Molecular structure of carbonyl bromide as studied by gas electron diffraction

The molecular structure of COBr₂ has been determined as follows by an analysis of electron diffraction intensity: r_g(CO) = 1.178 ± 0.009 Å, r_g(C-Br) = 1.923 ± 0.005 Å and θ°_α(Br-C-Br) = 112.3 ± 0.4°. The uncertainties represent estimated limits of error. The observed systematic trends in the bond lengths and bond angles in carbonyl and thiocarbonyl halides are discussed.     

LD端面泵浦的1.57μm内腔式OPO

1.57 μm波长激光为人眼安全波长激光。将KTP晶体置于一个由LD端面泵浦、声光调Q的Nd:YVO4晶体双凹谐振腔内,利用KTP表面镀膜建立了内腔式OPO,实现了重复率在5～40 kHz范围内1.57 μm脉冲激光的稳定输出。实验结果表明,激光的阈值将随声光调Q器重复率的增加而升高,重复率为5 kHz时得到最低阈值1.52 W。重复率为15 kHz、泵浦功率为3.7 W时,输出光平均功率为305 mW,脉冲宽度50 ns,峰值功率400 W。     

软交换割接后掉话率升高的解决方案

在GSM网络运行中，掉话现象是用户投诉热点，好的网络一般要求掉话率低于2％。随着GSM网络的日益成熟，如何降低掉话率是各运营商、设备商所关注的热点问题。主要讨论了掉话率以及如何设置交换与无线设备影响掉话的定时器，针对软交换工程割接后掉话率升高的问题提出了解决方案并进行实施，取得了良好的效果。     

Nanostructural aspects, free volume and phase constitution of rapidly solidified Nd-Fe-B

A complement of experimental characterization techniques - positron annihilation spectroscopy (PAS), transmission electron microscopy, synchrotron X-ray diffraction and elevated temperature ac and dc magnetic measurements - were applied to the study of melt-quenched stoichiometric Nd₂Fe₁₄B ribbons modified by various amounts of the alloying additions Ti and C. These alloying additions are known to enhance the glass-forming ability in Nd₂Fe₁₄B melts, allowing for a wider processing window to produce homogeneous nanoscale materials with tailored magnetic properties. The experimental techniques used in this study reveal the complex multi-phase and multi-scale nature of the ribbons, a result that had escaped detection by lower-resolution techniques. The as-quenched ribbons were found to consist of at least three phases: α-Fe nanocrystals, poorly crystalline Nd₂Fe₁₄B and glass. The measured weight fraction of glass does not show a direct correspondence with quenching wheel speed, a result attributed to the complexity of the melt-spinning heat-transfer process. The Curie temperature of the glassy component of the ribbons varies in a non-systematic way with both Ti and C alloying addition content and wheel speed. PAS provides quantitative measurements of the S (or ‘shape’)-parameter which represents the size of a void or open volume in the material volume probed. The experimental results indicate that an excess of free volume in the glass is associated with increased glass stability, a counterintuitive conclusion. However, the results are consistent with the model of Sietsma and Thijsse [Phys. Rev. B 52 (5) (1995) 3248] who propose that thermal relaxation in glass causes the larger free volume regions in the amorphous structure to break up into smaller voids, which necessarily increases the total number of voids, but decreases the volume per void. This void breakup fosters the processes of cooperative diffusion and subsequent devitrification. It is concluded that the free volume concentration in the amorphous component of melt-spun Nd₂Fe₁₄B alloys produced by the highest quenching wheel speeds and Ti/C alloying addition content is thus not sufficient to allow cooperative diffusion to take place, resulting in an increased stability against devitrification.     

Positron annihilation lifetime study of organic-inorganic hybrid materials prepared by irradiation

Silica based hybrid materials, some containing zirconia, prepared by gamma-irradiation, were studied by positron annihilation lifetime (PAL) spectroscopy, in the temperature range of 30-370 K. One long-lived component was observed in group of samples without zirconia. The behavior of this component as a function of temperature resembles that for polymers. This is explained by the elastomer like structure of the samples and the excellent linking between the inorganic and organic networks. The average radius, R, of the free-volume holes was in the range 0.26-0.42 nm depending on the temperature. In the group of samples containing zirconia two long-lived components were observed. A model with three different free-volume holes was suggested to explain the PAL results. Small closed holes (R ∼ 0.26 nm) and large closed holes introduced by Zr (R ∼ 0.5 nm), the sizes of both holes not changing with the temperature, together with intermediate polymer-like free-volume holes - the same behavior as those present in samples not containing zirconia.     

A study on interfacial reactions between electroless Ni-P under bump metallization and 95.5Sn-4.0Ag-0.5Cu alloy

Even though electroless Ni-P and Sn-Ag-Cu solders are widely used materials in flip-chip bumping technologies, interfacial reactions of the ternary Cu-Ni-Sn system are not well understood. The growth of intermetallic compounds (IMCs) at the under bump metallization (UBM)/solder interface can affect solder-joint reliability, so analysis of IMC phases and understanding their growth kinetics are important. In this study, interfacial reactions between electroless Ni-P UBM and the 95.5Sn-4.0Ag-0.5Cu alloy were investigated, focusing on identification of IMC phases and IMC growth kinetics at various reflowing and aging temperatures and times. The stable ternary IMC initially formed at the interface after reflowing was the (Cu,Ni)₆Sn₅ phase. However, during aging, the (Cu,Ni)₆Sn₅ phase slowly changed into the quaternary IMC composed of Cu, Ni, Sn, and a small amount of Au. The Au atoms in the quaternary IMC originated from immersion Au plated on electroless Ni-P UBM. During further reflowing or aging, the (Ni,Cu)₃Sn₄ IMC started forming because of the limited Cu content in the solder. Morphology, composition, and crystal structure of each IMC were identified using transmission electron microscopy (TEM) and scanning electron microscopy (SEM). Small amounts of Cu in the solder affect the types of IMC phases and the amount of the IMC. The activation energies of (Cu,Ni)₆Sn₅ and (Ni,Cu)₃Sn₄ IMCs were used to estimate the growth kinetics of IMCs. The growth of IMCs formed in aging was very slow and temperature-dependent compared to IMCs formed in reflow because of the higher activation energies of IMCs in aging. Comparing activation energies of each IMC, growth mechanism of IMCs at electroless Ni-P/SnAgCu solder interface will be discussed.     

SnAgCuY钎料高温时效过程的显微组织演化

研究了无铅钎料合金Sn3.8Ag0.7Cu高温时效过程中显微组织,特别是金属间化合物(IMC)的演化规律,以及稀土Y的添加对其产生的影响。结果表明:在高温时效过程中合金内部组元发生扩散与重组,伴随着共晶组织的逐渐溶解,新的IMC在组织内部呈球形弥散析出。结晶初期形成的具有规则形状的较粗大的IMC逐渐发生解体,树枝状富Sn相逐渐取代共晶组织成为受腐蚀的对象。随着时效时间的延长,合金内部各组元的成分也在不断发生变化。     

Singular Perturbations of Self-Adjoint Operators

Singular finite rank perturbations of an unbounded self-adjoint operator A ₀ in a Hilbert space ₀ are defined formally as A ₍₎=A ₀+GG ^*, where G is an injective linear mapping from = ^d to the scale space _-k(A₀)k , kN, of generalized elements associated with the self-adjoint operator A ₀, and where is a self-adjoint operator in . The cases k=1 and k=2 have been studied extensively in the literature with applications to problems involving point interactions or zero range potentials. The scalar case with k=2n>1 has been considered recently by various authors from a mathematical point of view. In this paper, singular finite rank perturbations A ₍₎ in the general setting ran G – _k (A ₀), kN, are studied by means of a recent operator model induced by a class of matrix polynomials. As an application, singular perturbations of the Dirac operator are considered.     

Evaluation of Automated ECG Monitoring: Theoretical Model Based upon Point Process Techniques

The development of practical methods of ECG monitoring using dedicated computers has presented problems in the evaluation and comparison of the relative effectiveness of various ECG monitoring systems. A theoretical model based on the application of point process techniques is discussed in this paper.     

SAC305无铅钎料在Au／Ni镀层上的铺展性能研究

文章阐述了钎料润湿的基本原理,分析了关键工艺参数对钎料铺展性能的影响规律。针对温度、时间和表面状态等关键参数／状态,对无铅钎料SAC305在Au／Ni镀层上的铺展性能开展试验研究。结果表明,随着焊接温度和保温时间的增加,无铅钎料SAC305的铺展性能明显改善,铺展系数逐渐趋于100％。同时,通过RF的Ar等离子对钎料进行表面预处理也能够使其铺展性能有所改善。试验结果与理论分析具有较好的一致性。