新型聚芳醚酮的研究进展

文章主要介绍了聚芳醚酮的合成路线与性质,讨论了对其改性的方向和进展,如共聚共混改性,在聚芳醚酮的主链中引入大的侧基破坏其规整性,以及研制含氟的新型聚合物。     

侧链含萘可交联聚芳醚酮的合成及性能

以4,4'-二羟基苯基正戊酸和4,4'-二氟二苯酮为原料, 二甲基亚砜(DMSO)为溶剂, 采用亲核取代反应合成侧基含羧基的聚芳醚酮均聚物, 进一步与1-萘酚和2-萘酚接枝制备新型含萘可交联聚芳醚酮. 用核磁共振(NMR)、红外光谱(FTIR)、示差扫描量热(DSC)和热重分析(TGA)表征其结构和性能, 含萘聚芳醚酮在常用有机溶剂如N,N-二甲基乙酰胺(DMAc)、DMSO, 四氢呋喃(THF)中有良好的溶解性, 并具有很好的成膜性. DSC测试结果显示, 在170℃热处理2 h的交联聚合物的玻璃化转变温度(T_g)提高40℃. TGA数据显示接枝后的聚合物的5%热失重温度提高40~50℃, 证明其发生交联反应. 结果表明, 新型含萘可交联聚芳醚酮具有热固性树脂的耐溶剂和耐高温特性, 进一步拓宽了聚芳醚酮的应用前景.     

Design and synthesis of a tribranched phenylethynyl‐terminated aryl ether compound and its use as a reactive diluent for PETI‐5

In this study, a tribranched, phenylethynyl‐terminated aryl ether compound (Tri‐PE‐PAEK) was synthesized. This novel star‐shaped compound exhibits a good combination of properties, such as a low melting temperature (252 °C) and good solubility in aprotic solvents, as well as a low melt viscosity (0.1 P at 280 °C). All these advantages make it a good candidate material for modern processing techniques such as resin infusion and resin transfer molding, which are the most favorable methodologies for current economical manufacturing of polymer matrix/carbon fiber composites. Furthermore, after undergoing thermal curing to yield a network at 370 °C for 1 h, a cured sample exhibited an unexpectedly higher glass transition temperature (370 °C), storage modulus retention above the glass transition temperature, and good thermal stability. In addition, this compound can be used as a reactive diluent for phenylethynyl‐terminated imide oligomer, which has the molecular weight of 5000 g/mol (PETI‐5) to reduce its viscosity and lower the minimum temperature of the minimum viscosity. Meanwhile, the toughness of a cured blended resin can be greatly increased with the addition of just 10% Tri‐PE‐PAEK to PETI‐5. Further loading levels of Tri‐PE‐PAEK in the blending would lead to a higher storage modulus and a higher mechanical strength without compromising the thermal stability. © 2007 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 45: 4844–4854, 2007     

新型低介电常数聚芳醚酮的合成及性能研究

近年来,随着对高分子材料功能化研究的深入,合成了许多具有特殊性能的聚芳醚酮．聚芳醚酮是一类综合性能优异的半结晶性特种工程塑料,在分子链中引入氟官能团可降低聚合物的介电常数．然而,不对称强极性氟的引入增加了聚合物分子的极性,不利于进一步降低介电常数,且在高温加工时容易放出氟化氢．因此,无氟、低氟的低介电高分子材料将会有很好的发展前景．     

新型含硅聚芳醚酮的合成与表征

聚醚醚酮（PEEK）因其具有优异的机械性能、耐热性和耐化学腐蚀性等而被广泛应用于航空航天、电子器件和机械仪表等领域，由于聚醚醚酮的结构特点决定其具有极好的耐溶剂性，只在浓硫酸等极少数溶剂中可以溶解，但随着应用目的和应用环境的不同，需要有可以溶解在一定溶剂中的聚醚醚酮材料。     

一类含联二萘结构的新型聚芳醚酮类刚性大环及其二聚体的合成与表征

通过一定的分子设计,利用一种全新的双酚单体(4-氯代苯基对苯二酚)和含有联二萘结构的双氟三聚体(BNDIF)经一步法合成环状齐聚物,制得了一类含有氯代苯基侧基和联二萘结构的新型聚芳醚酮类刚性大环;并通过氯苯基的催化偶联反应得到了该类刚性大环的二聚体(一类含有2个联二萘结构的新型结构双环齐聚物).利用MALDI-TOFMS和1HNMR及H-HCOSY分析,证明了目标产物的结构.