Effect of long-period stacking ordered phase on thermal stability of refined grains in Mg-RE-based alloys

The refined grains in both as-cast Mg-10Y-1Zn-2Zr (WZ101?K, wt.%) and Mg-10Y-1Al (WA101, wt.%) alloys have been found to have superior thermal stability after solution treatment. Plate-shaped, but different polytypes of long-period stacking ordered (LPSO) phases distributed along grain boundaries are considered as the predominant inhibitors of grain growth. Based on the plate-shaped features of the LPSO phases, a modified Zener’s model is established and the predicted limiting grain sizes are in a good agreement with the experimental results. Therefore, this model has strong potential for designing advanced Mg-RE-based alloys with high strength and high creep resistance at high temperatures.     

Grain boundary segregation diagrams of α-iron

Based on thermodynamic analysis of interfacial segregation, the segregation enthalpy H ^o of a solute I in a given matrix was found to depend linearly on two mutually independent terms reflecting the type of interface and the solid solubility limit X _infI ^sup* at temperature T and can be written as In this equation, the structural dependence of interfacial segregation is contained in H ^*() which corresponds to the extrapolated segregation enthalpy of a solute with unlimited solubility in the matrix. The product [Tln(X _infI ^sup* )] is essentially constant with temperature, and can therefore be obtained from data for maximum solid solubility, [Tln(X _infI ^sup* )]_max. The parameter v>0 represents the relationship between the activity a _infI ^sup* of a solute at the bulk solid solubility limit in a given matrix and X _infI ^sup* , a _infI ^sup* =(X _infI ^sup* ) ^v , and is characteristic for the matrix. Using recent experimental data for silicon, phosphorus, and carbon segregation at well-characterized grain boundaries in oriented bicrystals of -iron, the averaged value was determined. Values of H ^*() range from -8 kJ/mol (general grain boundaries) up to +8 kJ/mol (special grain boundaries). These values are discussed and used for a more precise and generalized construction of grain boundary segregation diagrams of -iron.     

中国优秀物理学家的杰出代表——葛庭燧

回顾介绍了葛庭燧院士的生平和他在科学研究、人才培养方面所作出的贡献,展示了他的高尚情操,分析了他取得卓著成就的原因.     

Influence of the Grain Boundaries on the Heat Transfer in Laser Ceramics

Grain boundaries play a key role in determining several key properties of polycrystalline laser ceramics. Heat transfer measurements at low temperature constitute a good tool to probe grain boundaries. We review the results of heat transfer measurements in polycrystalline Y₃Al₅O₁₂ garnets as well as Y₂O₃ and Lu₂O₃ sesquioxide materials obtained by self-energy-driven sintering of nano-particles. The average phonon mean free path in Y₃Al₅O₁₂ was found to be significantly larger than the average grain size and to scale with temperature as T ⁻² at low temperature. Existing models describing the interaction between phonons and grain boundaries are reviewed. Correct temperature dependence of the mean free path and order of magnitude of scattering rates were found by assuming the existence of a grain boundary layer having acoustic properties different from those of the bulk. A different temperature dependence of phonon mean free path was found for the sesquioxides and was ascribed to the stronger elastic anisotropy of these materials. The thermal resistance associated to the grain boundaries of laser ceramics was found to be lower than in other dense polycrystalline ceramic materials reported in the literature.     

Dependence of stresses on grain orientations in BCC polycrystalline films on substrates

Most thin films have different thermal expansion coefficients from their substrates, thus thermal stresses will be introduced into the films when the temperature is changed during annealing and service. Calculations of these stresses for grains in various crystallographic orientations have been made for seven BCC transition metals Cr, Fe, Mo, Nb, Ta, V and W. Neglecting W, which is isotropic and the stresses are equiaxial and without grain orientation （hkl） dependence, the BCC metals may be grouped into two classes. In the first class （Cr, Mo, Nb and V）, the （100）-oriented grains have the largest stresses, while the stresses σ1 and σ2 in other （hkl）-oriented grains decrease linearly with the increase of the angle between （hkl） and （100）, and with σ1 〈 σ2 except in （100）- and （lll）-oriented grains. In the second class （Fe and Ta）, on the contrary, the （100）-oriented grains have the lowest stresses, and the stresses σ1 and σ2 in other （hkl）-oriented grains increase linearly with the increase of the angle between （hkl） and （100）, and with σ1 〉 σ2 except in （100）- and （111）-oriented grains.     

Mg合金晶粒细化机理的电子理论研究

采用递归法计算了α-Mg与α-Zr的结构能、原子结合能,Mg/Zr界面能与Mg/液态Mg界面能,Mg中Zr及Zr中Fe,Mn,Si等杂质原子相互作用能.计算发现α-Zr的结构能、原子结合能低于相应的α-Mg,且Mg/Zr界面能低于Mg/液态Mg界面能,从能量角度合理解释了Zr先于Mg从Mg熔体析出,并作为异质核心细化Mg晶粒的实验现象.原子相互作用能的计算结果显示,Zr在Mg中相互吸引形成团簇,并与杂质形成化合物,削弱晶粒细化效果. 关键词： 电子结构 晶粒细化 Mg合金     

考虑晶粒尺寸效应的超薄(10–50 nm) Cu电阻率模型研究

结合Marom模型与实验数据, 给出了晶粒尺寸与金属薄膜厚度的关系式. 基于已有的理论模型, 针对厚度为10–50 nm Cu薄膜, 考虑到表面散射与晶界散射以及电阻率晶粒尺寸效应, 提出一种简化电阻率解析模型. 结果表明, 在10–20 nm薄膜厚度范围内, 考虑晶粒尺寸效应后的简化模型与现有实验数据符合得更好. 相对于Lim, Wang与Marom模型, 所提模型的相对标准差分别降低74.24%, 54.85%, 78.29%. 关键词： 表面散射 晶界散射 晶粒尺寸效应 平均自由程     

晶粒棱长、尺寸与拓扑学特征之间关系的Monte Carlo仿真研究

采用Potts模型Monte Carlo方法研究了晶粒棱长、尺寸与拓扑学特征之间的统计关系.结果表明,晶粒棱长与晶粒面数之间呈线性统计关系,并且平均N面体晶粒模型和Poisson-Voronoi组织均支持该结论.不同时刻的晶粒长大仿真数据表明,在准稳态晶粒长大阶段晶粒棱长的分布具有自相似性.个体晶粒的平均棱长随晶粒面数（或晶粒尺寸）的增加而逐渐增大,这说明一些理论模型中采用的“不同面数的晶粒平均棱长均相等”的假设具有局限性.仿真数据和纯铁实验数据均表明,晶粒尺寸与晶粒面数之间的统计关系表现为一条单调递增的凸曲线. 关键词： 晶粒棱长 晶粒尺寸 拓扑学 Monte Carlo仿真     

Microstructure evolution during severe plastic deformation

Radiotracer diffusion studies of severely deformed, ultra-fine grained materials have revealed the presence of ultra-fast transport paths, which include “non-equilibrium” grain boundaries and free volume. Under some experimental conditions, percolating porosity is produced even in pure copper. Micro-cracks may form in metals, if the local maximum shear stress exceeds the shear yield stress. However, their growth and propagation is postponed till late in the deformation process owing to the ductility of metals, the hydrostatic component of the stress system and/or dynamic recovery/recrystallization. In other words, crack growth and propagation is present only when the scope for further deformation is highly restricted. Using this approach, the load required for equal channel angular pressing, the change in the slope of the Hall–Petch plot with decreasing grain size and the theoretical limit for the smallest grain size attainable in a metal in a severe plastic deformation process are predicted and validated by experimental results. Experimentally successful prevention of percolated crack formation by the superposition of a hydrostatic pressure is also accounted for using this model.