Fabrication and characterization of low-cost ultrathin flexible polyimide interposer

A passive interposer, which is a way to bridge the feature gap between the integrated circuit (IC) and the package substrate, is a key building block for high performance 3-D systems. In this paper, polyimide (PI) is proposed as an alternative to glass and silicon based interposers for cost-effective 2.5-D/3-D IC integration. The development of interconnect technology using an ultrathin flexible polyimide interposer (UFPI) for 2.5-D/3-D packaging applications is described in detail. A semi-additive process consisting of copper seed layer deposition, photolithography, and electrolytic copper pattern plating is used for fabricating a double-sided flexible fan out interposer. A UFPI with electrodeposited micro-scale copper (Cu) fine patterns and laser drilling microvia is investigated using a scanning electron microscope (SEM), energy-dispersive spectrometry (EDS), X-ray spectrometry, and an optical 3-D profilometer. The UFPI with fine pitch on 12.5 μm thin PI substrates has been demonstrated. The result is a proof-of-concept to exploit the opportunities of cost-effective 2.5D flexible interposer production.     

SiP协调设计与PI解析(2)

概述了SiP协调设计和PI解析:(3)芯片的安装,(4)互连板。     

硅/玻璃基板互连和无源元件的动向

概述了硅玻璃互连板和硅系集成无源元件(IPD)的动向。无源元件制造商的PCB嵌入用硅系芯片元件已经问世。硅基板上的微细薄膜线路和薄膜元件实现无硅化。     

与半导体IC相融合的互连板的电镀技术动向

概述了IC芯片的铜镶嵌构造和高端电子安装领域中与半导体IC相融合的互连板的电镀技术动向。