Photoelastic stress freezing analysis of total shoulder replacement systems

Photoelastic stress freezing analyses in the orthopaedic literature have, in the past, been limited to studies where bone-on-bone, bone-on-metal or ultra-high molecular weight polyethylene (UHMWPE)-on-metal constructs are modeled. In these cases photoelastic plastics are used to simulate either bone or UHMWPE as it interacts with a metal implant. In joints such as the shoulder, a UHMWPE component is often cemented directly into the scapula's glenoid concavity using polymethylmethacrylate (PMMA). While a photoelastic material can be used to simulate bone with proper load scaling, UHMWPE and PMMA have very different mechanical properties at elevated stress freezing temperatures as compared within vivo body temperature. In this study, materials were identified such that proper scaling of elastic properties at elevated temperatures was utilized to simulate the metal-UHMWPE-PMMA-bone construct. Stresses on orthogonal planes throughout the glenoid were compared for two different UHMWPE component anchoring geometries (keeled and pegged). High stresses were found at the neck of the glenoid and also at the component-bone interface beneath simulated PMMA inclusions.     

Photoelasticity in quasicrystals

The maximum number of non-vanishing and independent second order photoelastic coefficients required by the seven pentagonal and the two icosahedral point groups 5(C₅), (S₁₀), (C_5h ), m2(D_5h ), 52(D₅), 5m(C_5v ), 2m(D_5d ); 235(I), 2/m (I _h )—that describe the quasicrystals symmetry groups in two and three dimensions—is obtained. The schemes of non-vanishing and independent coefficients have been calculated and listed. Finally the results of this group-theoretical study are briefly discussed.     

Digital photoelasticity of glass: A comprehensive review

The recent advances in digital photoelasticity have made it possible to use it conveniently for the stress analysis of articles and components made of glass. Depending on the application, the retardation levels to be measured range from a few nanometres to several thousand nanometres, which necessitates different techniques and associated equipments. This paper reviews the recent advances in the photoelasticity of glass with a focus on the techniques/methods developed in the last decade. A brief introduction to the residual stress in glass is provided initially to bring out its tensorial nature. The subsequent sections are organised thematically rather than chronologically, for better readability and easy access of information.     

Stress evaluation of Through-Silicon Vias using micro-infrared photoelasticity and finite element analysis

The Through-SiliconVias (TSV) is a key component of three dimensional electronic packaging. Obtaining its stresses is very important for evaluating its reliability. A micro-infrared photoelasticity system with a thermal loading function was built and applied to characterize the stresses of the TSV structure. Through testing it was found that the stress of each TSV is different even if their fabrication technology is exactly the same, that different TSVs obtain their stress free states at different elevated temperatures, and that their stress free states are maintained even when the temperature is further elevated. A finite element model was used to quantitatively determine the stresses of a TSV under different stress-free temperatures. Different virtual photoelasticity fringe patterns were then created based on the principle of photoelasticity and the simulated stresses. Comparing the virtual fringe patterns with the experimental pattern, an appropriate virtual photoelasticity fringe pattern and the corresponding stresses of TSV were determined     

用动态光弹性法研究炮身膛线的脱落问题

本文利用动态光弹性法研究了炮膛膛线脱落的机理。用包含五条膛线的部分炮筒横截面或扇形平面模型,在六种不同的载荷状态下进行了实验。得到了不同载荷状态下,不同瞬时的等差线条纹图的系列照片,以及膛线根部不同瞬时的应力分布曲线。结果表明:当一条或相邻数条膛线顶端受到足够大的均布冲击载荷时,将在承载膛线两侧根部的应力极值点出现膛线脱落的起裂点,而形成八字形脱落;而对非均布的其它几种冲击载荷,膛线都不会出现八字形脱落。     

应力波和动光弹等差条纹的分析与判读

介绍了动光弹的基本原理，并从理论上回答了动光弹应用中的一些问题，如惯性力可否忽略等．并在总结回顾动光弹等差条纹级次判读方法的基础上，提出了把应力波理论与等差条纹分析判读相结合的方法，这样不仅使条纹判读的概念更清晰，而且可提高条纹分析和级次判读的准确性．     

模型外载与自重并存变动外载的光弹性分析法

提出一个变动模型外载，分析大模型在外载与自重共同作用时的尤弹性法。它与用离心力模拟自重试验的传统方法完全不同，只要在大模型上变动外载，就可以获得上述两种载荷共同作用下的应力分析结果。此法避免了用离心模型自重受模型尺寸限制等诸多因素影响的缺点，为自重不可的大型复杂空间工程结构模型试验应力分析提出了一条新的途径。文中给出了本方法的基本原理及其简要的实验验证和工程应用结果。     

用动光弹性法研究材料引入的分配层对应力波传播的影响

本文用动态光弹性模拟试验分析方法，观察和分析研究了材料不同的分配层对应力波在结构中传播的影响，比较分析了冲击荷载产生的应力波在洞室结构顶部的传播及相互过程，得到指定点处的应力—时间关系曲线，为结构震塌机理的进一步的研究和防护结构的改进提供参考。     

COUPLED VARIATIONAL PRINCIPLES AND GENERALIZED COUPLED VARIATIONAL PRINCIPLES IN PHOTOELASTICITY

ＦｕＢａｏｌｉａｎ（付宝连）（ＲｅｃｅｉｖｅｄＮｏｖ．２２，１９９３；ＣｏｍｍｕｎｉｃａｔｅｄｂｙＣｈｉｅｎＷｅｉｚａｎｇ）ＣＯＵＰＬＥＤＶＡＲＩＡＴＩＯＮＡＬＰＲＩＮＣＩＰＬＥＳＡＮＤＧＥＮＥＲＡＬＩＺＥＤＣＯＵＰＬＥＤＶＡＲＩＡＴＩＯＮＡＬＰＲＩ...     

An experimental study of impact-induced failure events in homogeneous layered materials using dynamic photoelasticity and high-speed photography

The generation and the subsequent evolution of dynamic failure events in homogeneous layered materials that occur within microseconds after impact were investigated experimentally. Tested configurations include three-layer and two-layer, bonded Homalite specimens featuring different bonding strengths. High-speed photography and dynamic photoelasticity were utilized to study the nature, sequence and interaction of failure modes. A series of complex failure modes was observed. In most cases, and at the early stages of the impact event, intra-layer failure (or bulk matrix failure) appeared in the form of cracks radiating from the impact point. These cracks were opening-dominated and their speeds were less than the crack branching speed of the Homalite. Subsequent crack branching in several forms was also observed. Mixed-mode inter-layer cracking (or interfacial debonding) was initiated when the intra-layer cracks approached the interface with a large incident angle. The dynamic interaction between inter-layer crack formation and intra-layer crack growth (or the so-called “Cook–Gordon Mechanism”) was visualized for the first time. Interfacial bonding played a significant role in impact damage spreading. Cracks arrested at weak bonds and the stress wave intensity was reduced dramatically by the use of a thin but ductile adhesive layer.