Phase transformation of Ni-B, Ni-P diffusion barrier deposited electrolessly on Cu interconnect

In this paper, we report that the phase transformation of Ni-B, Ni-P diffusion barriers deposited electrolessly on Cu, for the reason that the Ni-P layer is a more effective diffusion barrier than the Ni-B layer. The Ni₃B crystallized was decomposed to Ni and B₂O₃ above 400 °C and the Ni₃P crystallized was decomposed to Ni and P₂O₅ above 600 °C respectively in Ar atmosphere. Also, the Ni₃B was decomposed to Ni and free B above 400 °C and the Ni₃P was decomposed to Ni and free P above 600 °C respectively in H₂ atmosphere. The decomposed Ni formed a solid solution with Cu. The Cu diffusion occurred above 400 °C for Ni-B layer and above 600 °C for Ni-P layer, respectively. Because the decomposition temperature of Ni-P layer is about 200 °C higher than that of Ni-B layer, the Ni-P layer is a more effective barrier for Cu than the Ni-B layer.     

Surface free energies of electroless Ni–P based composite coatings

Surface free energy of a solid surface gives a direct measure of intermolecular interactions at interfaces and has a strong influence on adsorption and adhesion behaviour. However few data are available for the surface free energies of electroless Ni–P based composition coatings. In this paper, the electroless Ni–P, Ni–P-surfactant, Ni–Cu–P, Ni–P–PTFE and Ni–Cu–P–PTFE composite coatings were prepared under various coating conditions. The chemical compositions, surface morphology and thickness of the coatings were measured using an energy dispersive X-ray microanalysis (EDX), a scanning electron microscope (SEM) and a digital micrometer respectively. The contact angles of water, diiodomethane and ethylene glycol on the coatings were measured automatically using dataphysics OCA-20 contact angle analyser. The surface free energy of the coatings and their components (e.g. dispersion, polar or acid/base portions) were calculated using various methods. The experimental results showed that the incorporation of surfactant or PTFE particles into Ni–P matrixes has a significant influence on the surface free energy of the coatings, while the incorporation of copper into Ni–P matrixes has no significant influence on the surface free energy of the coatings.     

Preparation and microwave absorption properties of electroless Co-Ni-P coated strontium ferrite powder

A new type of Co-Ni-P coated strontium ferrite nanocomposite was prepared with electroless plating enhanced by ultrasonic wave at room temperature. The plating process was studied carefully. The morphology, crystal structure and microwave absorption properties of the Co-Ni-P coated powder were studied with field emission scanning electron microscopy (FE-SEM), X-ray diffraction (XRD), energy dispersive analysis of X-rays (EDX) and vector network analyzer. The results show that the strontium ferrite powder was successfully coated with Co-Ni-P alloy and possesses excellent microwave absorption properties. The maximum microwave loss of the composite powder reaches −44.12 dB. The bandwidth with the loss above −10 dB exceeds 13.8 GHz.     

代铬刷镀层的耐腐蚀机理的考察

对新型的代铬刷镀层Ni-Fe-W-P-S进行了耐腐蚀性能机理的分析研究。用扫描电镜(SEM)、透射电镜(TEM)、扫描隧道显微镜(STM)、X射线衍射及电子能谱(XPS)等的分析表明，基体组织为非品结构是代铬刷镀层优异耐腐蚀性的主要原因.     

铜在HOPG上电沉积过程的现场ECSTM研究

用自制的电化学扫描隧道显微镜（ＥＣＳＴＭ）现场研究Ｃｕ在ＨＯＰＧ上的电沉积过程．结果表明Ｃｕ在ＨＯＰＧ上的电沉积为三维成核的过程．当电位较低或Ｃｕ２＋离子浓度较低时，铜在本体金属生长主要沿着台阶方向．过电位较高时，铜的成核数目增加，沉积层的晶粒有所细化．同时，非现场ＥＣＳＴＭ比较研究表明，ＳＴＭ针尖对针尖局部区域的电沉积起屏蔽作用，针尖所在区域Ｃｕ的沉积速度比其它区域明显减小     

烟酸对酸性硫酸盐体系铜电沉积的影响

对溶液A: 0.8 mol•L－1硫酸铜,0.6 mol•L－1硫酸,5.0×10－5 mol•L－1氯离子,1.0×10－4 mol•L－1聚乙二醇的溶液,溶液B:在溶液A中加入2.0×10－2 mol•L－1烟酸,pH为0.5,运用循环伏安和计时安培法研究玻碳电极上铜的电沉积行为.结果表明,铜的电沉积过程经历了晶核形成过程,其电结晶按瞬时成核和三维生长方式进行.烟酸的加入对铜的电沉积具有阻化作用,但不改变铜的电结晶机理.沉积层的X射线衍射表明Cu为面心立方结构,在烟酸存在下沉积层出现(220)高择优取向,这可能是烟酸在Cu(220)晶面上发生强烈吸附作用的结果.     

A surface adsorption model for electroless cobalt alloy thin films

Thin cobalt alloy films have been obtained using electroless deposition solution with two reducing agents: dimethylamine borane (DMAB) and sodium hypophosphite. This system allows spontaneous and self-activated deposition of barrier layers on Cu lines and via contacts for ultra large scale integration (ULSI) interconnects applications. This work presents a study of the solution composition effects on the material properties and composition of the films. First, we present the deposition rates, the electrical resistance, the various element profiles in the thin film, and the thin film roughness. Next, we discuss the film’s composition and its dependence on the ratio between the reducing agents composition in the solution. The experimental results suggest that the film phosphorous and boron composition is determined by the surface adsorption rates of the reducing agents. Therefore, a surface co-adsorption model of the two reducing agents is proposed, formulated, analyzed, and compared to the experimental results. Finally, we discuss the model and its significance to the formation of high-quality ultra-thin barrier layers. Dedicated to Professor Dr. Algirdas Vaskelis on the occasion of his 70th birthday.     

加速剂对化学镀镍层组成与结构的影响

加速剂对化学镀镍层组成与结构的影响方景礼，武勇，韩克平，张敏（南京大学应用化学研究所配位化学国家重点实验室南京２１００９３）关键词化学镀镍，Ｎｉ０Ｐ合金，加速剂，硫脲化学镀镍磷合金具有耐蚀性、可焊性、厚度均匀和硬度高等优点，已得到广泛应用。为提高生产...     

化学镀非晶态Ni—P层的初期沉积过程研究

化学镀非晶态Ｎｉ－Ｐ镀层初期沉积过程和沉积层状态是影响结合强度的决定性因素．对不同基体材料初期沉积的观察发现，有些非晶态镀层的初期沉积中含有微晶．微晶的产生与否与基体材料以及镀层材料晶格的错配度有关，当镀层与基体材料点阵常数相差不大，镀层的初期沉积沿基体晶格外延生长出现微晶层，反之，点阵常数相差较大时，初期沉积物中未发现微晶．     

Simultaneous deposition of Ni nanoparticles and wires on a tubular halloysite template: A novel metallized ceramic microstructure

Tubular halloysite can be used as a template to fabricate a novel metallized ceramic microstructure through electroless plating. Reduction of Pd ions by methanol is conducted to initiate Ni plating. There is a simultaneous deposition of Ni nanoparticles on the outer surface and discontinuous wires in the lumen site of the halloysite template obtained. The different deposition could be caused by the different composition distribution of ferric oxide impurity in the wall due to the isomorphic substitution during the formation of halloysite template. Its magnetic property is mainly attributed to the Ni nanoparticles, not the wires. The metallized ceramic microstructure has the potential to be utilized as a novel magnetic material.