Analysis of the filling capability to the microstructures in micro-injection molding

Micro-injection molding is an important fabrication process for polymer plastics with micro-features. In micro-injection molding of products with microstructures, the ability for the polymer melt to flow into the microstructures is a crucial factor for successful molding. An analytical model in micro-injection molding is constructed in this research. It has been reported that most of the filling in microstructure is done during the packing pressure. In this analytical model, the temperature of the polymer melt near the entrance of the microstructure at the end of mold filling is estimated first. With the temperature, we can calculate the injection distance into the microstructures of the mold insert during the packing stage. The model is compared with experimental results, and shows the feasibility. The experiment uses the LIGA-like lithography process to define the micro-feature and a micro-electroforming method to form the mold insert with the replicated micro-feature. The injection distance into the microstructures predicted by this analytical model shows reasonable result as compared to the experimental measurement.     

Laser Molding in Polymeric Materials Using Femto-Second Laser Pulse and Replication via Electroforming

The upheaval structure on the surface of polymer induced by the irradiation of a near-infrared (NIR) femto-second laser pulse in polymer bulk was investigated. Copolymers, such as poly(acrylonitrile-styrene) (AS) and poly(acrylonitrilebutadiene-styrene-methyl methacrylate) (ABSM) produced upheaval structures with a flattop just like the crater of a volcano, whereas homopolymers with relatively high glass transition temperature (T_g), such as polycarbonate (PC) and polyether imide (PEI) were more often formed a bell-shaped upheaval structure. A micro-lens effect was observed for the bell-shaped upheaval structure, but that effect was not observed in the case of copolymers with a flattop structure. Replication of the bell-shaped upheaval structure in PC was carried out by electroforming (non-electrolytic plating of Ni and the following electrolytic plating of Ni) and potting approximately 30 wt% THF solution of AS copolymer. A micro-scale bell-shaped upheaval structure in PC induced by a laser pulse was replicated using a Ni mother mold with suitable precision, and the replicated bell-shaped structure also showed a micro-lens effect.     

Effects of ultrasonic agitation on adhesion strength of micro electroforming Ni layer on Cu substrate

Micro electroforming is an important technology, which is widely used for fabricating micro metal devices in MEMS. The micro metal devices have the problem of poor adhesion strength, which has dramatically influenced the dimensional accuracy of the devices and seriously limited the development of the micro electroforming technology. In order to improve the adhesion strength, ultrasonic agitation method is applied during the micro electroforming process in this paper. To explore the effect of the ultrasonic agitation, micro electroforming experiments were carried out under ultrasonic and ultrasonic-free conditions. The effects of the ultrasonic agitation on the micro electroforming process were investigated by polarization and alternating current (a.c.) impedance methods. The real surface area of the electroforming layer was measured by cyclic voltammetry method. The compressive stress and the crystallite size of the electroforming layer were measured by X-ray Diffraction (XRD) method. The adhesion strength of the electroforming layer was measured by scratch test. The experimental results show that the imposition of the ultrasonic agitation decreases the polarization overpotential and increases the charge transfer process at the electrode–electrolyte interface during the electroforming process. The ultrasonic agitation increases the crystallite size and the real surface area, and reduces the compressive stress. Then the adhesion strength is improved about 47% by the ultrasonic agitation in average. In addition, mechanisms of the ultrasonic agitation improving the adhesion strength are originally explored in this paper. The mechanisms are that the ultrasonic agitation increases the crystallite size, which reduces the compressive stress. The lower the compressive stress is, the larger the adhesion strength is. Furthermore, the ultrasonic agitation increases the real surface area, enhances the mechanical interlocking strength and consequently increases the adhesion strength. This work contributes to fabricating the electroforming layer with large adhesion strength.     

Numerical simulations and electrochemical experiments of the mass transfer of microvias electroforming under ultrasonic agitation

This paper explores the mass transfer mechanism of microvias electroforming under ultrasonic agitation by numerical simulations and electrochemical experiments. Firstly, the velocity distribution of electroforming solution inside the microvias under ultrasound treatment is simulated by COMSOL Multiphysics software. The ultrasonic frequency is that of 120 kHz. The ultrasonic powers are 100 W, 200 W, 300 W and 400 W, respectively. The simulation results indicate that the mean liquid velocity inside the microvias increases with the increasing of acoustic power. In addition, under a certain ultrasonic power, the mean liquid velocity will decrease with increasing the distance between microvias and transducer, the aspect ratio of microvias and the distance between cathode and central position. Secondly, electrochemical experiments are presented to investigate the effect of ultrasonic agitation on the electrode kinetics of microvias electroforming. It is found that ultrasonic treatment decreases the thickness of diffusion layer, increases the limiting diffusion current densities and further enhances the mass transfer of microvias electroforming. Compared with the silent condition, the diffusion layer thicknesses with the acoustic power of 100 W, 200 W, 300 W, 400 W are decreased by 50.0%, 64.1%, 69.3% and 74.5%, respectively. Finally, according to the results above, the 200 × 200 metal micro-column array structures are fabricated by ultrasonic electroforming under the condition of 120 kHz and 200 W. The metal micro-column is 250 μm high and has a diameter of 80 μm. The results show that ultrasonic electroforming can enhance the mass transfer of microvias electroforming, and further solve the problem of porous structure in electroforming layer. This work contributes to expanding the application of ultrasonic agitation in the microvias electroforming.     

Reducing the residual stress in micro electroforming layer by megasonic agitation

In order to reduce the large residual stress in micro elelctroforming layer, megasonic assisted electroforming is proposed here. Micro electroforming experiments were performed with and without megasonic agitation, respectively. Four different megasonic power densities were applied to investigate the influence of megasonic agitation on reducing the residual stress. The residual stress was measured by X-ray diffraction (XRD) method. Experiment results show that the residual stresses fabricated with megasonic agitation are less than that fabricated without megasonic. When the megasonic power density is 2 W/cm², the residual stress can be the minimum value of −125.7 MPa, reduced by 60% in comparison with the value of −315.1 MPa electroformed without megasonic agitation. For exploring the mechanism of megasonic agitation on reducing the residual stress, the dislocation density and crystal orientation were calculated by the single-line Voigt profile analysis and Relative Texture Coefficient (RTC) method, respectively. The diameters and distributions of pits on the surface of electroforming layer were observed by the STM-6 tool microscope and counted by the Image-Pro Plus software. It reveals that one hand of the mechanism is the acoustic streaming produced by megasonic can strengthen the motion of dislocation in crystal lattice and makes the crystal lattices grow towards the equilibrium shape, which is benefit to crystallization with low residual stress. When the megasonic power density is 2 W/cm², the dislocation density increases to be the maximum value of 8.09 × 10¹⁵ m⁻² and the difference between RTC_{(1 1 1)} and RTC_{(2 0 0)} decreases to be zero, which is consistent with the residual stress results. The other hand is that the stable cavitation produced by megasonic can provide residual stress release points during the electroforming process.     

高聚物微流控芯片镍阳模的简易加工技术

提出了一种简便快速制作高聚物微流控芯片镍阳模的新方法。采用抛光镍片作为电铸基底,涂覆SU-8光胶层后,光刻得到SU-8微结构。以镍基片作为阳极,用16～30A/dm2的电流密度电解刻蚀5min,清除SU-8微结构间隙底部镍片表面的氧化物,并刻蚀得到10～20μm深的凹坑,有效地提高了随后电沉积镍结构和基底镍片间结合力。利用SU-8微结构作为电铸模板,以镍基片作为阴极,电铸5h后制得了微结构倾角为83°深宽比较大的镍阳模。实现了在普通化学实验室中长寿命镍阳模的制作。用热压法制得500多片聚甲基丙烯酸甲酯(PMMA)聚合物芯片,并成功用于DNA片段的分离。     

Transport and luminescence phenomena in electroformed silicon nitride-based light emitting diode

Abstract

Hydrogenated amorphous silicon nitride-based heterojunction pin diode was electroformed under sufficiently high forward bias stress leading to its instant nanocrystallization at room temperature. In order to investigate the origin of the accompanying bright visible light emission, current-voltage and electroluminescence (EL) characteristics of the electroformed diode were scanned over temperature. Electrical transport mechanism was analysed in the low, medium and high electric field regimes. Temperature and field dependence of thermal activation energy were discussed. EL characteristics were studied using the spectral energy distribution and the injection current dependence of its intensity. Thermal quenching data of EL and photoluminescence intensities were compared. Finally, the relationship between the electrical transport and luminescence phenomena was attempted to be interpreted within the frame of a self-consistent model.     

X波段PBG加速结构的数值模拟和加工研究

利用3D电磁场模拟计算软件, 对X波段的金属PBG加速结构进行了模拟计算. 设计了11.42GHz的光速段行波加速腔, 并进行了耦合器调配的计算和模拟. 最后, 研究了电铸加工的方法, 并通过模拟计算给出了加工公差.     

Enhancing the adhesion strength of micro electroforming layer by ultrasonic agitation method and the application

Micro electroforming is widely used for fabricating micro metal devices in Micro Electro Mechanism System (MEMS). However, there is the problem of poor adhesion strength between micro electroforming layer and substrate. This dramatically influences the dimensional accuracy of the device. To solve this problem, ultrasonic agitation method is applied during the micro electroforming process. To explore the effect of the ultrasonic agitation on the adhesion strength, micro electroforming experiments were carried out under different ultrasonic power (0 W, 100 W, 150 W, 200 W, 250 W) and different ultrasonic frequencies (0 kHz, 40 kHz, 80 kHz, 120 kHz, 200 kHz). The effects of the ultrasonic power and the ultrasonic frequency on the micro electroforming process were investigated by polarization method and alternating current (a.c.) impedance method. The adhesion strength between the electroforming layer and the substrate was measured by scratch test. The compressive stress of the electroforming layer was measured by X-ray Diffraction (XRD) method. The crystallite size of the electroforming layer was measured by Transmission Electron Microscopy (TEM) method. The internal contact surface area of the electroforming layer was measured by cyclic voltammetry (CV) method. The experimental results indicate that the ultrasonic agitation can decrease the polarization overpotential and increase the charge transfer process. Generally, the internal contact surface area is increased and the compressive stress is reduced. And then the adhesion strength is enhanced. Due to the different depolarization effects of the ultrasonic power and the ultrasonic frequency, the effects on strengthening the adhesion strength are different. When the ultrasonic agitation is 200 W and 40 kHz, the effect on strengthening the adhesion strength is the best. In order to prove the effect which the ultrasonic agitation can improve the adhesion strength of the micro devices, micro pillar arrays were fabricated under ultrasonic agitation (200 W, 40 kHz). The experimental results show that the residual rate of the micro pillar arrays is increased about 17% by ultrasonic agitation method. This work contributes to fabricating the electroforming layer with large adhesion strength.     

Electroluminescence and N2 laser excited fluorescence of high field electroformed castor oil and liquid paraffin

The method of preparation of electroluminescent (el) cells using dielectric liquids like castor oil and liquid paraffin by an electroforming process is presented. Theel spectrum of the material derived from castor oil exhibits a large number of sharp lines which can be grouped into four distinct series superposed on a broad background. Theel spectrum of liquid paraffin cells does not show any significant line features. The N₂ laser excited fluorescence spectra of these oils and of the respective electroformed materials are also recorded. The electrical and brightness characteristics of these cells are discussed in detail.