Laser induced copper electroless plating on polyimide with Q-switch Nd:YAG laser

The results of laser induced deposition of copper on polyimide substrate from copper electrolyte solution are reported. Unlike most work reported in the literatures where CW Ar⁺ lasers were used, a second harmonic (532 nm wavelength) Q-switch Nd:YAG laser was used for our experiments. The deposition process was conducted by laser-catalyzing of the polyimide surface and subsequent photothermal-accelerated reduction of copper-complex ions in an alkaline reducing environment. The characteristics of the deposited copper line were investigated in terms of laser beam scanning speed, and the number of scans. The surface morphology and chemical composition of the deposited copper were analyzed using field emission scanning electron microscope (FESEM) and energy dispersive spectrometer (EDX). The optimum processing conditions have been identified. The copper deposit was found to adhere well to the substrate.     

STM/AFM studies of the evolution of morphology of electroplated Ni/W alloys

The surface morphology evolution of Ni/W alloys was studied, as a function of the alloy composition. Using the modified plating baths developed in our laboratory recently, electroplated Ni/W alloys with different W content, in the range of 7–67 atom percent (a/o), can be obtained. This was found to lead to different structures, ranging from polycrystalline fcc-Ni type structure to amorphous, followed by orthorhombic with increasing W content in the alloy. Powder XRD was studied to determine the crystal structures. Ex situ STM, AFM and SEM were used to study in detail the surface morphologies of the different alloys, and their evolution with increasing W content.

The important findings are that a mixture of two crystalline forms can give rise to an amorphous structure. Hillocks that are usually a characteristic of epitaxial growth can also exist in the amorphous alloys. Oriented scratches caused by stress can also be formed.

Up to 20 a/o of W is deposited in the alloys in crystalline form, with the fcc-Ni type structure. Between 20 and about 40 a/o an amorphous structure is observed, and above that an orthorhombic crystal structure is seen, which is characteristic of the NiW binary alloy. Careful choice of the composition of the plating bath allowed us to deposit an alloy containing 67 a/o W, which corresponds to the composition NiW₂.     

SURFACE METALLIZATION OF CENOSPHERES AND PRECIPITATORS BY ELECTROLESS PLATING

This paper reports the use of a colloidal Pd^0 catalysis system to metallize the surface of precipitators separated from coal fly-ash, and metals such as Cu, Ni etc. are deposited on the precipitators surface. Alternatively, according to the characteristic surface of cenospheres, an Ag coating catalysis system is adopted to first deposit Ag on the cenospheres surface, followed, if necessary, by the deposition of other metals such as Cu, Ni, etc. on the Ag coating to produce monolayer and multilayer metal-coated cenospheres. The surface characteristics and the morphologies of the metal coatings are examined in detail with scanning electron microscopy (SEM), energy dispersive spectroscopy (EDX) and X-ray photoelectron spectroscopy (XPS) techniques. It can be shown that the quality of metal coatings derived from the Aa coatina catalysis system, is better than that of the colloidal Pd^0 catalysis system.     

代铬刷镀层的耐腐蚀机理的考察

对新型的代铬刷镀层Ni-Fe-W-P-S进行了耐腐蚀性能机理的分析研究。用扫描电镜(SEM)、透射电镜(TEM)、扫描隧道显微镜(STM)、X射线衍射及电子能谱(XPS)等的分析表明，基体组织为非品结构是代铬刷镀层优异耐腐蚀性的主要原因.     

镀金层识别及其厚度测定的X—荧光强度比值法

利用Ａｕ原子在Ｘ射线激发下所发射的Ｌβ线和Ｍ线的强度比值识别样品是镀金还是Ｋ金，同时利用这个比值测定镀金层的厚度，镀金层厚度的测定范围为０～４μｍ，测定值与标定值的相对误差小于１５％。     

低温低内应力化学镀镍工艺的研究

化学镀广泛应用于非金属的电镀、电铸前的施加导电层。化学镀沉积层质量与其在零件上的附着力有着密切的关系 ,重视对化学镀沉积层内应力的研究 ,开发一个低温、低内应力的化学镀镍工艺 ,对于化学镀沉积层的推广应用有着十分重要的意义。本文采用正交实验方法对低温、低内应力化学镀镍工艺进行了系统研究 ,开发出了一个低温、低内应力的化学镀镍工艺。在实验过程中发现沉积层内应力同其在零件上的结合力具有密切关系并对其进行了初步探讨。1　实验方法1 1　正交实验根据探索性实验结果分析 ,影响化学镀镍层内应力σ和沉积层速率ｒ的主要因…     

A New Activation Method for Electroless Metal Plating：Palladium Laden via Bonding with Self—Assembly Monolayers

A new activation method has been developed for electroless copper plating on silicon wafer based on palladium chemisorption on SAMs of APTS without SnCl2 sensitization and roughening condition.A closely packed electroless copper film with strong adhesion is successfully formed by AFM observation.XPS study indicates that palladium chemisorption occurred via palladium chloride bonding to the pendant amino group of the SAMs.     

Nano-WC/PTFE-Ni复合电刷镀层的磨损性能研究

采用电刷镀技术在Q235钢基材上制备含纳米WC和PTFE的镍基复合镀层,采用S-2700型扫描电子显微镜观察镀层表面形貌及其显微组织,采用HX-1型显微硬度计测定镀层的显微硬度,采用WS-2005型涂层附着力自动划痕仪测定镀层与基体的结合强度,采用HT-500型销-盘高温摩擦磨损试验机测量镀层的滑动磨损性能.结果表明:镀液中同时加入纳米WC和PTFE可以得到表面形貌平整、纳米粒子分布均匀的纳米复合镍镀层;复合镀层的硬度随WC含量的增加而增大,随PTFE含量的增加而减小;含有2种纳米粒子的复合镍镀层的耐磨性比镍镀层和含单一WC或PTFE的镍镀层的耐磨性优良;当镀液中WC和PTFE含量分别为3.0 g/L和7.5 mL/L时,复合镍镀层的显微硬度较镍镀层提高约30%,耐磨性较镍镀层提高7倍.     

Low-phosporous nickel-coated carbon microcoils: Controlling microstructure through an electroless plating process

Carbon microcoils (CMCs) have been coated with a nickel-phosphorus (Ni-P) film using an electroless plating process, with sodium hypophosphite as a reducing agent in an alkaline bath. CMC composites have potential applications as microwave absorption materials. The morphology, elemental composition and phases in the coating layer of the CMCs and Ni-coated CMCs were investigated by scanning electron microscopy (SEM), energy dispersive spectroscopy (EDS) and X-ray diffraction (XRD), respectively. The effects of process parameters such as pH, temperature and coating time of the plating bath on the phosphorus content and deposition rate of the electroless Ni-P coating were studied. The results revealed that a continuous, uniform and low-phosphorous nickel coating was deposited on the surface of the CMCs for 20 min at pH 9.0, plating bath temperature 70 °C. The as-deposited coatings with approximately 4.5 wt.% phosphorus were found to consist of a mix of nano- and microcrystalline phases. The mean particle size of Ni-P nanoparticles on the outer surface of the CMCs was around 11.9 nm. The deposition rate was found to moderately increase with increasing pH, whereas, the phosphorous content of the deposit exhibited a significant decrease. Moreover, the material of the coating underwent a phase transition between an amorphous and a crystalline structure. The thickness of the deposit and the deposition rate may be controlled through careful variation of the coating time and plating bath temperature.     

Electroless plating of copper on fly ash cenospheres using polyaniline‐Pd activation

The polyaniline of different intrinsic oxidation states, viz., the emeraldine (EM) and the leucoemeraldine (LM) states, were coated on 3‐aminopropyltriethoxy silane modified fly ash cenospheres. Without prior sensitization by SnCl₂ solution, Pd activation by PdCl₂ solution was carried out on EM and LM laden cenospheres, followed by electroless plating of copper (Cu). The topography and composition of the composites were characterized by scanning electron microscopy, X‐ray diffraction, and X‐ray photoelectron spectroscopy, etc. The results indicate that the oxidation state of the LM layer showed a much bigger increase than that of the EM layer in the Pd activation process, while coupled Pd reduction underwent to a more extent on the LM layer. The metallic Pd atoms on the LM and EM layers surface initiated the subsequent electroless plating of Cu, and the coated Cu on LM laden cenospheres had a much more uniform and compact morphology than that on EM laden cenospheres. Copyright © 2012 John Wiley & Sons, Ltd.