和电接口,可广泛应用于光通信各种实验中,具有重要的实用价值。 相似文献
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Direct additive fabrication of thin‐film electronics using a high‐mobility, wide‐bandgap amorphous oxide semiconductor (AOS) can pave the way for integration of efficient power circuits with digital electronics. For power rectifiers, vertical thin‐film diodes (V‐TFDs) offer superior efficiency and higher frequency operation compared to lateral thin‐film transistors (TFTs). However, the AOS V‐TFDs reported so far require additional fabrication steps and generally suffer from low voltage handling capability. Here, these challenges are overcome by exploiting in situ reactions of molybdenum (Mo) during the solution‐process deposition of amorphous zinc tin oxide film. The oxidation of Mo forms the rectifying contact of the V‐TFD, while the simultaneous diffusion of Mo increases the diode's voltage range of operation. The resulting V‐TFDs are demonstrated in a full‐wave rectifier for wireless energy harvesting from a commercial radio‐frequency identification reader. Finally, by using the same Mo film for V‐TFD rectifying contacts and TFT gate electrodes, this process allows simultaneous fabrication of both devices without any additional steps. The integration of TFTs alongside V‐TFDs opens a new fabrication route for future low‐cost and large‐area thin‐film circuitry with embedded power management. 相似文献
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