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针对中大规模红外焦平面对高速读出的需求,研究并设计了一款20MPixel/s红外焦平面高速读出电路。读出电路单元电路由电容负反馈运放输入级、相关双采样、源随输出级电路组成,总线输出级采用基于低功耗推挽运放的跟随器结构。研究了输出级运放像元信号建立时间和负载电容的关系,给出了20 MPixel/s高速读出的负载电容适用范围。采用0.5μm Mixed Signal CMOS工艺研制了一款红外焦平面高速读出电路芯片,和InGaAs光敏芯片耦合后实测读出速率达到20MPixel/s,像元信号之间最大上升时间为17ns。  相似文献   
3.
Previously, we demonstrated a large format 1024 × 1024 corrugated quantum well infrared photodetector focal plane array (C-QWIP FPA). The FPA has a cutoff at 8.6 μm and is BLIP at 76 K with f/1.8 optics. The pixel had a shallow trapezoidal geometry that simplified processing but limited the quantum efficiency QE. In this paper, we will present two approaches to achieve a larger QE for the C-QWIPs. The first approach increases the size of the corrugations for more active volume and adopts a nearly triangular pixel geometry for larger light reflecting surfaces. With these improvements, QE is predicted to be about 35% for a pair of inclined sidewalls, which is more than twice the previous value. The second approach is to use Fabry–Perot resonant oscillations inside the corrugated cavities to enhance the vertical electric field strength. With this approach, a larger QE of 50% can be achieved within certain spectral regions without using either very thick active layers or anti-reflection coatings. The former approach has been adopted to produce two FPAs, and the preliminary experimental results will be discussed. In this paper, we also describe using voltage tunable detector materials to achieve multi-color capability for these FPAs.  相似文献   
4.
A new CMOS readout circuit for VO2-based uncooled FPAs is presented in this paper. The on-chip readout circuit consists of three major parts: An input circuit of BCDI structure, a column-shared integration circuit of CTIA structure, and a common CDS output circuit. The simple configuration of the input circuit makes it possible to operate more circuits in parallel, and increases the integration time and number of pixels, the column-shared integration circuit which is suitable for small pixel size provides low noise, high gain, a highly stable detector bias, and high photon current injection efficiency, and the common CDS output circuit is utilized to reduce or eliminate low-frequency noise of the readout circuit. An experimental readout chip for 50-μm-pitch 32×32 element VO2-based uncooled FPAs has been fabricated. The measurement results of the fabricated readout chip have successfully verified its readout function and excellent performance.  相似文献   
5.
We propose a novel sub circuit model to simulate HgCdTe infrared photodiodes in a circuit simulator, like PSPICE. We have used two diodes of opposite polarity in parallel to represent the forward biased and the reverse biased behavior of an HgCdTe photodiode separately. We also connected a resistor in parallel with them to represent the ohmic shunt and a constant current source to represent photocurrent. We show that by adjusting the parameters in standard diode models and the resistor and current values, we could actually fit the measured data of our various HgCdTe photodiodes having different characteristics. This is a very efficient model that can be used for simulation of readout integrated circuit (ROIC) for HgCdTe IR photodiode arrays. This model also allows circuit level Monte Carlo simulation on a complete IRFPA at a single circuit simulator platform to estimate the non-uniformity for given processes of HgCdTe device fabrication and Si ROIC fabrication.  相似文献   
6.
Monolithic integration method has been demonstrated to increase the fill factor of the infrared focal plane arrays (IRFPA). Which is consists of 256×256 Pt-Si schottky barrier charge coupled devices(CCD) operation in 3-5m IR region. The relative silicon 256×256 element diffractive microlens arrays have been fabricated on the back side of the substrate of the IRFPA using binary optics technology. The aligning process between IRFPA and microlens arrays on each side of the substrate has been completed by IR mask aligner. The testing results show that the imaging quality is very good and the average optical response of the IR FPA is increased by a factor of 3.0, which is improved by about 25% compared with the hybrid integration method in the previous work.  相似文献   
7.
非制冷铁电混合式焦平面探测器新研究   总被引:1,自引:1,他引:0  
胡旭  黄承彩  太云见  蔡毅 《光子学报》2005,34(11):1685-1687
本文报道一种128×128元铁电非制冷混合式焦平面探测器,涉及该器件的混合式结构.分析了影响器件性能的关键因素,给出器件所采用的铁电材料的基本物理和电学特性参数,器件的热隔离技术和相应参数,读出电路的基本结构和性能.对实验数据所涉及的原理进行了讨论,最后给出了利用该器件得到的清晰红外热像.  相似文献   
8.
本文对读出原理、像差要求、图谱质量进行深入研究,进而对读出技术进行深度整合与简化,实现光读出FPA红外成像系统小型化、轻量化、集成化。首先,从FPA的热-机械效应出发,介绍了光读出FPA红外成像系统的工作原理;然后,针对通常采用的光读出FPA红外成像系统体积大、重量大、结构复杂缺陷,提出了高集成度的新型光读出系统;接着,在分析讨论读出光路像差容限、特点的基础上,对以异形棱镜为核心元件的光读出系统进行了具体的光学仿真设计;最后,设计了集光、机、电、软技术的集成式光读出FPA红外成像系统。对系统样机测试结果表明:在确保成像性能的前提下,光读出FPA红外成像系统的体积减小到175 mm×83 mm×105 mm。以异形棱镜为核心元件的光读出技术,在满足成像精度和灵敏度的前提下,可减小读出系统的复杂程度,有效降低了光读出FPA红外成像系统的体积和重量,从而促进光读出FPA成像系统的工业化应用。  相似文献   
9.
High-level ab initio electronic structure calculations up to the CCSD(T) theory level, including extrapolations to the complete basis set (CBS) limit, resulted in high precision energetics of the tautomeric equilibrium in 2-substituted acetaldehydes (XH2C-CHO). The CCSD(T)/CBS relative energies of the tautomers were estimated using CCSD(T)/aug-cc-pVTZ, MP3/aug-cc-pVQZ, and MP2/aug-cc-pV5Z calculations with MP2/aug-cc-pVTZ geometries. The relative enol (XHC?=?CHOH) stabilities (ΔE e,CCSD(T)/CBS) were found to be 5.98?±?0.17, ?1.67?±?0.82, 7.64?±?0.21, 8.39?±?0.31, 2.82?±?0.52, 10.27?±?0.39, 9.12?±?0.18, 5.47?±?0.53, 7.50?±?0.43, 10.12?±?0.51, 8.49?±?0.33, and 6.19?±?0.18?kcal?mol?1 for X?=?BeH, BH2, CH3, Cl, CN, F, H, NC, NH2, OCH3, OH, and SH, respectively. Inconsistencies between the results of complex/composite energy computations methods Gn/CBS (G2, G3, CBS-4M, and CBS-QB3) and high-level ab initio methods (CCSD(T)/CBS and MP2/CBS) were found. DFT/aug-cc-pVTZ results with B3LYP, PBE0 (PBE1PBE), TPSS, and BMK density functionals were close to the CCSD(T)/CBS levels (MAD?=?1.04?kcal?mol?1).  相似文献   
10.
李珂  王学伟  王世立 《应用光学》2012,33(6):1138-1141
为了增加红外凝视焦平面阵列探测器成像仿真的置信度,对探测器所存在的空间采样效应产生机理进行了分析,并且从空间域角度对其进行了建模,借助于基于图像像素处理的方法进行实验仿真;为了客观地评价空间采样效应对探测器成像质量的影响,定义了图像的负指数型平滑度,实验结果表明,叠加空间采样效应后探测器输出图像的平滑度减小了11.7%,图像局部波动变大,从而验证了红外探测器成像仿真中空间采样效应考虑的必要性。  相似文献   
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