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The junction properties of tunnel silicon oxide (SiOx) passivated contact (TOPCon) with n-type poly-Si on p-type c-Si wafer are characterized using current-voltage (J-V) and capacitance-voltage (C-V) measurements. The dark J-V curves show a standard diode characteristic with a turn-on voltage of ~0.63 V, indicating a p-n junction is formed. While the C-V curve displays an irregular shape with features of 1) a slow C increase with the decrease of the magnitude of reverse bias voltage, being used to estimate the built-in potential (Vbi), 2) a significant increase at a given positive bias voltage, corresponding to the geometric capacitance crossing the ultrathin SiOx, and 3) a sharp decrease to negative values, resulting from the charge tunneling through the SiOx layer. The C of depleting layer deviates from the normal linear curve in the 1/C2-V plot, which is caused by the diffusion of P dopants from the n-type poly-Si into the p-type c-Si wafer as confirmed by the electrochemical capacitance-voltage measurements. However, the 1/C2+γ-V plots with γ > 0 leads to linear curves with a proper γ and the Vbi can still be estimated. We find that the Vbi is the range of 0.75–0.85 V, increases with the increase of the doping ratio during the poly-Si fabrication process, and correlates with the passivation quality as measured by the reverse saturated current and implied open circuit voltage extracted from transient photoconductivity decay.  相似文献   
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本文主要对低压化学气相沉积(LPCVD)法制备N型高效晶硅隧穿氧化层钝化接触(TOPCon)电池工艺进行研究。分析LPCVD法制备隧穿氧化层及多晶硅层的影响因素,研究了不同氧化层厚度、多晶硅厚度及多晶硅层中P掺杂量对太阳能电池转换效率的影响。结果表明:当隧穿氧化层厚度在1.55 nm时,钝化效果最佳;多晶硅层厚度120 nm时Voc达到最高值;多晶硅层厚度在90 nm时Eff最高。当P掺杂量为3.0×1015 cm-2时可获得较高的Voc,原因是随着P掺杂量的增加,多晶硅层场钝化效果提高。  相似文献   
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Min Yue 《中国物理 B》2022,31(8):88801-088801
Monolithic perovskite/Si tandem solar cells (TSCs) have experienced rapid development in recent years, demonstrating its potential to exceed the Shockley-Queisser limit of single junction Si solar cells. Unlike typical organic-inorganic hybrid perovskite/silicon heterojunction TSCs, here we propose CsPbI3/TOPCon TSC, which is a promising architecture in consideration of its pleasurable thermal stability and good compatibility with current PERC production lines. The optical performance of CsPbI3/TOPCon TSCs is simulated by the combination of ray-tracing method and transfer matrix method. The light management of the CsPbI3/TOPCon TSC begins with the optimization of the surface texture on Si subcell, indicating that a bifacial inverted pyramid with a small bottom angle of rear-side enables a further minimization of the optical losses. Current matching between the subcells, as well as the parasitic absorption loss from the front transparent conductive oxide, is analyzed and discussed in detail. Finally, an optimized configuration of CsPbI3/TOPCon TSC with a 31.78% power conversion efficiency is proposed. This work provides a practical guidance for approaching high-efficiency perovskite/Si TSCs.  相似文献   
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本文对70 nm超薄多晶硅的掺杂工艺、钝化性能及光伏特性进行了研究。确定了70 nm超薄多晶硅的掺杂工艺,研究表明当离子注入剂量为3.2×1015 cm-3,在855 ℃退火20 min时,70 nm超薄多晶硅的钝化性能可以达到与常规120 nm多晶硅相当的水平,且70 nm多晶硅的表面掺杂浓度达到5.6×1020 atoms/cm3,远高于120 nm掺杂多晶硅的表面掺杂浓度(2.5×1020 atoms/cm3)。基于70 nm超薄多晶硅厚度减薄和高表面浓度掺杂的特点,较低的寄生吸收和强场钝化效应使得在大尺寸(6英寸)直拉单晶硅片上加工的N型TOPCon太阳能电池的光电转换效率得到明显提升,主要电性能参数表现为:电流Isc升高20 mA,串联电阻Rs降低,填充因子FF增加0.3%,光电转换效率升高0.13%。  相似文献   
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本文对TOPCon电池发射结的叠层钝化膜进行了研究,对比了3种不同叠层钝化膜(SiO2/SiNx、Al2O3(1.5 nm)/SiNx、SiO2/Al2O3(1.5 nm)/SiNx)的钝化性能。结果表明:Al2O3(1.5 nm)/SiNx的钝化性能优于SiO2/SiNx,SiO2/Al2O3(1.5 nm)/SiNx的钝化水平最佳,隐开路电压均值可达到705 mV。基于Al2O3/SiNx叠层膜研究了Al2O3厚度(1.5 nm、3 nm和5 nm)对钝化性能和电池转换效率的影响。当Al2O3厚度由1.5 nm增加到3 nm时,钝化性能得到明显提升,隐开路电压均值提高了20 mV,达到707 mV,对应电池的光电转换效率升高了0.23个百分点,与SiO2/Al2O3(1.5 nm)/SiNx叠层膜电池的转换效率持平。然而,当Al2O3厚度继续增加至5 nm时,隐开路电压均值保持不变。因此可以使用Al2O3(3 nm)/SiNx叠层膜代替SiO2/Al2O3(1.5 nm)/SiNx叠层膜,不仅简化了电池的工艺步骤,而且降低了生产成本。  相似文献   
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