Evaluation of 1.0 mm i.d. column performances on ultra high pressure liquid chromatography instrumentation

The present study focuses on the evaluation of 1.0 mm i.d. (internal diameter) columns on a commercial Ultra-High Pressure system. These systems have been developed specifically to operate columns with small volumes, typically 2.1 mm i.d., by reducing extra-column volume dispersion. The use of columns with smaller i.d. results in a reduced solvent consumption and required sample volume. The evaluation of the columns was carried out with samples containing neutral and pharmaceutical compounds. In isocratic mode, the extra-column volume produced additional band broadening leading to poor performances compared to equivalent 2.1 mm i.d. columns. By increasing the length of the column, the influence of the extra-column bandspreading could be reduced and 75,000 plates were obtained when four columns were coupled. In gradient mode, the effect of the extra-column contribution on efficiency was limited and about 80% of the performance of the 2.1 mm i.d. columns was obtained. Optimum conditions in gradient mode were further investigated by changing flow rate, gradient time and column length. A different approach of the calculation of peak capacity was also considered for the comparison of the influence of these different parameters.     

Optical mm-wave generation by using external modulator based on optical carrier suppression

In this paper, we have theoretically investigated the transmission performance of the optical millimeter (mm)-wave generated by using an external modulator based on optical carrier suppression for the first time. According to our theory, the data signals carried by the optical mm-wave are transmitted in the dispersion fiber without fading but are degraded greatly because of the time shift of the code edges, which still limits the transmission distance. The experimental results agree well with our theory.     

A dielectric rod waveguide coupled with metal rectangular waveguide

Measurements have been done in the millimeter wave region on a composite waveguide which comprises a dielectric rod waveguide connecting two metal rectangular waveguides. Such a waveguide has been used by us in a Josephson harmonic mixer installed in a small metal cryostat, to prevent the thermal invasion from outside environment and to transmit both signal and LO waves with small losses. The measured transmission loss, that is caused mainly by the coupling loss between metal rectangular waveguides (TE₁₀ mode) and a dielectric rod waveguide (HE₁₁ mode), has been less than 2dB in the frequency range of 52–104 GHz.     

DSB optical mm-wave with signal only on optical carrier generated by embedded LiNbO3 Mach-Zehnder modulator

We have investigated the generation of the 40-GHz double-sideband optical millimeter (mm)-wave with signal carried only by its optical carrier via an embedded LiNbO₃ Mach-Zehnder modulator (LN-MZM). Since the optical carrier and its two first-order sidebands are dominant and their powers are well balanced, the first-order harmonic in the photocurrent gets maximal. As the optical mm-wave signal is transmitted along the fiber, there is no code outline distortion because the signal is only modulated on the optical carrier. Although the first-order harmonic shows the periodical fading effect when the optical mm-wave signal is transmitted along the fiber, its degradation on the radio-over-fiber link can be avoided by adjusting the position of the fading nodes via varying the main MZM bias voltage, and the signal still keeps much good eye diagram even after 50-km fiber transmission. The experimental results prove our theory.     

3 mm波段回旋速调管放大器设计与粒子模拟

设计了一支3 mm 波段基波回旋速调管,该回旋速调管工作在低损耗的TE01模式,包含四个谐振腔。首先使用线性理论确定工作参数的大致范围, 然后采用HFSS软件设计单个谐振腔,通过调整谐振腔尺寸和腔壁介质层参数使谐振腔的谐振频率和Q值符合设计要求, 最后使用粒子模拟程序优化设计了回旋速调管的互作用电路,研究了谐振腔参差调谐方案, Q值对回旋速调管性能的影响, 互作用电路的稳定性以及电子注参数变化对注-波互作用性能的影响。PIC粒子模拟结果表明,在电子注电压65 kV, 电流6 A, α(V⊥/V∥)1.5, 工作磁场3.6 T时,回旋速调管的3 dB带宽约为600 MHz,在93.7 GHz获得139 kW 的峰值输出功率,效率为35.6%,增益为28.4 dB。模拟中没有考虑电子注速度零散的影响。     

Calorimetric studies on the electrorefining process of copper

Calorimetric measurements were carried out on the electrorefining of copper using different current densities with a Calvet type microcalorimeter at room temperature. The ratio (R) of the measured heat (Q _m orW _m) to the input electric energy (Q _in orW _in) and the excess heat (Q _ex orW _ex), i.e. the difference betweenQ _m (orW _m) andQ _in (orW _in) during the electrorefining process were discussed in terms of general thermodynamics. It was found thatR andQ _ex were related to the current density employed in the experiment and varied as a logarithmic function. The results obtained here indicate that the heat generation under different conditions, such as different currents or voltages, may be caused partially by the irreversibility of the process or by some unknown processes.Dedicated to Prof. Menachem Steinberg on the occasion of his 65th birthdayThe authors would like to acknowledge the extreme encouragements and help of Professor Shuyi Liu (University of Science and Technology of China) and Professors Fu Tan and Guoquan Liu (Institute of Chemistry, Academia Sinica).This study was supported by the National Nature Science Foundation of China.     

Finite strain stress fields near the tip of an interface crack between a soft incompressible elastic material and a rigid substrate

We present a numerical study of finite strain stress fields near the tip of an interface crack between a rigid substrate and an incompressible hyperelastic solid using the finite element method (FEM). The finite element (FE) simulations make use of a remeshing scheme to overcome mesh distortion. Analyses are carried out by assuming that the crack tip is either pinned, i.e., the elastic material is perfectly bonded (no slip) to the rigid substrate, or the crack lies on a frictionless interface. We focus on a material which hardens exponentially. To explore the effect of geometric constraint on the near tip stress fields, simulations are carried out under plane stress and plane strain conditions. For both the frictionless interface and the pinned crack under plane stress deformation, we found that the true stress field directly ahead of the crack tip is dominated by the normal opening stress and the crack face opens up smoothly. This is also true for an interface crack along a frictionless boundary in plane strain deformation. However, for a pinned interface crack under plane strain deformation, the true opening normal stress is found to be lower than the shear stress and the transverse normal stress. Also, the crack opening profile for a pinned crack under plane strain deformation is completely different from those seen in plane stress and in plane strain (frictionless interface). The crack face flips over and the tip angle is almost tangential to the interface. Our results suggest that interface friction can play a very important role in interfacial fracture of soft materials on hard substrates.