2020年电子电路技术热点

文章归纳了2020年电子电路产业一些技术热点,主要有5G电路板设计和基材,制造方面半加成法、3D打印、直接金属化孔电镀和垂直互连结构等技术,以及集成电路封装载板技术。     

从微电子到"活动的硅"--系统集成的未来潜力

本文主要介绍微电子发展趋势、微电子与微机械结合、系统集成的未来潜力。     

A surface-mounted device assembly technique for small optics based on laser reflow soldering

The three-dimensional miniaturized optical surface-mounted device (TRIMO-SMD) is a new flexible and automated assembly technique for small optical components (maximum diameter for a lens is 2 mm) based on laser reflow soldering technique. This technology can be compared to the electronic SMD technique but applied to micro-optical devices. We present some recent developments of TRIMO-SMD in its application to industrial products.     

GaN材料系列的研究进展

ＧａＮ及其合金作为第三代半导体材料具有一系列优异的物理和化学性质，在光电子器件，高温大功率电子器件及高频微波器件应用方面具有广阔的前景，已成为当前高科技领域的研究重点，论述了这种材料的研究历史与发展现状，物理与化学性质，薄膜的生长方法及在光学电子和微电子器件应用于方面的研究进展。     

Organometallic chemistry related to applications for microelectronics in Japan

This is meant to be a brief overview of the developments of research activities in Japan on organometallic compounds related to their use in electronic and optoelectronic devices. The importance of organometallic compounds in the deposition of metal and semiconductor films for the fabrication of many electronic and opto-electronic devices cannot be exaggerated. Their scope has now extended to thin-film electronic ceramics and high-temperature oxide superconductors. A variety of organometallic compounds have been used as source materials in many types of processing procedures, such as metal–organic chemical vapor deposition (MOCVD), metalorganic vapor-phase epitaxy (MOVPE), metal–organic molecular-beam epitaxy (MOMBE), etc. Deposited materials include silicon, Group III–V and II–VI compound semiconductors, metals, superconducting oxides and other inorganic materials. Organometallic compounds are utilized as such in many electronic and optoelectronic devices; examples are conducting and semiconducting materials, photovoltaic, photochromic, electrochromic and nonlinear optical materials. This review consists of two parts: (I) research related to the fabrication of semiconductor, metal and inorganic materials; and (II) research related to the direct use of organometallic materials and basic fundamental research.     

Mask‐free Localized Grafting of Organic Polymers at the Micrometer or Submicrometer Scale on Composite Conductors or Semiconductor Substrates

This work presents a new one‐step process enabling the mask‐free localized functionalization by organic polymers of the conducting or semiconducting parts of composite surfaces at the micrometer and submicrometer scale. The functionalization is carried out via cathodic electrografting of suitable precursors of composite cathodes, which gives an insulating polymer film strongly grafted to selected parts of the composite electrodes and guarantees that the resolution is that of the pre‐existing pattern, even when the whole surface is dipped into the reaction medium. The presumed mechanism is based on a regioselective extraction of electrons from the composite surface according to its apparent local work function in solution.     

集成电路的现状及其发展趋势

集成电路是信息社会经济发展的基石。通过对集成电路发展规律的分析,从集成电路的设计、制造、新产品研发和市场动态等方面,描述了集成电路的最新动态;探讨了集成电路的发展趋势;指出集成电路与其它学科、技术的结合,不断形成新的研究方向;新材料、新结构、新器件不断涌现,特征尺寸继续缩小,摩尔定律仍然起作用。     

Optimal shape design for packaging containing heating elements by inverse heat transfer method

The present study is concerned with the determination of the optimal shape for a package containing multiple heating elements. The optimization tool has been developed based on the inverse heat transfer (IHT) approach, incorporating a direct problem solver, a numerical grid generator, a direct-differentiation sensitivity analyzer, and the conjugate gradient method. Shape design that leads to a specified outer surface temperature distribution is predicted by the approach. In this study, the effects of internal heat generation on optimal shapes of the packagings have also been evaluated. Several practical cases with various imbedded heating elements and thermal conditions are studied. Results show that the approach provides an efficient computer-aided design scheme for the shape profile determination.     

Headspace solid-phase microextraction-gas chromatography-mass spectrometry applied to quality control in multilayer-packaging manufacture

A method based on headspace solid-phase microextraction-gas chromatography-mass spectrometry is proposed for the quality control of multilayer packaging and its manufacturing process. Volatile organic compounds (VOCs) are produced in the manufacturing process of the packaging. They can cause organoleptic problems or modify the properties of the packaging depending on the nature and the amount of the VOCs formed. The quantification using packaging samples with a known VOC concentration for the calibration is proposed in order to reduce the analysis time, and the method is validated using a statistical test. Finally, the method is applied to the determination of odour-responsible compounds in multilayer packaging samples obtained under different extrusion-coating conditions, i.e. type of extruder, type of polymer and extrusion speed.     

Characterization of the barrier properties of composites of HDPE and purified cellulose fibers

The present work presents and discusses the interrelation between composition, morphology, thermal history, mechanical and barrier properties to oxygen and limonene of composites of HDPE/MA-PE/cellulose fibers of significant interest in, among others, food packaging applications. From the overall results, it was observed that increasing the loading of purified alpha-cellulose fibers in the polyethylene matrix beyond 10 wt.% led to a decrease in the permeability coefficient of d-limonene, effect which was found to be primarily related to a decrease in the overall solubility of this strongly plasticizing aroma component. On the other hand, the oxygen permeability was found to decrease to a significant extend with increasing fiber content beyond 5 wt.%, but this effect was more strongly ascribed to a significant decrease in the diffusion coefficient. Therefore, the fibers are thought to generate a more tortuous path for the non-interacting gas molecules to travel across the composites thickness, even when tested at high relative humidity conditions. Optimum fiber loading levels in terms of overall property balance were found to be around 20 wt.%.