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底部充填是一种用来提高电子产品在恶劣环境下工作的稳定性及可靠性的技术,是电子制造产业的常用方法．本文基于细观力学方法建立了计算底部充填封装芯片热应力的方法．针对底部充填封装芯片焊锡-充填物接合层的结构特点,我们建立了接合层的均一化模型,并从理论上推导了接合层的等效弹性常数、热膨胀系数和导热系数．运用该均一化模型,我们对封装芯片工作产热导致的热传导和热应力问题进行了有限元数值模拟,计算的结果与接合层未均一化的模型具有较好的一致性,而计算效率极大提高,显示了该方法在计算底部充填封装芯片热应力方面的可行性． 相似文献
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A laminate weakened by multiple elliptical holes of arbitrary distribution, arbitrary orientation and arbitrary dimensions, is treated as an anisotropic, infinite, multiple connected thin plate. By Faber series expansion [1–6] and a complex potential method in the plane theory of thermo-elasticity of an anisotropic body, the general step to deduce the thermostress concentration in the laminate subjected to arbitrary mechanical and thermal loads is obtained.Supported by The Chinese Science Foundation of Aeronautics 相似文献
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