Electron transport near the Mott transition in n-GaAs and n-GaN

In this paper, we study the temperature dependence of the conductivity and the Hall coefficient near the metal–insulator phase transition. A theoretical investigation is performed within the effective mass approximation. The variational method is used to calculate the eigenvalues and eigenfunctions of the impurity states. Unlike previous studies, we have included nonlinear corrections to the screened impurity potential, because the Thomas–Fermi approximation is incorrect for the insulator phase. It is also shown that near the phase transition the exchange interaction is essential. The obtained temperature dependencies explain several experimental measurements in gallium arsenide (GaAs) and gallium nitride (GaN).     

Ultraviolet electroluminescence from ZnO-based light-emitting diode with p-ZnO:N/n-GaN:Si heterojunction structure

A p-ZnO:N/n-GaN:Si structure heterojunction light-emitting diode (LED) is fabricated on c-plane sapphire by full metal organic chemical vapor deposition (MOCVD) technique. The p-type layer with hole concentration of 8.94×10¹⁶ cm⁻³ is composed of nitrogen-doped ZnO using NH₃ as the doping source with subsequent annealing in N₂O plasma ambient. Silicon-doped GaN film with electron concentration of 1.15×10¹⁸ cm⁻³ is used as the n-type layer. Desirable rectifying behavior is observed from the current-voltage (I-V) curve of the device. The forward turn on voltage is about 4 V and the reverse breakdown voltage is more than 7 V. A distinct ultraviolet (UV) electroluminescence (EL) with a dominant emission peak centered at 390 nm is detected at room temperature from the heterojunction structure under forward bias conditions. The origins of the EL emissions are discussed in comparison with the photoluminescence (PL) spectra.     

光致电化学法提高垂直结构发光二极管出光效率的研究

研究了在垂直结构发光二极管(VLED)器件中, 光致电化学法(PEC)刻蚀N极性n-GaN的速率受不同刻蚀条件(刻蚀浓度、刻蚀时间和光照强度)的影响. 并选择N极性n-GaN表面含有较理想六角金字塔结构(侧壁角为31°)的样品制成器件, 研究PEC刻蚀对VLED的欧姆接触和光电性能的影响. 结果表明, 与未粗化样品相比, PEC刻蚀后的样品接触电阻率明显降低, 形成更好的欧姆接触; 其电学特性有较好的改善, 光输出功率有明显提高, 在20 mA电流下光输出功率增强了86.1%. 对不同金字塔侧壁角度的光提取效率用时域有限差分法(FDTD)模拟, 结果显示光提取效率在侧壁角度为20°– 40°有显著提高, 在23.6° (GaN-空气界面的全反射角)时达到最大.     

Electrical properties of photoanodically generated thin oxide films on n-GaN

The characteristics of photoelectrochemically (PEC) generated gallium oxide films on n-GaN using an 0.002 M KOH electrolyte are described. The chemical composition of the resistive layers was analyzed by Auger electron spectroscopy. The DC and HF characteristics of Al/Ti/PEC-Ga₂O₃ (gallium sesquioxide)/GaN structures were studied with current–voltage and capacitance–voltage measurements, respectively. Under reverse bias we found extremely low leakage currents (<10⁻⁸ Acm⁻² at −15 V) and a very low interface state density; high-temperature operation (up to 166°C tested) motivates the integration of the described dielectric layer forming technique into GaN based device process schemes. Our method may also be employed as gate recess technology.     

MOVPE低温生长的n型GaN电学特性研究

系统研究了采用金属有机物化学气相外延方法在740℃和900℃条件下生长的n型GaN的电学特性. 电化学电容-电压测试表明,在低温条件下采用三乙基镓作为Ga源生长有利于降低非故意掺杂n型GaN的背景杂质浓度. 另外,对重掺Si的n型GaN的霍耳效应测试表明,随着Si掺杂浓度增大,电子浓度相应线性增大,表现出杂质带导电特性,而迁移率则相应减小. 同时,原子力显微镜测试和X射线衍射测试均表明生长温度和掺杂浓度对外延材料的表面形貌和晶体质量有影响,特别是在高掺杂浓度的情况下,样品的表面形貌恶化更严重. 在所研究的 关键词： n型GaN 电子浓度 迁移率     

刻蚀与退火对GaN欧姆接触的影响

使用干法刻蚀在GaN LED晶片上刻蚀n区,用电子束蒸发方法在n型GaN表面上淀积Ti/Al双金属层作为接触电极,在N2环境中进行退火.探讨不同的刻蚀方法和刻蚀条件及不同的退火条件对Ti/Al-n型GaN间欧姆接触的影响.     

原子层沉积Al2O3/n-GaN MOS结构的电容特性

利用原子层沉积技术制备了具有圆形透明电 极的Ni/Au/Al₂O₃/n-GaN金属-氧化物-半导体结构, 研究了紫外光照对样品电容特性及深能级界面态的影响, 分析了非理想样品积累区电容随偏压增加而下降的物理起源. 在无光照情形下, 由于极长的电子发射时间与极慢的少数载流子热产生速率, 样品的室温电容-电压扫描曲线表现出典型的深耗尽行为, 且准费米能级之上占据深能级界面态的电子状态保持不变. 当器件受紫外光照射时, 半导体耗尽层内的光生空穴将复合准费米能级之上的深能级界面态电子, 同时还将与氧化层内部的深能级施主态反应. 非理想样品积累区电容的下降可归因于绝缘层漏电导的急剧增大, 其诱发机理可能是与氧化层内的缺陷态及界面质量有关的“charge-to-breakdown”过程. 关键词： 原子层沉积 2O₃/n-GaN')" href="#">Al₂O₃/n-GaN 金属-氧化物-半导体结构 电容特性