FTIR spectroscopy and radiative forcing of octafluorocyclobutane and octofluorocyclopentene

High-resolution (0.03 cm⁻¹) absolute infrared photoabsorption cross-sections of octafluorocyclobutane (c-C₄F₈) and octafluorocyclopentene (c-C₅F₈) have been measured using Fourier-transformed infrared (FTIR) spectroscopy at 279 and 297 K. Radiative forcing and global warming potential of these two species was estimated using the measured infrared cross section spectra.     

Fluorinated gases for semiconductor manufacture: process advances in chemical vapor deposition chamber cleaning

In the past several years, the semiconductor industry has been presented with various options for cleaning of plasma enhanced chemical vapor deposition (PECVD) tool chambers. In this paper, we assess the relative merits of the latest chamber cleaning processes. These processes will be compared on the overall cleaning performance (process throughput, efficiency of clean) the economic performance (gas usage, costs) and the environmental performance (perfluorocarbon (PFC) emissions). Direct comparisons between chemistries will be made whenever relevant process factors (e.g. tool type, film, analysis methods) are held constant.We have previously reported both laboratory and commercial CVD tool results comparing different chamber cleaning gases. These studies using both Novellus Concept-1 and AMAT P-5000 tools, indicated that a “drop-in” alternative such as octafluorocyclobutane (c-C₄F₈) would significantly lower PFC emissions (up to 85%) as well as decrease process costs through reductions in gas consumption. In this paper, we further extend this work to include qualification and implementation at chipmakers on a variety of tools, wafer sizes, and films. Key process data on film properties such as uniformity, number of particles, and thickness is also presented.The overall results support and extend the basic conclusions reached earlier: c-C₄F₈ has the lowest process cost of any cleaning gas, without any penalty in cleaning performance (process throughput) but most importantly, it also offers the lowest PFC emissions of any fluorocarbon-based process. It is a true drop-in alternative offering the unique win-win combination of improved environmental performance while also reducing processing costs.     

八氟环丁烷等离子体聚合物结构的ESCA和IR表征

采用外部电极电容耦合的等离子体聚合装置,以Ar、N_2H_2和Hc为等离子气体,在不同功率、压力、等离子气体及等离子气体对单体比率的反应条件下,在辉光放电中进行八氟环丁烷聚合。用电子能谱(ESCA)和红外光谱(IR)法对聚合物结构进行表征。发现聚合物中存在C、F、Si、O、N和H等六种元素,并对可能存在的基团进行探讨。通过对ESCA(C_18 谱的分析,研究了聚合物支化与交联程度对反应条件的依赖关系,及其和聚合与刻蚀竞争历程之间存在的内在联系。