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排序方式: 共有193条查询结果,搜索用时 31 毫秒
1.
A series of unsaturated polyesters based on phthalic anhydride (PHA), maleic anhydride (MA), ethylene glycol (EG), diethylene glycol (DG), triethylene glycol (TG), propylene glycol (PG), styrene (Sty) and acrylonitrile (AN) were prepared. The molecular weights of the prepared polyesters were determined by end-group analysis. The effect of the structure of the resin on its curing behavior has been investigated. On the basis of the experimental study, the following were concluded: (1) The maximum curing temperature (Tmax) is related to the molecular weight of the glycol incorporated in these castings. In this context the Tmax was found to decrease with increasing the molecular weight. Meanwhile the time to peak temperature tmax was increasing. (2) The higher the percentage of AN in the crosslinking monomer system, the slower a resin cures. (3) The values of Tmax were found to be influenced to a large extent by the percentage of AN. 相似文献
2.
This paper describes basic studies of the surface modification of polyimide covered wires for insulation of electrical machines. Drain-off of the impregnating resin during production should be reduced by introduction of surface catalytic groups. 1H NMR kinetic analysis of aminolytic ring opening reaction of low molecular model compounds for polyimides showed very fast modification reactions. The catalytic effect of various functional groups on unsaturated polyester imide, acrylate and epoxy resins was investigated by DSC. Co(II)-catalysts and tertiary aliphatic amines proved highest activity for double bond containing systems and epoxy resins, respectively. Aminolytic treatment of Kapton® slides was followed by ATR-IR spectroscopy. Plate-plate rheometer measurements of epoxy resins employing tertiary amine-treated Kapton® slides proved significantly reduced gelling temperature. 相似文献
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4.
Norman S. Allen 《Journal of photochemistry and photobiology. A, Chemistry》1996,100(1-3):101-107
The radiation curing industry is one of the most rapidly developing fields in the entire coatings industry. The low toxicity, cheapness, speed, control and ease of formulation and operation are some of the main advantages of this growing technology. UV and/or visible light radiation is used to induce photochemical polymerization or crosslinking of a monomer, oligomer or prepolymer formulation containing a certain type of unsaturation, such as an acrylic group, and an appropriate initiator. The latter is used to absorb the light energy and transform it into active species, such as radicals or ions, capable of inducing such reactions. Applications extend to general coatings for paper, board, wood, tapes, compact discs and holograms, inks, photoresists for imaging processes and adhesives for welding and sealing in electronic circuit boards. The photoinitiator is the key to the control of these processes and, in recent years, has seen many new developments. These include the need for water-soluble, co-reactive and polymeric structures with low migration rates, as well as cheaper UV/ visible sensitizers with enhanced speed. New and effective cationic systems are also on the scene and, although expensive, are attracting significant academic and commercial interest. 相似文献
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A kind of aziridine crosslinkers was synthesized and used to crosslink acrylate copolymers. The crosslinkingproperties and curing kinetics of the resin were studied. It was found that with the increase of the content of crosslinker in theemulsion, the mechanical properties and solvent resistance of the resin will be apparently improved, but its glass transitiontemperature (T_g) is very low. The lowest amount of crosslinker used in the acrylic resin emulsion is 0.25%. Curing kineticsstudied by DSC show that this curing reaction occurs readily because the apparent activation energy of the reaction is low(65.1 kJ/mol). These results demonstrate that the aziridine crosslinker is indeed a low temperature crosslinking agent and canbe used at room temperature. 相似文献
7.
Diglycidyl ether of 4,4′-dihydroxybiphenol (BPDGE) is a liquid crystalline epoxy. The biphenyl epoxy (diglycidyl ether of 3,3′,5,5′-tetramethyl-4,4′-biphenyl, TMBPDGE) has found great applications in plastic encapsulated semiconductor packaging. Phenol novolac (PN) was used as curing agent. The reaction kinetics of BPDGE/PN and TMBPDGE/PN systems in the presence of triphenylphosphine (TPP) were characterized by an isoconversional method under dynamic conditions using differential scanning calorimetry (DSC) measurements. The results showed that the curing of epoxy resins involves different reaction stages and the values of activation energy are dependent on the degree of conversion. The effects of curing temperature on their phase structure have been investigated with polarized optical microscopy and Wide-angle X-ray diffraction. With proper curing process, BPDGE showed a nematic phase when cured with PN. 相似文献
8.
苯并噁嗪中间体/蛭石插层纳米复合物热固化行为的研究 总被引:4,自引:0,他引:4
通过对双酚A型苯并嗪中间体 (BOZ A) 蛭石插层纳米复合物固化过程的分析表明长链烷基铵阳离子对BOZ A的热开环聚合反应没有表现出催化作用 ,也不影响纳米复合物的结构形态 .不同蛭石含量的插层纳米复合物 ,在形成不同纳米分散状态的纳米复合物的过程中 ,蛭石晶片对BOZ A的热开环聚合具有明显不同的阻碍作用 ,蛭石含量为 3%的插层纳米复合物 16 0℃的凝胶化时间较纯树脂延长约 7min ,活化能升高约8kJ mol,固化反应热焓降低约 14J g ,使得固化物的固化程度较纯树脂降低约 7%~ 10 % ,阻碍作用最大 ,其它含量的次之 相似文献
9.
聚氧硫杂蒽树脂固化特性及其动力学的研究 总被引:12,自引:0,他引:12
以DSC、TG等技术手段研究了聚氧硫杂蒽树脂 (POSPF)的固化特性及其动力学 .结果表明 ,用六次甲基四胺 间二氯苄作固化剂 ,加热至 10 5~ 2 2 5℃能使POSPF树脂固化 ,在固化过程树脂中的活性羟甲基和固化剂参与反应生成亚甲基桥从而形成网状体型结构 ;动态DSC曲线上出现宽的固化放热峰 ,用T β外推法确定其凝胶温度Ti=10 0 0℃、固化温度Tp=181 5℃、后固化温度Tf=2 2 5 7℃ .固化后树脂具有优良的耐热性 ,失重 5 %时热分解温度高达 4 0 3℃ . 相似文献
10.
M Suguna LakshmiB.S.R Reddy 《European Polymer Journal》2002,38(4):795-801
New epoxide and cyanate ester resins with an aromatic ester backbone namely 1,3-[di-(4-glycidyloxy diphenyl-2,2′-propane)]-isophthalate (DGDPI) and 1,4-[di-(4-cyanato diphenyl-2,2′-propane)]-terephthalate (DCDPT) were synthesized and the intermediates were characterized by IR, 1H-/13C-NMR spectroscopic methods. The cured products from DGDPI and DHDPI exhibited higher Tg compared with standard epoxy system. The increase in the Tg may be due to the cyanate ester and rigid aromatic backbones present in the curing system. 相似文献