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1.
In the past, thinking of carrying electronic devices inside our bodies was only posed by non-real scenarios. The emergence of insertable devices has changed this. Since this technology is still in its initial development stages, few studies have investigated factors that influence its acceptance. This paper analyzes the predictors of the intention to use non-medical insertable devices in two Latin American contexts. We used partial least squares structural equation modeling to examine whether six constructs predicted intention to use insertable devices. A questionnaire was administered to undergraduate students located in Colombia and Chile (n = 672). We also examined whether these predictors influenced intention differently for both of them. Four common constructs significantly and positively influenced both Chilean and Colombian respondents to use insertable devices (hedonic motivation, habit, performance expectancy, and social influence). Also, the habit has a complementary mediating effect on the relationship between social influence and behavioral intention. By contrast, effort expectations were a positive and significant predictor, but only among Chilean respondents. Findings suggest that when technologies are emerging, well-known predictors of intention (e.g., performance and effort expectations) are less influential than predictors related to self-efficacy (e.g., habit and hedonic motivation). The use of insertable devices has a significant impact on society. Thus, a better understanding of what motivates their use has implications for both academia and industry. 相似文献
2.
文章归纳了2020年电子电路产业一些技术热点,主要有5G电路板设计和基材,制造方面半加成法、3D打印、直接金属化孔电镀和垂直互连结构等技术,以及集成电路封装载板技术。 相似文献
3.
在分析了双极型晶体管和场效应晶体管各自的特点和不足后,介绍了一种既具有双极型晶体管较大电流容量和功率输出,又具有场效应晶体管高输入阻抗的电子器件——双极MOS场效应晶体管(BJMOSFET),同时指出体硅BJMOSFET的阳极扩散区与衬底之间存在较大的漏电流,可产生较大的寄生效应。提出了一种新型固体电子器件——基于SOI的BJMOSFET,分析了其工作原理j与体硅BJMOSFET比较,由于SOI技术完整的介质隔离避免了体硅器件中存在的大部分寄生效应,使基于SOI的BJMOSFET在体效应、热载流子效应、寄生电容、短沟道效应和闩锁效应等方面具有更优良的特性。 相似文献
4.
CMP系统技术与市场 总被引:3,自引:1,他引:2
葛劢冲 《电子工业专用设备》2003,32(1):17-24
概述了CMP系统技术的发展历史、发展趋势以及在IC生产中的重要性,介绍了国外CMP设备主要制造厂家的设备型号和性能及CMP设备市场分布和需求,阐述了CMP系统技术的基础研究、关键技术和国内研究概况。 相似文献
5.
研究了深亚微米PD和FD SOI MOS器件遭受热截流子效应(HCE)后引起的器件参数退化的主要差异及其特点,提出了相应的物理机制,以解释这种特性。测量了在不同应力条件下最大线性区跨导退化和闽值电压漂移,研究了应力Vg对HCE退化的影响,并分别预测了这两种器件的寿命,提出了10年寿命的0.3μm沟长的PD和FD SOI MOS器件所能承受的最大漏偏压。 相似文献
6.
胡志勇 《电子工业专用设备》2002,31(3):148-150
当今的回转头式贴装设备能够以相对低廉的价格 ,提供高速度和准确的贴装 ,以及先进的识别操作。 相似文献
7.
Bo Jin Xi Wang Jing Chen Feng Zhang Xinli Cheng Zhijun Chen 《Applied Surface Science》2006,252(16):5627-5631
The oxidation of SiGe film epitaxial grown on top of SOI wafers has been studied. These SiGe/SOI samples were oxidized at 700, 900, 1100 °C. Germanium atoms were rejected from SiGe film to SOI layer. A new Si1−xGex (x is minimal) layer formed at SiGe/Si interface. As the germanium atoms diffused, the new Si1−xGex (x is minimal) layer moved to Si/SiO2 interface. Propagation of threading dislocation in SiGe film to SOI substrate was hindered by the new SiGe/Si interface. Strain in SOI substrate transferred from SiGe film was released through dislocation nucleation and propagation inner. The relaxation of SiGe film could be described as: strain relaxed through strain equalization and transfer process between SiGe film and SOI substrates. Raman spectroscopy was used to characterize the strain of SiGe film. Microstructure of SiGe/SOI was observed by transmission electron microscope (TEM). 相似文献
8.
Transmission of signals, whether on-chip or off-chip, places severe constraints on timing and extracts a large price in energy. New silicon device technologies, such as back-plane CMOS, provide a programmable and adaptable threshold voltage as an additional tool that can be used for low power design. We show that one particularly desirable use of this freedom is energy-efficient high-speed transmission across long interconnects using multi-valued encoding. Our multi-valued CMOS circuits take advantage of the threshold voltage control of the transistors, by using the signal-voltage-to-threshold-voltage span, in order to make area-efficient implementations of 4-PAM (pulse amplitude modulation) transceivers operating at high speed. In a comparison of a variety of published technologies, for signal transmission with interconnects of 10-15 mm length, we show up to 50% improvement in energy for on-chip signal transmission over binary encoding together with higher limits for operating speeds without a penalty in circuit noise margin. 相似文献
9.
2005年11月份邯郸钢铁厂8万煤气柜外送煤气加压机采用高压变频技术改造。其原因是该加压机外送量波动较大,采用普通阀门调节打回流,将会浪费大量电能,采用变频技术改造后,节能效果非常明显。 相似文献
10.
Application-level performance is a key to the adoption and success of the CDMA 2000. To predict this performance in advance,
a detailed end-to-end simulation model of a CDMA network is built to include application traffic characteristics, network
architecture, network element details using the proposed simulation methodology. We assess the user-perceived application
performance when a RAN and a CN adopt different transport architectures such as ATM and IP. To evaluate the user-perceived
quality of voice service, we compare the end-to-end packet delay for different vocoder schemes such as G.711, G.726 (PCM),
G.726 (ADPCM), and vocoder bypass scheme. By the simulation results, the vocoder bypass scenario shows 30% performance improvement
over the others. We also compare the quality of voice service with and without DPS scheduling scheme. We know that DPS scheme
keep the voice delay bound even if the service traffic is high. For data packet performance, HTTP v.1.1 shows better performance
than that of HTTP v.1.0 due to the pipelining and TCP persistent connection. We may conclude that IP transport technology
is better solution for higher FER environment since the packet overhead of IP is smaller than that of ATM for web browsing
data traffic, while it shows opposite effect to the small size voice packet in RAN architecture. We show that the 3G-1X EV-DO
system gives much better packet delay performance than 3G-1X RTT. The main conclusion is that end-to-end application-level
performance is affected by various elements and layers of the network and thus it must be considered in all phases of the
development process.
Jae-Hyun Kim He received the B.S., M.S., and Ph.D. degrees, all in computer science and engineering, from Hanyang University, Ansan, Korea,
in 1991, 1993, and 1996 respectively. In 1996, he was with the Communication Research Laboratory, Tokyo, Japan, as a Visiting
Scholar. From April 1997 to October 1998, he was a post-doctoral fellow at the department of electrical engineering, University
of California, Los Angeles. From November 1998 to February 2003, he worked as a member of technical staff in Performance Modeling
and QoS management department, Bell laboratories, Lucent Technologies, Holmdel, NJ. He has been with the department of electrical
engineering, Ajou University, Suwon, Korea, as an assistant professor since 2003. His research interests include QoS issues
and cross layer optimization for high-speed wireless communication. Dr. Kim was the recipient of the LGIC Thesis Prize and
Samsung Human-Tech Thesis Prize in 1993 and 1997, respectively. He is a member of the Korean Institute of Communication Sciences
(KICS), Korea Institute of Telematics and Electronis (KITE), Korea Information Science Society (KISS), and IEEE.
Hyun-Jin Lee received the B.S. degree in electrical engineering from Ajou University, Suwon, Korea, in 2004, and is working toward the
M.S. degree and Ph. D. degree in electrical engineering at Ajou University. He has been awarded Samsung Human-Tech Thesis
Prize in 2004. His research interests QoS, especially network optimization and wireless packet scheduling. He is a member
of the KICS.
Sung-Min Oh received the B.S. and M. S. degrees in electrical engineering form Ajou University, Suwon, Korea, in 2004, and is working
toward the Ph. D. degree in electrical engineering at Ajou University. His research interests QoS performance analysis and
4G network. He is a member of the KICS.
Sung-Hyun Cho received his B.S., M.S., and Ph.D. in computer science and engineering from Hanyang University, Korea, in 1995, 1997, and
2001, respectively. From 2001 to 2005, he has been with Samsung Advanced Institute of Technology, where he has been engaged
in the design and standardization of MAC and upper layers of B3G, IEEE 802.16e, and WiBro systems. He is currently a MAC part
leader in the telecommunication R&D center of Samsung Electronics. His research interests include 4G air interface design,
radio resource management, cross layer design, and handoff in wireless systems. 相似文献