聚异酰亚胺树脂合成条件的优化

采用不同溶剂制备了苯乙炔基封端的聚异酰亚胺树脂,探讨了不同处理温度对聚异酰亚胺树脂(PⅡ)和相应的聚酰亚胺树脂(PⅠ)的熔体粘度及溶解性的影响。结果表明,不同处理温度对PⅡ的熔体黏度影响不大,但对溶解性有一定的影响,PⅡ在NMP和THF中具有良好的溶解性能。在相同处理温度条件下,PⅡ的熔体黏度低于PⅠ。随处理温度的增加,PⅡ低聚物的T5%随之增加,PⅡ在110℃处理的T5%为208℃,150℃处理的T5%为323℃,180℃处理的T5%为382℃,PⅡ固化后的T5%为550℃,显示出较优异的耐热性能。     

FTIR investigation of cross-linking and isomerization reactions of acetylene-terminated polyimide and polyisoimide oligomers

The interrelationship between the cross-linking and isoimide-imide isomerization reactions of oligomeric isoimides and imides was investigated using FTIR spectroscopy. It was found that cross-linking of the acetylene units of Thermid IP-600 retarded the local rearrangement of the isoimide to imide conversion of Thermid IP-600 compared with an aniline-terminated analog, decreasing the rate constant by a factor of about 2. The increased flexibility of both the isoimide (Thermid IP-600) and imide (Thermid FA-700) oligomers increased the cross-linking rate of the acetylene end groups by a factor of 4 and 2, respectively, over that of the more rigid imide oligomer (MC-600). With increasing conversion of the isoimide to imide linkages in Thermid IP-600, the kinetic parameters, E_α and in A, for the cross-linking reaction of this oligomer became the same as those for the oligomeric imide, Thermid MC-600. © 1994 John Wiley & Sons, Inc.