CIF格式文件展开处理程序

阐述对 CIF 格式文件进行展开处理在制版工作中的必要性;剖析了 CIF格式;介绍了展开处理程序的主要思想和结构。     

阿达玛变换成像光谱术的研究

本文论述了阿达玛变换成像光谱仪的基本原理,探讨了工作模式和若干设计问题,利用自行研制的实验装置,在可见波段获得了各种透明字形的成像光谱图。采用对称π变换和快速δ阿达玛变换,改善了实验数据的处理方法。     

红外光谱检测阻焊油墨固化程度试验报告

为从本质上分析阻焊剂剥离的原因,即光固化成分和热固化成分含量的差异,开展此试验。通过采用红外光谱检测阻焊油墨中环氧基以及丙烯基的含量,以衡量油墨的固化程度。并以此分析生产流程各环节对油墨固化程度的影响。通过研究不同的固化成分对阻焊剂结合力的影响,在业界开创了一种新的量化方法。     

干膜与阻焊油墨对化镍金厚度的影响

感光阻焊与干膜析出物,是化镍金表面工艺金、镍缸控制寿命的原因之一,旨在改善黑焊盘缺陷。由于阻焊、干膜种类繁多,且阻焊、干膜与化镍金药水属于不同公司或厂家,鉴于配方专利等原因,单方对其相互影响原理甚至现象鲜有研究,此方面文献更是屈指可数。本文简述了"黑焊盘"发生的基本原理,并利用干膜以及不同阻焊油墨进行试验,通过测量镍金层厚度评估干膜与油墨对化镍金工艺的影响。通过机理验证试验,验证阻焊油墨析出物抑制化镍反应,而非目前业界所认知的加速反应。本实验一则为PCB厂家提供经验数据,利于生产控制;二则抛砖引玉,促进阻焊油墨、干膜、化镍金药水及PCB厂家对其进一步研究。     

Microstructure, optical and static recording properties of AgOx film, and near-field simulation of sub-wavelength aperture based on the AgOx marks’ formation

Structures, spectra and surface topographies of as-deposited and annealed AgO_x films have been investigated by an X-ray diffractometer, a spectrophotometer and an atomic force microscopy (AFM). X-ray diffraction and spectrum results show that the as-deposited AgO_x films with high oxygen ratios (x≥0.5) are in amorphous states and Ag crystalline particles will separate out after annealed. AFM results show that the film surface will become much rougher and film thickness will increase greatly after annealed due to the decomposition of AgO_x with release of oxygen. Static recording results show that two microstructures of the recording marks can be produced: one is the bubble mark at a low recording power and the other is the rupture bubble with an ablated aperture (hole) in the center at a high recording power. Based on the formation of rupture bubble marks, the near-field optical distribution of a focused Gaussian laser beam through a sub-wavelength aperture (200 nm in diameter) has been simulated using finite-difference-time-domain (FDTD) method. Results show that the spot size can be greatly squeezed with still highly transmitted intensity, which may lead to the super-resolution readout.     

Modified form of binary and ternary 3-point subdivision schemes

Binary 3-point scheme, developed by Hormann and Sabin [Hormann, K. and Sabin, Malcolm A., 2008, A family of subdivision schemes with cubic precision, Computer Aided Geometric Design, 25, 41-52], has been modified by introducing a tension parameter which generates a family of C¹ limiting curves for certain range of tension parameter. Ternary 3-point scheme, introduced by Siddiqi and Rehan [Siddiqi, Shahid S. and Rehan, K., 2009, A ternary three point scheme for curve designing, International Journal of Computer Mathematics, In Press, DOI: 10.1080/00207160802428220], has also been modified by introducing a tension parameter which generates family of C¹ and C² limiting curves for certain range of tension parameter. Laurent polynomial method is used to investigate the continuity of the subdivision schemes. The performance of modified schemes has been demonstrated by considering different examples along with its comparison with the established subdivision schemes.     

VLSI版图验证算法的固化研究

ＶＬＳＩ电路芯片集成度的不断增加，使得设计趋于复杂化，这就对版图验证工具的处理能力与性能提出了进一步的要求，运用特殊的硬件将版图验证的某些算法固化，利用其中内在的并行性来获得处理速度的提高是一类非常有效的方法，本文提出了一种用于在版图验证算法中得到广泛运用的线扫描算法中边排序操作的硬件实现。并且在ＦＰＧＡ上进行了验证，整个系统实现于一块ＰＣ机的扩展卡上，测试的结果表明，对于排序的操作，硬件实现的速     

Micromachining of a thin film by laser ablation using femtosecond laser with masks

A gold thin film was machined by laser ablation using a femtosecond laser with mask patterns in the shape of lines and numbers. The patterns were successfully transferred with proper focusing and laser fluence. The optimal femtosecond laser fluence to keep the line width was about 5.2 mJ/cm² on the mask, and 99 mJ/cm² on the film. The processing resolution was 13 μm, and the narrowest line width was about 4 μm.     

引起阻焊膜色差的关键因素分析

在PCB阻焊外观品质控制中,阻焊的颜色是比较重要的一项控制点,对于使用同一型号阻焊油墨的一款生产板,板面阻焊出现明显的色差,客户一般不接受,目前业内对于引起阻焊色差的深层原因罕见报道。本文主要针对阻焊色差问题,研究了阻焊厚度、预烘时间、曝光能量、热固化温度时间等对阻焊颜色的影响,尝试从光学角度和阻焊的微观结构来解释引起阻焊色差的根本原因,同时研究了阻焊膜的色差所带来的可靠性问题,从结合力和其耐化学性方面做深入探讨。     

浅谈防焊显影不净

针对防焊出现的显影不净问题,通过实际的生产跟进分析验证,找出造成显影不净的主要因素：无尘房的温湿度、油墨本身的性能、油墨在产线（开油到显影的停放时间）。为解决此类问题提供思路。