Microstructures of InN film on 4H-SiC (0001) substrate grown by RF-MBE

InN film was grown on 4H-SiC (0001) substrate by RF plasma-assisted molecular beam epitaxy (RF-MBE). Prior to the growth of InN film, an InN buffer layer with a thickness of ~ 5.5 nm was grown on the substrate. Surface morphology, microstructure and structural quality of InN film were investigated. Micro-structural defects, such as stacking faults and anti-phase domain in InN film were carefully investigated using transmission electron microscopy (TEM). The results show that a high density of line contrasts, parallel to the growth direction (c-axis), was clearly observed in the grown InN film. Dark field TEM images recorded with diffraction vectors g = 1120 and g = 0002 revealed that such line contrasts evolved from a coalescence of the adjacent misoriented islands during the initial stage of the InN nucleation on the substrate surface. This InN nucleation also led to a generation of anti-phase domains.     

RF-MBE生长的AlGaN/GaN高电子迁移率晶体管特性

用射频分子束外延技术研制出了室温迁移率为10 35 cm2 /(V·s) ,二维电子气浓度为1.0×10 1 3cm- 2 ,77K迁移率为2 6 5 3cm2 /(V·s) ,二维电子气浓度为9.6×10 1 2 cm- 2 的Al Ga N/Ga N高电子迁移率晶体管材料.用此材料研制的器件(栅长为1μm,栅宽为80μm,源-漏间距为4μm )的室温非本征跨导为186 m S/m m,最大漏极饱和电流密度为92 5 m A/m m,特征频率为18.8GHz.     

RF-MBE生长的AlGaN/GaN高电子迁移率晶体管特性

用射频分子束外延技术研制出了室温迁移率为1035cm2/(V·s),二维电子气浓度为1.0×1013cm-2,77K迁移率为2653cm2/(V·s),二维电子气浓度为9.6×1012cm-2的AlGaN/GaN高电子迁移率晶体管材料.用此材料研制的器件(栅长为1μm,栅宽为80μm,源-漏间距为4μm)的室温非本征跨导为186mS/mm,最大漏极饱和电流密度为925mA/mm,特征频率为18.8GHz.     

Ⅴ/Ⅲ比和生长温度对RF-MBE InN表面形貌的影响

由于生长InN所需平衡氮气压较高,而且InN分解温度比较低,因此在生长InN时In原子很容易在表面聚集形成In滴,使InN外延膜的表面形貌变差,影响InN外延膜质量的提高.通过研究Ⅴ/Ⅲ比和生长温度对RFMBE生长InN外延膜表面形貌的影响,发现Ⅴ/Ⅲ比和生长温度对InN外延膜表面In滴的量有重要影响.通过选择合适的Ⅴ/Ⅲ比和生长温度,得到了表面平整光亮、无In滴的InN外延膜.     

RF-MBE生长的高Al势垒层AlGaN/GaN HEMT结构

采用RF-MBE技术,在蓝宝石衬底上生长了高Al组分势垒层AlGaN/GaN HEMT结构.用三晶X射线衍射分析得到AlGaN势垒层的Al组分约为43%,异质结构晶体质量较高,界面比较光滑.变温霍尔测量显示此结构具有良好的电学性能,室温时电子迁移率和电子浓度分别高达1246cm2/(V·s)和1.429×1013cm-2,二者的乘积为1.8×1016V-1·s-1.用此材料研制的器件,直流特性得到了提高,最大漏极输出电流为1.0A/mm,非本征跨导为218mS/mm.结果表明,提高AlGaN势垒层Al的组分有助于提高AlGaN/GaN HEMT结构材料的电学性能和器件性能.     

RF-MBE生长AlN/GaN超晶格结构二维电子气材料

用射频等离子体辅助分子束外延技术( RF- MBE)在c面蓝宝石衬底上外延了高质量的Ga N膜以及Al N/Ga N超晶格结构极化感应二维电子气材料.所获得的掺Si的Ga N膜室温电子浓度为2 .2e1 8cm- 3,相应的电子迁移率为2 2 1cm2 /( V·s) ;1μm厚的Ga N外延膜的( 0 0 0 2 ) X射线衍射摇摆曲线半高宽( FWHM)为7′;极化感应产生的二维电子气室温电子迁移率达到10 86cm2 /( V·s) ,相应的二维电子气面密度为7.5e1 2 cm- 2 .     

蓝宝石衬底上单晶InAlGaN外延膜的RF-MBE生长

利用射频等离子体辅助分子束外延技术在蓝宝石衬底上外延了晶体质量较好的单晶InAlGaN薄膜.在生长InAlGaN外延层时,获得了外延膜的二维生长.卢瑟福背散射测量结果表明,InAlGaN外延层中In,Al和Ga的组分分别为2%,22%和76%,并且元素的深度分布比较均匀.InAlGaN(0002)三晶X射线衍射摇摆曲线的半高宽为4.8′.通过原子力显微镜观察外延膜表面存在小山丘状的突起和一些小坑,测量得到外延膜表面的均方根粗糙度为2.2nm.利用光电导谱测量InAlGaN的带隙为3.76eV.     

Effects of Growth Temperature Oil the InAIGaN Epilayer by RF-MBE

Single crystalline InAIGaN films are grown on sapphire substrate by radio-frequency plasma-excited molecularbeam epitaxy (RF-MBE).With the increase of growth temperature,the In content decreases,while the AI and Ga content increase.The InAIOaN grown at high temperature(600℃and 590℃)has some cracks on the surface.The surface of InAl.GaN grown at 580。C is very smoothing.There were SOme hillocks on the surface of InAIGaN film grown at 570℃.     

蓝宝石衬底上单晶InN外延膜的RF-MBE生长

采用低温氮化铟(InN)缓冲层,利用射频等离子体辅助分子束外延（RF-MBE）方法在蓝宝石衬底上获得了晶体质量较好的单晶InN外延膜．用光学显微镜观察所外延的InN单晶薄膜,表面无铟滴．InN（0002）双晶X射线衍射摇摆曲线的半高宽为14′;用原子力显微镜测得的表面平均粗糙度为3.3nm;Hall测量表明InN外延膜的室温背景电子浓度为3.3e18cm－3,相应的电子迁移率为262cm2/（V·s）．     

蓝宝石衬底上单晶InAlGaN外延膜的RF-MBE生长

利用射频等离子体辅助分子束外延技术在蓝宝石衬底上外延了晶体质量较好的单晶InAlGaN薄膜.在生长InAlGaN外延层时,获得了外延膜的二维生长.卢瑟福背散射测量结果表明,InAlGaN外延层中In,Al和Ga的组分分别为2%,22%和76%,并且元素的深度分布比较均匀.InAlGaN(0002)三晶X射线衍射摇摆曲线的半高宽为4.8′.通过原子力显微镜观察外延膜表面存在小山丘状的突起和一些小坑,测量得到外延膜表面的均方根粗糙度为2.2nm.利用光电导谱测量InAlGaN的带隙为3.76eV.