Influence of growth conditions on the V-defects in InGaN/GaN MQWs

The influence of the growth temperature,TMIn/TEGa andⅤ/Ⅲratio on the V-defects of InGaN/GaN multi-quantum wells（MQWs） has been investigated and discussed.When the TMIn flow increases from 180 to 200 sccm,the density of V-defects increases from 2.72×10¹⁸ to 5.24×10¹⁸ cm^-2,and the V-defect width and depth increase too.The density also increases with the growth temperature.The densities are 2.05×10⁸,2.72×10¹⁸ and 4.23×10⁸ cm^-2,corresponding to a growth temperature of 748,753 and 758℃respectively.When the NH₃ flows are 5000,6600 and 8000 sccm,the densities of the V-defects of these samples are 6.34×10¹⁸,2.72×10¹⁸ and 4.13×10¹⁸ cm^-2,respectively.A properⅤ/Ⅲratio is needed to achieve step flow growth mode.We get the best quality of InGaN/GaN MQWs at a growth temperature of 753℃TMIn flow at 180 sccm,NH₃ flow at 6600 sccm,a flatter surface and less V-defects density.The depths of these V-defects are from 10 to 30 nm,and the widths are from 100 to 200 nm.In order to suppress the influence of V-defects on reverse current and electro-static discharge of LEDs,it is essential to grow thicker p-GaN to fill the V-defects.     

生长条件对InGaN/GaN多量子阱表面v型缺陷的影响

我们研究了生长温度、TMIn/TEGa和Ⅴ/Ⅲ比对 InGaN/GaN多量子阱表面v型缺陷的影响。当TMIn的流量从180sccm增加到200sccm,v型缺陷的密度也从2.7210¹⁸/cm² 增加到了5.2410¹⁸ /cm², v型缺陷的深度和宽度也随着TMIn流量的增加而增加。当生长温度从748℃增加到758℃, v型缺陷的密度分别是2.0510⁸/cm², 2.7210⁸/cm² 和 4.2310⁸/cm²,V型缺陷的密度随着生长温度的增加而增加。当NH3的流量从5000sccm增加到8000sccm, v型缺陷的密度分别为 6.3410¹⁸/cm², 2.7210¹⁸/cm², 4.1310¹⁸/cm²。我们在753℃, TMIn 流量为180sccm, NH3 流量为6600sccm时,得到了晶体质量最好的InGaN/GaN 多量子阱,表面平整,v型缺陷的密度也比较少。V型缺陷的深度从10nm到30nm,宽度从100nm到200nm,为了抑制v型缺陷对GaN基LEDs反向电流(IR)和静电放电 (ESD) 的影响,我们需要生长更厚的p-GaN来填充这些v型缺陷。     

Residual impurities in GaN/Al2O3 grown by metalorganic vapor phase epitaxy

Residual impurities in GaN films on sapphire (A1₂O₃) substrates grown by two-step metalorganic vapor phase epitaxy (MOVPE) have been investigated. We have mainly investigated the incorporation of carbon into the GaN films with GaN buffer layers on A1₂O₃ during MOVPE growth, comparing trimethygallium (TMGa) and triethygallium (TEGa) as the typical gallium precursors. The films were characterized by secondary ion mass spectroscopy analysis, photolu-minescence, and Hall measurements. The carbon, hydrogen, and oxygen concentrations increase with decreasing growth temperature in using TMGa. Especially the carbon concentration increases with decreasing a V/III ratio, for both TMGa and TEGa. There is about two times more carbon in the GaN films grown using TEGa than those using TMGa. The carbon from TMGa mainly enhances the D-A pair emission (∼378 nm), which shows the carbon makes an acceptor level at nitrogen sites in GaN. On the other hand, the carbon from TEGa enhances a deep emission (∼550 nm), which shows the carbon makes not only an acceptor level but deep levels at interstitial sites in GaN. The carbon impurities originate from methyl radicals for TMGa, or ethyl radicals for TEGa. It is supposed that, in the case of TEGa, the carbon impurities are not always located at nitrogen sites, but are also located at interstitial sites because of the C-C bonding in ethyl radicals.     

使用TEGa和TMGa为镓源MOCVD生长GaN的研究

采用自行研制的立式MOCVD生长系统 ,以TMGa、TEGa为Ga源 ,在不同的生长条件下生长GaN单晶膜。然后对样品进行室温光致发光光谱测试、范德堡霍尔测量和X射线双晶衍射测试。实验结果表明 ,缓冲层的Ga源不同对GaN单晶膜质量影响很大 ;以TEGa为Ga源生长缓冲层及外延层 ,外延层不连续 ;以TMGa为缓冲层Ga源、TEGa为外延层Ga源 ,在此得到室温载流子浓度为 4 5× 1 0 17cm-3 ,迁移率为 1 98cm2 /V·s的电学性能较好的GaN单晶膜。研究结果表明 :使用TEGa为外延层Ga源生长GaN ,能有效地抑制不期望的蓝带的出现。