纳米SiC蓝光发射的研究

在４．６８ｅＶ的激光激发下，室温ＣＶＤ合成的纳米ＳｉＣ粉体，可发射４７５ｎｍ的蓝光，经６００～１１００℃在Ｎ２气氛下进行快速退火（ＲＴＡ）处理，其荧光强度随退火温度升高而增强，当Ｔ≥９００℃时，荧光强度下降，但发光峰位与退火温度无关．通过ＸＲＤ、ＩＲ、ＴＥＭ、ＸＰＳ等研究，认为纳米ＳｉＣ中与氧有关的缺陷可能是引起４７５ｎｍ蓝光发射的主要原因     

The ferroelectric and ferromagnetic characterization of CoFe2O4/Pb(Mg1/3Nb2/3)O3-PbTiO3 multilayered thin films

The multiferroic (PMN-PT/CFO)_n (n = 1,2) multilayered thin films have been prepared on SiO₂/Si(1 0 0) substrate with LNO as buffer layer via a rf magnetron sputtering method. The structure and surface morphology of multilayered thin films were determined by X-ray diffraction (XRD) and atom force microscopy (AFM), respectively. The smooth, dense and crack-free surface shows the excellent crystal quality with root-mean-square (RMS) roughness only 2.9 nm, and average grain size of CFO thin films on the surface is about 44 nm. The influence of the thin films thickness size, periodicity n and crystallite orientation on their properties including ferroelectric, ferromagnetic properties in the (PMN-PT/CFO)_n multilayered thin films were investigated. For multilayered thin films with n = 1 and n = 2, the remanent polarization Pr are 17.9 μC/cm² and 9.9 μC/cm²; the coercivity H_c are 1044 Oe and 660 Oe, respectively. In addition, the relative mechanism are also discussed.     

Improvement of photoluminescence mechanism of CTA-treated Si-implanted SiO2 films by using RTA

In this paper, a shift in the photoluminescence (PL) peak from blue to near-infrared region was observed in the Si⁺-implanted 400-nm-thick SiO₂ films with the rapid thermal annealing (RTA) method only. As the Si⁺-fluence was 1×10¹⁶ ions/cm², a blue band was observed in the films after RTA at 1050 °C for 5 s in dry-N₂ atmosphere; then, the band shifted from blue to orange upon increasing the holding temperature of RTA to 1250 °C in the films after the isochronal RTA in dry N₂. Furthermore, while the fluence was increased to 3×110¹⁶ ions/cm² and the holding temperature was at the same range between 1050 and 1250 °C, the PL peak occurred between red and near-infrared regions. Although the RTA and conventional thermal annealing (CTA) methods produce a similar mechanism, the CTA method needs a much longer annealing-time and a higher Si⁺-implanted dose than the RTA method for producing the same shift and intensity of PL peak from the as-implanted sample. Therefore, the RTA method can produce the mechanism in the Si⁺-implanted sample with the PL energy between blue and near-infrared band in place of the CTA method.     

利用快速热退火法制备多晶硅薄膜

为了制备优质的多晶硅薄膜,该论文研究了非晶硅薄膜的快速热退火(RTA)技术.先利用PECVD设备沉积非晶硅薄膜,然后把其放入快速热退火炉中进行退火.退火前后的薄膜利用X射线衍射(XRD)仪、Raman光谱仪及扫描电子显微镜(SEM)测试其晶体结构及表面形貌,利用电导率测试设备测试其暗电导率.研究表明退火温度、退火时间以及沉积时的衬底温度对非晶硅薄膜的晶化都有很大的影响.     

Interest of Rapid Thermal Annealing (RTA) for the Elaboration of SnO2:Sb Transparent Conducting Oxide by the Sol-Gel Technique

Transparent Conducting Oxide (TCO) films of Sb doped SnO₂ have been successfully elaborated by us using the Sol-Gel Dip Coating (SGDC) technique. Good conductive and optical properties of such films depend on the densification and crystallisation of the SGDC deposits, which can be achieved by classical thermal procedures but such procedures are time consuming in case of multilayered films. Here are presented results of Rapid Thermal Annealing (RTA) of these films, which lead to good conductive properties even in the case of monolayered films.     

快速退火对大直径CZSi单晶中原生微缺陷的影响

本文利用快速退火对 8″直拉硅单晶片中的流动图形缺陷(FPDs)进行了研究.首先用Secco腐蚀液腐蚀了大直径直拉硅片,利用光学显微镜观察了FPDs的宏观分布,并用原子力显微镜(AFM)对原生FPDs的微观形貌进行观察,证明了 FPDs是一种空位型原生缺陷,然后采用了高温快速热处理,分别在N2、N2/O2(3;)、Ar三种气氛中对原生直拉单晶硅片进行了处理.对比退火前后FPDs密度的变化,分析了高温快速热处理对直拉硅单晶片中FPDs的影响,实验表明1200℃快速热处理180s可以显著降低硅片表面的FPDs.     

Influence of rapid thermal annealing on structure and interfacial characteristic of ZnO thin films

Highly C‐axis oriented ZnO thin film was manufactured by radio‐frequency magnetron sputtering technique on Si (111) substrate. The main objective was to study the influence of rapid thermal annealing (RTA) temperature on the structure and interfacial characteristic of ZnO thin films. X‐ray diffraction results showed that the ZnO thin films annealed at 600 °C by RTA technique had a perfect C‐axis preferred orientation compared to the other ZnO thin films, and the full width at half maximum of ZnO (002) rocking curve measurements indicted that the RTA‐annealed ZnO thin films possessed better crystal structure. Atom force microscopy displayed that the grain size of RTA‐annealed ZnO thin films was fine and uniform compared with the as‐deposited ZnO thin films, although the grains grew in RTA process and the root meant square roughness was smaller than that of as‐deposited films. High‐resolution transmission electron microscopy showed that there was an obvious amorphous layer between ZnO thin films and Si substrate, but the RTA‐annealed ZnO thin films exhibited larger and denser columnar structure and a preferred orientation with highly c axis perpendicular to the amorphous layer. Copyright © 2012 John Wiley & Sons, Ltd.     

富硅氮化硅薄膜的荧光发射

室温下在3．45eV的激光激发下,对950℃温度下淀积的LPCVD富硅的SiNx薄膜中,观测到5个高强度的可见荧光的发射。其峰位位置分别为2．7,2．69,2．4,2．3,2．1eV。通过TEM、IR、XPS等的分析研究表明,该样品为纳米硅镶嵌结构的a-SiNx：H复合膜,分析了其微结构的成因及其与膜内应力之间的相互关系。经过1000～1200℃快速退火(RTA)处理,原PL谱蓝移并只出现了峰位为3．0,2．8eV的两个紫蓝色荧光的发射,用能隙态模型对此结果做了初步的分析和讨论。认为薄膜中纳米硅团簇的密度、尺寸的变化和亚稳态缺陷态对其PL峰以及膜应力起着十分重要的作用。     

非晶Ni-Al阻挡层对快速退火制备的硅基Ba0.6Sr0.4TiO3薄膜结构及物性影响的研究

应用非晶Ni-Al薄膜作为扩散阻挡层,采用磁控溅射法和溶胶-凝胶法在Pt/TiO2/SiO2/Si(001)衬底上制备了Pt/Ni-Al/Ba0.6Sr0.4TiO3/Ni-Al/Pt电容器结构,研究了在650～800 ℃温度范围内快速退火(RTA)工艺对电容器结构和物理性能的影响.结果表明:在外加电场为-100 kV/cm时,700 ℃和750 ℃退火样品的介电常数达到最大,分别为150和170.非晶Ni-Al薄膜的应用可以有效地降低BST薄膜的漏电流密度.650 ℃退火样品在整个测试电场范围内满足欧姆导电机制;700 ℃、750 ℃和800 ℃退火样品分别在电压低于-3.67 V、-2.65 V和-2.14 V时满足欧姆导电机制,在电压高于-3.67 V、-2.65 V和-2.14 V时满足普尔-弗兰克导电机制.     

高温快速退火对重掺锑硅单晶中流动图形缺陷的影响

对大直径重掺锑硅单晶中流动图形缺陷（FPDs）进行了研究.利用高温快速退火工艺（RTA） ，将重掺锑硅片在N₂，Ar，H₂三种不同气氛下进行热处理，对退 火前后FPDs的密度变化进行了研究，分析了重掺锑硅单晶中FPDs在不同高温RTA过程中的热 稳定性.并从重掺杂原子锑与间隙氧之间的关系，分析了重掺锑硅片中FPDs在高温快速退火 工艺下的消除机制，认为重掺锑硅单晶中大量的锑原子，影响了硅片中间隙氧的浓度分布， 进而影响了原生微缺陷的形成及热行为. 关键词： 重掺锑硅单晶 快速退火（RTA） 流动图形缺陷（FPDs） 空洞缺陷