c轴定向氮化铝薄膜的制备

利用电子回旋共振 (ECR)微波增强化学气相沉积法 (PECVD)并使用氮气 (N2 ) ,氩气 (Ar)和AlCl3蒸气作为气源在直径为 6 .35cm的 (10 0 )单晶硅片表面制备了c轴定向氮化铝 (AlN)薄膜 ,并使用X射线衍射仪及其X射线特征能谱和扫描电镜 (SEM)分析了薄膜特征 ,研究了微波功率、基板温度和N2 流量对薄膜c轴定向的影响 ,得到了c轴偏差角小于 5°的高质量大面积AlN薄膜。     

Hybrid electron cyclotron resonance-radio-frequency plasma etching of III–V semiconductors in Cl2-based discharges. Part I: GaAs and related compounds

A systematic study has been performed of the dry etching characteristics of GaAs, Al_0.3Ga_0.7As, and GaSb in chlorine-based electron cyclotron resonance (ECR) discharges. The gas mixtures investigated were CCl₂F₂/O₂, CHCl₂F/O₂, and PCl₃. The etching rates of all three materials increase rapidly with applied RF power, while the addition of the microwave power at moderate levels (150 W) increases the etch rates by 20–80%. In the microwave discharges, the etch rates decrease with increasing pressure, but at 1 m Torr it is possible to obtain usable rates for self-bias voltages 100 V. Of the Freon-based mixtures, CHCl₂F provides the least degradation of optical (photoluminescence) and electrical (diode ideality factors and Schottky barrier heights) properties of GaAs as a result of dry etching. Smooth surface morphologies are obtained on all three materials provided the microwave power is limited to 200 W. Above this power, there is surface roughening evident with all of the gas mixtures investigated.     

Dry etching of InGaP and AlInP in CH4/H2/Ar

Electron cyclotron resonance (ECR) plasma etching with additional rf-biasing produces etch rates 2,500 A/min for InGaP and AlInP in CH₄/H₂/Ar. These rates are an order of magnitude or much higher than for reactive ion etching conditions (RIE) carried out in the same reactor. N₂ addition to CH₄/H₂/Ar can enhance the InGaP etch rates at low flow rates, while at higher concentrations it provides an etch-stop reaction. The InGaP and AlInP etched under ECR conditions have somewhat rougher morphologies and different stoichiometries up to 200 Å from the sur face relative to the RIE samples.     

2.45GHz ECR 强流等离子体源核心部件设计与实验研究

电子回旋共振(Electron Cyclotron Resonance,ECR)等离子体源能产生高电荷态离子、高流强的单电荷态离子,提供稳定的束流和良好的重复性.核心部件的设计对ECR等离子体源是至关重要的,磁场对等离子体的生成和分布有直接影响,良好的磁场可以提高等离子体的性能和效率.采用有限元分析方法对ECR等离子体源磁场进行分析与设计,得到了满足设计需求与目标的磁场位形,通过高斯计对设计的永磁环轴向磁场精确测量,发现磁场仿真结果与实验结果吻合比较好,只是轴向磁场最大值及对应位置上有点偏差.通过集成实验,研究核心部件对离子源引出束流强度的影响,引出束流稳定且强度达到7 m A.     

源气体对沉积的a-C∶F∶H薄膜结构的影响

采用微波电子回旋共振等离子体化学气相沉积(MWPECRCVD)方法,使用不同的源气体(CHF3CH4,CHF3C2H2,CHF3C6H6)体系制备了aC∶F∶H薄膜.由于CH4,C2H2,C6H6气体在等离子体中的分解反应不同导致了薄膜的沉积速率和结构上的差异.红外吸收谱的结果表明,用C6H6CHF3作为源气体沉积的薄膜中几乎不含H,而用C2H2CHF3所沉积的薄膜中的含氟量最高,其相应的CF振动峰位向高频方向偏移.薄膜的真空退火结果表明,aC∶F∶H薄膜的热稳定性除了取决于薄膜的CC键浓度外,还与CC键 关键词： 氟化非晶碳膜 电子回旋共振化学气相沉积 红外吸收光谱     

微波电子回旋共振等离子体增强化学气相沉积法沉积氟化非晶碳薄膜的研究

使用三氟甲烷和苯的混合气体,利用微波电子回旋共振等离子体增强化学气相沉积法制备了F/C比在0.11—0.62之间的α-C∶F薄膜.研究了微波功率对薄膜沉积和结构的影响,发现微波功率的升高提高了薄膜的沉积速率,降低了薄膜的F/C比,也降低了薄膜中CF和CF₃基团的密度,而使CF₂基团的密度保持不变.在高微波功率下可以获得主要由CF₂基团和C=C结构组成的α-C∶F薄膜.薄膜的介电频率关系(1×10³—1×10⁶Hz)和损耗频率关系(1×10²—1×10⁵Hz)均呈指数规律减小,是缺陷中心间简单隧穿引起的跳跃导电所致.α-C∶F薄膜的介电极化主要来源于电子极化 关键词： 氟化非晶碳薄膜 ECR等离子体沉积 键结构 介电性质     

电偏转扫描法测量高电荷态ECR源发射度

成功地研制了一套适合于低能离子束流发射度测量的电偏转扫描探测器.对该探测器的原理和结构作了较详细的描述,并给出该探测器对兰州近代物理研究所高电荷态ECR源LECR3引出离子束流发射度的测量结果.典型结果为:在引出高压为15.97kV,引出束流为190μA时,O⁴⁺水平发射度(x方向)为137πmm·mrad,垂直发射度(y方向)为120πmm·mrad(包括90%束流).最后,对测量结果作了一些分析和讨论.     

SECRAL等离子体韧致辐射谱的测量

The axial emitted bremsstrahlung spectra were measured on SECRAL(Superconducting ECR ion source with Advanced design in Lanzhou)using an HPGe detector.The spectral temperature T_(spe) was obtained from the linear fit of the spectra in the semi-log present.The evolution of T_(spe) with microwave power and magnetic field configuration is investigated in this paper.     

为IBA C70回旋加速器设计研制的采用Cusp场型H-离子源与产生He束的ECR离子源的双束轴向注入系统

At the moment,a 70MeV cyclotron is under construction by the IBA company.This cyclotron will be able to accelerate H~- beam from a multicusp source and with a beam intensity in the range of 10mA at the source extraction.A He~(1 2 ) beam is also required.This beam will be produced by a PANTECHNIK ECR ion source(SUPERNANOGAN)with an extracted current of 1 to 2mA.In this paper the studies and design of the two sources with a common axial injection in the cyclotron are described.     

用于ECR离子源的超导磁体——设计与制造

Superconducting magnets are widely used in ECR ion sources.The intensity and form of the magnetic field plays an important role in the way towards higher performance sources.During the development steps,the design principles and geometries had to be adapted to reach higher fields using state-of-the-art technologies and design tools.Production,assembly,and tests of these superconducting magnets are presented and a short outlook on possible future developments is given.