Oxidation kinetics of thin copper films and wetting behaviour of copper and Organic Solderability Preservatives (OSP) with lead-free solder

The oxide formation on thin copper films deposited on Si wafer was studied by XPS, SEM and Sequential Electrochemical Reduction Analysis SERA. The surfaces were oxidized in air with a reflow oven as used in electronic assembly at temperatures of 100 °C, 155 °C, 200 °C, 230 °C and 260 °C. The SERA analyses detected only the formation of Cu₂O but the XPS analysis done for the calibration of the SERA equipment proved also the presence of a CuO layer smaller than 2 nm above the Cu₂O oxide. The oxide growth follows a power-law dependence on time within this temperature range and an activation energy of 33.1 kJ/mol was obtained. The wettability of these surfaces was also determined by measuring the contact angle between solder and copper substrate after the soldering process. A correlation between oxide thickness and wetting angle was established. It was found that the wetting is acceptable only when the oxide thickness is smaller than 16 nm. An activation energy of 27 kJ/mol was acquired for the spreading of lead free solder on oxidized copper surfaces.From wetting tests on copper surfaces protected by Organic Solderability Preservatives (OSP), it was possible to calculate the activation energy for the thermal decomposition of these protective layers.     

高温超导带材焊接接头电阻研究

针对高温超导一代Bi2223/Ag带材、二代YBCO带材的焊接问题,理论计算分析了搭接长度、焊锡层厚度对带材接头电阻的影响,并对焊接长度对接头电阻的影响进行了实验验证。实验结果表明:增加焊接搭接长度可以减小接头电阻,两种超导带材的接头电阻皆同焊接搭接长度成反比。当焊接长度在3—5cm,焊料厚度在微米量级时,Bi2223/Ag带材、YBCO带材各自之间的接头电阻在液氮温度下均可控制在10-8Ω左右,能够满足超导装置稳定运行的要求。     

Laser soldering of flip-chips

A novel process for laser soldering of flip-chips on transparent printed circuit board assemblies is presented. The experiments were carried out on silver test patterns printed on glass wafers using a roller-type gravure offset printing method. The contact pads, where the bumps of the flip-chips are positioned, were covered with a thin layer of additional solder paste. The aligned samples (solder pad—solder paste—chip bump) were illuminated through the glass substrate using an Ar⁺ laser beam (, , at 1/e) to heat the printed pad and melt the solder paste, thus forming a joint between the printed pad and the chip bump. The heat-affected zone was modeled using computer-assisted finite element method. The solder joint cross-sections were analyzed using optical and electron microscopy as well as energy dispersive X-ray element analyses. The laser-soldered joints were of good mechanical and electrical quality and the process proved to be suitable for manufacturing customized circuit prototypes.     

Vibration characteristics of aluminum surface subjected to ultrasonic waves and their effect on wetting behavior of solder droplets

The vibration characteristics of an aluminum surface subjected to ultrasonic waves were investigated with a combination of numerical simulation and experimental testing. The wetting behavior of solder droplets on the vibrating aluminum surface was also examined. The results show that the vibration pattern of the aluminum surface is inhomogeneous. The amplitude of the aluminum surface exceeds the excitation amplitude in some zones, while the amplitude decreases nearly to zero in other zones. The distribution of the zero-amplitude zones is much less dependent on the strength of the vibration than on the location of the vibration source. The surface of the liquid solder vibrates at an ultrasonic frequency that is higher than the vibration source, and the amplitude of the liquid solder is almost twice that of the aluminum surface. The vibration of the surface of the base metal (liquid solder) correlates with the oxide film removal effect. Significant removal of the oxide film can be achieved within 2 s when the amplitude of the aluminum surface is higher than 5.4 μm or when the amplitude of the liquid solder surface is higher than 10.2 μm.     

超导芯片铟焊质量试验研究

为考察超导芯片接地钎焊质量,参照电子元器件试验方法相关国家标准,模拟超导器件工作温度和真空环境制作了试验装置,对钎焊后的超导芯片样品进行了温度冲击试验、完整超导器件系列环境试验,并对试验数据和结果进行了分析。     

The advances and characteristics of high-power diode laser materials processing

This paper presents a review of the direct applications of high-power diode lasers for materials processing including soldering, surface modification (hardening, cladding, glazing and wetting modifications), welding, scribing, sheet metal bending, marking, engraving, paint stripping, powder sintering, synthesis, brazing and machining. The specific advantages and disadvantages of diode laser materials processing are compared with CO₂, Nd:YAG and excimer lasers. An effort is made to identify the fundamental differences in their beam/material interaction characteristics and materials behaviour. Also an appraisal of the future prospects of the high-power diode lasers for materials processing is given.     

Paramagnetic behaviour of silver nanoparticles generated by decomposition of silver oxalate

Silver oxalate Ag₂C₂O₄, was already proposed for soldering applications, due to the formation when it is decomposed by a heat treatment, of highly sinterable silver nanoparticles. When slowly decomposed at low temperature (125 °C), the oxalate leads however to silver nanoparticles isolated from each other. As soon as these nanoparticles are formed, the magnetic susceptibility at room temperature increases from −3.14 10⁻⁷ emu.Oe⁻¹.g⁻¹ (silver oxalate) up to −1.92 10⁻⁷ emu.Oe⁻¹.g⁻¹ (metallic silver). At the end of the oxalate decomposition, the conventional diamagnetic behaviour of bulk silver, is observed from room temperature to 80 K. A diamagnetic-paramagnetic transition is however revealed below 80 K leading at 2 K, to silver nanoparticles with a positive magnetic susceptibility. This original behaviour, compared to the one of bulk silver, can be ascribed to the nanometric size of the metallic particles.     

Ultrasonic soldering in electronics

Ultrasonic (US) soldering of electronic components, as an alternative to flux soldering, is environmentally friendly, improves the quality of soldered connections at the mounting elements after long-term storage, and allows the use of lead-free solders. Methods of US solder melt activation, lead-free solders in US soldering and glass-ceramic capacitor metallization processes have been investigated.     

20kA高温超导电流母线本体的绕制和实验

系统描述了20kA、5米长高温超导电流母线本体的绕制、焊接及实验。超导母线本体设计采用成熟的均流技术设计,在自主开发的专用绕线机上进行绕制。超导线采用B i2223/Ag多芯不锈钢加强带材。在超导带材与端部焊接过程中采用新的焊接技术,保证了超导性能不退化和减小接触电阻。对绕制的超导母线本体进行了直流实验。实验结果表明,两端端部接触电阻小于10nΩ,超导母线的临界电流大于32kA,满足设计指标要求。     

高温超导带材Bi-2223/Ag的焊接接头电阻研究

针对高温超导带材Bi-2223/Ag的焊接问题进行了研究.利用ANSYS建立焊接接头电阻特性的有限元计算模型,仿真和计算分析了焊料材料、搭接长度和焊锡层厚度对接头电阻值的影响,并进行了实验验证.实验表明:可通过减少焊料厚度,增加焊接搭接长度来减少接头电阻,当焊接长度在2～5cm,焊料厚度为0.5mm时,Bi-2223/...