Phenylethynyl-terminated Imide Oligomers Modified by Reactive Diluent for Resin Transfer Molding Application

To meet the processing requirements of resin transfer moulding(RTM)technology,reactive diluent containing m-phenylene moiety was synthesized to physically mixed with phenylethynyl terminated cooligoimides with well-designed molecular weights of 1500-2500 g/mol derived from 4,4’-(hexafluoroisopropylidene)diphthalic anhydride(6 FDA),3,4’-oxydianiline(3,4’-ODA)and m-phenylenediamine(m-PDA).This blend shows low minimum melting viscosity(<1 Pa·s)and enlarged processing temperature window(260–361℃).FPI-R-1 stays below 1 Pa·s for2 h at 270℃.The relationship between the molecular weight of the blend and its melting stability was first explored.Blending oligoimides with lower molecular weights exhibit better melting stability.Upon curing at 380℃for 2 h,the thermosetting polyimide resin demonstrates superior heat resistance(T_g=420-426℃).     

含芳基均三嗪环耐高温低聚酰亚胺的合成与性能

通过调控聚合单体的摩尔配比,合成了一系列新型的不同分子链长度的邻苯二甲腈封端含二氮杂萘酮联苯结构低聚酰亚胺,通过FTIR、1H-NMR、WAXD和元素分析对其结构进行表征.以4,4′-二氨基二苯砜为催化剂,低聚物经常压下固化交联后,得到含芳基均三嗪环结构的热固性聚酰亚胺.低聚物表现了良好的溶解性能,可溶于N-甲基-2-...