高密度互连印制板

本文阐述了RCC材料与化学蚀刻法制作高密度互连印制板的工序和详细方法,意在探寻最为经济、简单而又行 之有效的工艺。     

数字混沌扩频序列的盲估计

混沌序列具有非线性、宽带类噪声、大的码族、任意长的周期且容易产生的特性,因此在扩频通信系统中很有实用价值。本文将文献[1]中对伪随机扩频序列盲估计的方法推广应用到混沌扩频通信中,并对其不足提出了改进方法。在只知道扩频码周期而无其它任何先验知识的条件下,利用特征值分析的方法可以对数字混沌直扩序列进行盲估计,仿真实验证明了该方法的有效性。     

红外制导系统误差信号分布曲线及盲区的计算

本文介绍了红外制导系统误差信号分布曲线及盲区的计算方法，对目前红外界使用的计算公式进行了讨论。     

水相湿法改性纳米碳酸钙表面性质的研究

用特定的表面改性剂在水相中对纳米碳酸钙的悬浮液进行了湿法改性。红外光谱和热失重分析证明,改性剂与碳酸钙之间以化学键结合;沉降体积和接触角的测定结果说明改性粒子在液体石蜡中的润湿性和疏水性得到了提高;透射电子显微镜照片显示改性粒子在液体石蜡中有更好的分散性;体系粘度实验表明改性粒子与液体石蜡之间有较好的相容性。     

Towards EPC-syntheses of the structural class of cochleamycins and macquarimicins. Part 2: EPC-synthesis of the hydrindene subunit of the macquarimicins

The EPC-synthesis of the cis-hydrindene subunit of the macquarimicins, antibiotics with antitumour and anti-inflammatory activity, has been achieved. Desymmetrization of cis-1,4-cyclopent-2-enediol was succeeded by Diels-Alder reaction and functional group transformations to a tricyclic ketone. Regio- and stereoselective methylation via Claisen condensation and hydrogenation was followed by nucleophilic, intramolecular addition, reduction and acidic fragmentation. Further functional group transformations led to the target molecule.     

电化学方法获得具有表面增强拉曼活性镍电极的研究

利用纯电化学手段获得了具有较强表面增强拉曼活性的镍电极, 改进了原有的镍电极表面预处理方法. 结果表明, 在0.5 mol/L的NaClO4溶液中, 结合电化学阶跃技术和循环伏安技术, 可以得到合适的粗糙镍电极; 同时, 还得到了探针分子吡啶在该粗糙镍电极表面随电极电位变化的表面增强拉曼光谱(SERS), 此时谱峰强度获得了极大的增强; 还研究了粗糙镍电极的扫描电子显微镜(SEM)图像, 并估算出其SERS增强因子约为104, 此结果比以前的镍电极表面粗糙方法所能达到的增强因子高一个数量级.     

Preparation and properties of sclerotium rolfsii invertase immobilized on indion 48-R

Crude extracellular invertase fromSclerotium rolfsii, when coupled to glutaraldehyde activated Indion 48-R, retained 70–80% activity of the soluble enzyme. Immobilization resulted in a decrease in the pH and temperature optima but it increased the temperature stability. K_m and V_max also increased as a result of immobilization. Both soluble and immobilized invertase showed inhibition at high substrate concentrations. The bound enzyme showed excellent stability to repeated use and retained approx 90% of its initial activity after 8 cycles of use.     

The effects of etching and deposition on the performance and stress evolution of open through silicon vias

The effects of silicon etching using the Bosch process and LPCVD oxide deposition on the performance of open TSVs are analyzed through simulation. Using an in-house process simulator, a structure is generated which contains scalloped sidewalls as a result of the Bosch etch process. During the LPCVD deposition step, oxide is expected to be thinner at the trench bottom when compared to the top; however, additional localized thinning is observed around each scallop. The scalloped structure is compared to a structure where the etching step is not performed, but rather a flat trench profile is assumed. Both structures are imported into a finite element tool in order to analyze the effects of processing on device performance. The scalloped structure is shown to have an increased resistance and capacitance when compared to the flat TSV. Additionally, the scalloped TSV does not perform as well at high frequencies, where the signal loss is shown to increase. However, the scallops allow the TSV to respond better to an applied stress. This is due to the scallops’ enhanced range of motion and displacement, meaning they can compensate for the stress along the entire sidewall and not only on the TSV top, as in the flat structure.     

任意层互连生产技术研究

任意层互连（ELIC）是最高阶的高密度连接（HDI）制程，它可以比传统线路在层数相同的情况下，增加约30%层间互连；随着移动通讯产品功能需求的增加，ELIC技术被大举应用在智能手机及平面电脑等产品上。高阶ELIC线路板的生产不但流程长，且生产难度较大。本文对ELIC板的制作难点进行了分析，并提出相应的解决方法和生产注意事项，为ELIC工艺产业化提供必要的参考依据。