毫米波三维异质异构集成技术的进展与应用

三维异质异构集成技术是实现电子信息系统向着微型化、高效能、高整合、低功耗及低成本方向发展的最重要方法,也是决定信息化平台中微电子和微纳系统领域未来发展的一项核心高技术。文章详细介绍了毫米波频段三维异质异构集成技术的优势、近年来的发展趋势以及面临的挑战。利用硅基MEMS 光敏复合薄膜多层布线工艺可实现异质芯片的低损耗互连,同时三维集成高性能封装滤波器、高辐射效率封装天线等无源元件,还能很好地处理布线间的电磁兼容和芯片间的屏蔽问题。最后介绍了一款新型毫米波三维异质异构集成雷达及其在远距离生命体征探测方面的应用。     

Recent breakthroughs of antibacterial and antiviral protective polymeric materials during COVID-19 pandemic and after pandemic: Coating,packaging, and textile applications

The global epidemic owing to COVID-19 has generated awareness to ensuring best practices for avoiding the microorganism spread. Indeed, because of the increase in infections caused by bacteria and viruses such as SARS-CoV-2, the global demand for antimicrobial materials is growing. New technologies by using polymeric systems are of great interest. Virus transmission by contaminated surfaces leads to the spread of infectious diseases, so antimicrobial coatings are significant in this regard. Moreover, antimicrobial food packaging is beneficial to prevent the spread of microorganisms during food processing and transportation. Furthermore, antimicrobial textiles show an effective role. We aim to provide a review of prepared antimicrobial polymeric materials for use in coating, food packaging, and textile during the COVID-19 pandemic and after pandemic.     

微桥法镍膜的弹性模量和残余应力测量

利用MEMS技术制作了不同尺寸的镍(Ni)膜微桥结构样品。采用纳米压痕仪XP系统测量了微桥载荷与位移的关系,并结合微桥力学理论模型得到了两种不同尺寸的Ni膜的弹性模量和残余应力。结果表明,两种不同尺寸的Ni膜的弹性模量结果一致,为190 GPa左右,但是残余应力变化较大。与采用纳米压痕仪直接测得的带有硅(Si)基底的Ni膜弹性模量186.8 7.5 GPa相比较,两者符合较好。     

MEMS封装技术研究进展

介绍了MEMS封装技术的特点、材料以及新技术,包括单片全集成MEMS封装、多芯片组件(MCM)封装、倒装芯片封装、准密封封装和模块式MEMS封装等。文中还介绍了MEMS产品封装实例。     

Low temperature delamination of plastic encapsulated microcircuits

Plastic encapsulated microcircuits (PEMs) are increasingly being used in applications requiring operation at temperatures lower than the manufacturer’s recommended minimum temperature, which is 0°C for commercial grade components and −40°C for industrial and automotive grade components. To characterize the susceptibility of PEMs to delamination at these extreme low temperatures, packages with different geometries, encapsulated in both biphenyl and novolac molding compounds, were subjected to up to 500 thermal cycles with minimum temperatures in the range −40 to −65°C in both the moisture saturated and baked conditions. Scanning acoustic microscopy revealed there was a negligible increase in delamination at the die-to-encapsulant interface after thermal cycling for the 84 lead PQFPs encapsulated in novolac and for both 84 lead PQFPs and 14 lead PDIPs encapsulated in biphenyl molding compound. Only the 14 lead novolac PDIPs exhibited increased delamination. Moisture exposure had a significant effect on the creation of additional delamination.     

Si基膜片型气敏传感器微结构单元的热学性能

微结构气敏传感器由于其微型化、低功耗、易阵列化和易批量生产等优点而受到国内外研究者的广泛关注。利用微机电系统（MEMS）加工技术，制备Si基膜片型微结构单元，并分析其热学性能。这种单元工作区温度为-300℃时，加热功率约75mW；并且膜片工作区的热质量很小，温度可以于毫秒量级的时间内，在室温和450℃之间调制。利用这种微结构单元，可以在温度调制方式下，研究气敏薄膜的电学特性和敏感机理。     

MEMS移相器及其在微型通信系统中的应用

从传统移相器的构造和原理出发，进一步分析了MEMS移相器的结构、特性。结果表明，MEMS移相器具有传统移相器所无法比拟的体积小、损耗小、成本低、频带宽、易于集成等突出优点。随着高阻硅衬底在微波领域应用的扩展，MEMS移相器介质损耗大幅度降低，将能与信号处理电路一同集成于硅衬底上，便于相控阵雷达等通信系统实现微小型化。     

MEMS光开关及其与光纤组装方式的研究

光开关是一种在光路中应用极其广泛的光无源器件,可用于扫描、投影、通讯等多种不同的领域,其中用于全光通讯中连接光纤之间的光开关日渐成为人们关注的焦点.高性能、低成本、又能大量生产的MEMS光开关很好地满足了全光网络对器件的要求.本文对这种MEMS光纤光开关的类型、特点以及研究现状进行了介绍,并给出了MEMS光开关与输入输出光纤的组装与自组装以及主要方式.     

A Noninvasive, on Wafer Method to Determine the Intrinsic Stress of a Polymer Layer

The method described in this paper allows an investigator to determine the intrinsic stress of a polymer layer in a way that does not result in damage to devices or test structures. The method requires that a small area of the polymer be released from the substrate to form a diaphragm. The diaphragm is stimulated with acoustic white noise and the diaphragm movement is monitored with a laser vibrometer. The first few resonance frequencies of the diaphragm are obtained using a laser vibrometer and then those frequencies are used to calculate the membrane intrinsic bi-axial tension.     

反射式微光机电系统(MOEMS)的研究现状与展望

反射式微光机电系统是微光机电系统中的重要组成部分,近年来得到了较快的发展。介绍了反射式微光机电系统(MOEMS)的研究现状和最新进展。根据反射式微光机电系统的分类,列举了一些具有代表性的反射式MOEMS器件。简要介绍了反射式MOEMS的加工工艺;阐述了反射式MOEMS的应用领域;展望了发展前景。