焊膏工艺性要求及性能检测方法

焊膏是SMT工艺中不可缺少的钎焊材料,广泛应用于再流焊中;它是由一定的合金粉末和助焊剂均匀混合而成的膏状体。主要对SMT中焊膏的组成及焊膏性能检测方法进行了简要分析。     

提高焊膏印刷质量的工艺改进

焊膏印刷作为SMT工艺的第一步，其质量好坏对SMT工艺有着重要影响。文章通过对焊膏成分、特性的分析，讨论了印刷中各种工艺参数的正确选择；对焊膏印刷中容易出现的质量问题进行了详细分析，指出了产生问题的原因，提出了改进措施。     

电镀污水净化新工艺--电浮选方法简介

综述了电浮选方法处理电镀污水的基本原理和提高电浮选净水技术的途径。重点介绍了俄罗斯门捷列夫化工大学的电浮选两种新工艺方法。     

Roughness reduction in submicron waveguides by low-molecular weight development

Roughness reduction of a submicron waveguide profile in chemically amplified negative resist is here performed by proper selection of an alkali-based developer, taking into account that its smaller molecules lead to smoother resist surface by altering the developing mechanism of aggregate extraction performed with standard quaternary ammonium hydroxide. Roughness is then analyzed by means of classical Atomic Force Microscope inspection; furthermore, a non-invasive line edge roughness analysis approach based on top-down scanning electron microscope acquisition gives comparable results, in terms of standard deviation and molecular aggregate periodicity.     

用时间-边界跟踪模型确定抗蚀剂显影后的轮廓分布

文章提出了时间一边界跟踪模型的定义,阐述了用该模型确定抗蚀剂显影后的轮廓分布的方法,并给出了模拟计算结果.     

Enhanced electrodeposition of indium hexacyanoferrate thin films through improved plating solution stability

An ordinary plating solution for indium hexacyanoferrate (InHCF) thin film deposition, mainly composed of equal concentrations of In³⁺ and [Fe(CN)₆]^3–, usually forms precipitates rapidly when either concentration is higher than few millimolar. This contributes to the plating solution's instability. Moreover, electrodeposited capacities are limited accordingly. In this work, the plating solution's stability and the electrodeposition of InHCF were greatly enhanced by adding a large amount of K⁺ and/or H⁺. It was found that a 10-mM plating solution added with 1 M HCl and 1 M KCl could be stored as fresh over a one-week period, whereas an unmodified plating solution became useless within a couple of minutes. Also, such cationic additions, especially adding H⁺, increased the electrodeposited capacity ca. 18 times at least, as compared with that obtained from the unmodified plating solution. Furthermore, related enhancing mechanisms were proposed and verified. To sum up, this study offers a means for better InHCF electrodeposition and should promote the applications of InHCF films. Electronic Publication     

JEE—4x型真空镀膜仪功能扩展

报道了对ＪＥＥ－４ｘ型真空镀膜仪蒸发装置的改进以及建立蒸发材料回收装置的具体方法，并介绍了改进后该仪器在高分辨扫描电镜样品制备上的应用实例．实验证明，上述改进不但扩展了ＪＥＥ—４ｘ型真空镀膜仪的制样功能又节省了蒸发材料，集中了离子溅射法及常规高真空镀膜法的优点，完全满足ＳＥＭ样品的分析要求，该方法简单易操作．     

化学镀钴基合金镀液中钴的快速测定

研究了采用显色剂 苦胺酸偶氮变色酸对化学镀钴基合金镀液中钴含量进行测定的试验条件,在pH11的氨 氯化铵缓冲溶液中,钴与显色剂配合物的最大吸收峰在650nm波长处,钴(Ⅱ)在0～60μg/25ml范围内服从比耳定律,表观摩尔吸光系数为3.1×104L·mol-1·cm-1。该法测定钴的选择性好,在大量镍存在下,也能准确测定,对镀液样品进行了测定,相对标准偏差小于1%,结果满意。     

分级分段印制插头工艺的研发与应用

介绍了一种采用特殊的设计方法制作分级分段印制插头的工艺生产的印制插头完全没有引线残留的踪迹,对分级分段印制插头的品质做到了有效的控制,可靠性实达到品质要求,通过了实际生产应用的验证,建立了工艺规范和品质管制计划,为批量生产奠定了坚实基础。     

圆片级封装的凸点制作技术

圆片级封装是一种先进的电子封装技术,近年来,圆片级封装技术的发展速度很快,主要应用于系统级芯片、光电器件和MEMS等.凸点制作是圆片级封装工艺的关键工序,目前凸点制作工艺方法有多种,重点介绍常用的电镀法、植球法和蒸发沉积法凸点工艺,分别介绍这三种凸点制作技术的工艺流程、关键技术.