Microstructure evolution during surface alloying of ductile iron and austempered ductile iron by electron beam melting

Alloying and microstructural modification of surfaces by electron beam has become popular to tailor the surface properties of materials. Surface modification of as-received ductile iron, Ni-plated ductile iron and Ni-plated austempered ductile iron was carried out by electron beam melting to improve the surface properties. Martensitic structure evolved in the heat affected zone and ledeburite structure was produced in the molten zone of the ductile iron. Microhardness of the melted specimens enhanced considerably as compared to the as-received samples. However the microhardness of melted Ni-plated samples is lower than that of the unplated specimens. X-ray diffraction clearly revealed the formation of an austenite and Fe₃C phases in the electron beam molten zone. The broadening of peaks suggests refinement of the microstructure as well as internal stresses generated during electron beam melting.     

石英玻璃光纤表面化学镀镍

采用化学镀的方法在石英玻璃光纤表面上制备了光亮、均匀、可焊性好的镍镀层；在光纤表面粗化后增加热处理工序可以克服石英光纤表面难以活化的问题。     

Electroless Ni-plating on PTFE fine particles

A Ni electroless plating process was used with polytetrafluoroethylene (PTFE) fine particles (25–500 μm). Using nonionic hydrocarbon surfactant, PTFE particles were dispersed in the plating bath. The PTFE hydrophobicity was sufficiently high that Ni was deposited partly on the PTFE surface in the initial step. The Ni-PTFE particles were formed into the Ni-PTFE plate by heat treatment at 350 °C after pressing. The Ni-PTFE plate had electrical conductivity and gas permeability, which were influenced by the pore distribution in the plate. Pores with 1 μm diameter might be especially important to impart high gas permeability to the Ni-PTFE plate.     

镀镍光纤Bragg光栅温度传感特性实验研究

在光纤智能金属结构材料中,为了保护光纤Bragg光栅并使得传感器与基体金属有很好的结合性,在光纤Bragg光栅表面化学镀镍,并实验研究了化学镀镍前后的光纤Bragg光栅的温度传感特性.实验表明：镀镍后的光纤光栅的Bragg波长随温度变化呈现出良好的线性和重复性,Bragg光栅温度灵敏度变大.     

蚀刻金属铝箔覆型制备Ni-P微阵列材料及析氢电催化性能研究

以蚀刻金属铝箔为模板,用化学镀制备了具有微米阵列结构的Ni-P合金材料,使用扫描电镜、能量散射谱及X-射线衍射等表征手段对所得材料的微观形貌与物质组成进行了分析,并通过电化学方法研究了化学镀温度、施镀时间对材料析氢催化活性的影响。结果表明,70℃制得的Ni-P微阵列材料作电极其析氢过电位最小,电流密度为15m A/cm2时比光面Ni-P镀层下降了约100m V;同时表现出最高的交换电流密度13.53×10-6A/cm2,高出光面Ni-P镀层近1个数量级;70℃施镀4h能够得到析氢过电位较低且结构完整的镀层,延长镀时没有继续提升其性能。为直观衡量材料的催化活性,在双室槽中进行了光解水析氢测试。Ni-P微阵列材料表现出良好的催化活性,析氢速率较光面电极上升约200%。