Resistance reduction effect of potassium bismuth titanate doping in yttrium–manganese co-doped medium Curie temperature barium titanate lead free ceramics through improved synthesis process

Through improved synthesis process, resistance reduction effect of (K_0.5Bi_0.5)TiO₃ (KBT) doping in Y–Mn co-doped BaTiO₃ (BT) lead free ceramics was investigated. By different doping methods (doping K₂O, Bi₂O₃ and TiO₂ or synthesized KBT), medium Curie temperature (around 130 °C) lead free BT ceramics were obtained with ultra-low resistivity (13.84 Ωcm) with a temperature maintaining process at 700 °C. In this contribution, effect of sintering process and doping methods is discussed in detail.     

在无铅环境中的热风整平

当电子工业走向无铅焊接的时候,热风焊料整平仍然是继续可焊性保护的优选方法。     

提高焊膏印刷质量的工艺改进

焊膏印刷作为SMT工艺的第一步，其质量好坏对SMT工艺有着重要影响。文章通过对焊膏成分、特性的分析，讨论了印刷中各种工艺参数的正确选择；对焊膏印刷中容易出现的质量问题进行了详细分析，指出了产生问题的原因，提出了改进措施。     

Intermetallic compounds formed at the interface between liquid indium and copper substrates

The interfacial reactions between liquid In and Cu substrates at temperatures ranging from 175°C to 400°C are investigated for the applications in bonding recycled sputtering targets to their backing plates. Experimental results show that a scallop-shaped Cu₁₆In₉ intermetallic compound is found at the Cu/In interface after solder reactions at temperatures above 300°C. A double-layer structure of intermetallic compounds containing scallop-shaped Cu₁₁In₉ and continuous CuIn is observed after the Cu/In interfacial reaction at temperatures below 300°C. The growth of all these intermetallic compounds follows the parabolic law, which implies that the growth is diffusion-controlled. The activation energies for the growth of Cu₁₆In₉, Cu₁₁In₉, and CuIn intermetallic compounds calculated from the Arrhenius plot of growth reaction constants are 59.5, 16.9, and 23.5 kJ/mole, respectively.     

水溶性涂料使用性能研究

本文通过试验对水溶性涂料的耐盐雾腐蚀性能，耐热性能，高低温冲击性能，耐油性能，涂膜与铁基体，面漆的给合力及涂膜表面电阻进行研究，同时指出了该涂料在军用电子产品上的应用前景。     

A surface-mounted device assembly technique for small optics based on laser reflow soldering

The three-dimensional miniaturized optical surface-mounted device (TRIMO-SMD) is a new flexible and automated assembly technique for small optical components (maximum diameter for a lens is 2 mm) based on laser reflow soldering technique. This technology can be compared to the electronic SMD technique but applied to micro-optical devices. We present some recent developments of TRIMO-SMD in its application to industrial products.     

用边界元法提取VLSI版图电阻

介绍了ＶＬＳＩ版图验证中电阻提取的基本原理和主要方法，给出了一种新颖的基于边界元法的电阻提取算法。该算法采用变节点单元，较好地解决了实际问题中经常出现的角点问题。通过应用该算法对几个实例进行提取，证明使用本文的算法不仅在精度上而且在占用ＣＰＵ时间上都取得了令人满意的效果     

开关磁阻电机传动技术及其应用

本文主要论述了开关磁阻电机传动技术的工作原理，系统结构和技术性能。介绍了该技术的发展背景、目前的应用情况和国内外发展水平。并对其前景表明了一些看法。     

厚膜混合集成电路常见工艺缺陷及其消除方法

除设计和材料外，工艺和操作对厚膜混合集成电路的质量和性能也有较大的影响。分析了厚膜混合集成电路生产过程中一些常见的工艺缺陷，如线条变形、起泡、阻值不稳、元件受损、锡珠等的产生原因，并提出了相应的消除方法。     

功率GaAs MESFET的热阻测试

阐述了功率ＧａＡｓＭＥＳＦＥＴ器件热阻测试中温敏参数ＶＧＳＦ和测试电流Ｉｍ的选取，给出了１～５Ｗ器件典型温敏参数的温度测试系数Ｍ与测试电流Ｉｍ的关系。讨论了测试延迟时间ｔｍｄ对△ＶＧＳＦ测量值的影响和三种校正方法。