Effect of annealing temperature for Si0.8Ge0.2 epitaxial thin films

This study investigates the effect of annealing temperature on the Si_0.8Ge_0.2 epitaxial layers. The Si_0.8Ge_0.2 epitaxial layers were deposited by using ultrahigh vacuum chemical vapor deposition (UHVCVD) with different annealing temperatures (400-1000 °C). Various measurement technologies, including high-resolution X-ray diffraction (HRXRD), atomic force microscopy (AFM) and interfacial adhesion tester, were used to characterize the materials properties of the SiGe epilayers. The experimental results showed that the SiGe epilayers gradually reduced lattice-mismatch to the underlying substrate as annealing temperature increased (from 400 to 800 °C), which resulted from a high temperature enhancing interdiffusion between the epilayers and the underlying substrate. In addition, the average grain size of the SiGe films increased from 53.3 to 58 nm with increasing annealing temperature. The surface roughness in thin film annealed at 800 °C was 0.46 nm. Moreover, the interfacial adhesion strength increased from 476 ± 9 to 578 ± 12 kg/cm² with increasing the annealing temperature.     

硅基低位错密度厚锗外延层的UHV/CVD法生长

利用超高真空化学气相淀积系统, 基于低温缓冲层和插入应变超晶格的方法, 在Si(100)衬底上外延出厚度约为880 nm的纯Ge层. 采用X射线双晶衍射、高分辨透射电镜、原子力显微镜和光致发光谱分别表征了其结构及光学性质. 测试结果显示外延Ge的X射线双晶衍射曲线半高宽为273", 表面均方根粗糙度为0.24 nm, 位错密度约为1.5×10⁶ cm². 在室温下观测到外延Ge的直接带跃迁光致发光, 发光峰值位于1540 nm. 表明生长的Si基Ge材料具有良好的结晶质量, 可望在Si基光电子器件中得到应用.     

金属诱导生长与超高真空化学气相沉积方法相结合制备多晶锗硅薄膜

采用金属Ni诱导与超高真空化学气相沉积(UHVCVD)相结合的方法，在热氧化硅衬底上生长了多晶锗硅薄膜.利用X射线衍射(XRD)、场发射扫描电镜(SEM)等对多晶锗硅薄膜的质量、表面形貌进行了测试分析，并就生长参数以及金属Ni对薄膜性能的影响进行了研究.结果表明：1)在420—500℃范围内，金属Ni具有明显的诱导作用；2)Ni层厚度对薄膜质量及形貌的影响使得晶粒尺寸随Ni厚度增加存在一极大值.在Ni层厚度为60nm时，能够获得晶粒尺寸均匀，晶粒大小为500—600nm，结晶质量良好的多晶锗硅薄膜. 关键词： 超高真空化学气相沉积 金属诱导 镍 多晶锗硅