InSb薄膜热导率温度特性及传热机理

InSb薄膜广泛应用于高精度的光电存储、红外探测和红外热成像技术以及超分辨掩膜层技术中.热导率及其温度特性是影响薄膜实际应用的关键因素.采用瞬态热反射方法测试了厚度为70~200nm的InSb薄膜在非晶态和晶态下热导率,并探讨了其中的传热机理.对于晶态InSb薄膜,热导率为(0.55±0.055)W/(m·K),并且随温度的变化不明显;而非晶态InSb薄膜在温度450K以下时热导率为(0.37±0.037)W/(m·K).当温度在450K以上时,由于薄膜从非晶态转化为晶态,其热导率经历了一个突然的升高过程.无论是晶态还是非晶态薄膜样品,热导率与薄膜厚度都没有明显依赖关系.研究结果可以为InSb薄膜的实际应用提供有益的参考.     

In-Plane Thermal Diffusivity Measurement of Thin Films Based on the Alternating-Current Calorimetric Method Using an Optical Reflectivity Technique

An advanced ac calorimetric method to measure thermal diffusivity of a thin sample is developed by using an optical reflectivity technique. A modulated infrared laser is used to heat the front surface of a foil specimen. The reflectivity of a continuous-wave He-Ne laser at the rear surface of the specimen is detected by a photoreceiver.     

高压下碳纳米管阵列与金属接触热阻研究

碳纳米管具有很高的轴向热导率,近年来基于碳纳米管阵列的热界面材料得到了广泛的关注.但碳纳米管阵列与金属间的接触热阻较大,通常在10mm~2·K/W以上,限制了其实际应用.目前通过化学成键等方法可将其界面热阻降至0.6mm~2·K/W,但这些方法都需要牺牲碳纳米管耐高温的特点.为保证其耐高温特性,通过施加压力的方法降低了碳纳米管阵列与金属间的接触热阻.对于高度为800μm的碳纳米管阵列,当压力为1.49 MPa时,测量得到的碳纳米管阵列-Au界面接触热阻为1.90~3.51mm~2·K/W,接近化学成键法的结果并且远小于小压力作用下的热阻,这一结果为进一步减小碳纳米管的接触热阻提供了新的思路.     

二氧化硅薄膜比热容分子动力学模拟

针对纳米量级薄膜比热容测定的困难,根据实验值建立了SiO2(100)薄膜物理模型.选取可靠的势能函数描述了分子间的相互作用,采用分子动力学模拟了它的比热容变化规律,在100～600K下给出了厚度在1～5nm的薄膜比热容对温度和厚度的依赖关系.计算结果表明,SiO2薄膜在300K下比热容明显低于相同条件下常规体材料的比热容,且随薄膜厚度的增加而增大;随温度升高,比热容变大,这同体材料是一致的.模拟结果揭示了SiO2薄膜比热容的微尺度效应,与理论分析基本吻合,可为半导体微器件的设计提供资料.     

Thermal Conductivity Measurement of Submicron-Thick Aluminium Oxide Thin Films by a Transient Thermo-Reflectance Technique

Thermal conductivity of submicron-thick aluminium oxide thin films prepared by middle frequency magnetron sputtering is measured using a transient thermo-reflectance technique. A three-layer model based on transmission line theory and the genetic algorithm optimization method are employed to obtain the thermal conductivity of thin films and the interracial thermal resistance. The results show that the average thermal conductivity of 330- 1000nm aluminium oxide thin films is 3.3 Wm^-1K^-1 at room temperature. No significant thickness dependence is found. The uncertainty of the measurement is less than 10%.     

纳米尺度水薄膜液-气相变分子动力学模拟

采用分子动力学模拟,研究了纳米尺度水薄膜厚度和系统温度对液-气相变蒸发率的影响.模拟了水薄膜厚度为2nm时,温度(375~425K)对相变蒸发率的影响;同时模拟了温度400K条件下,水薄膜厚度(2、3、4nm)对相变蒸发率的影响.结果表明:相同水薄膜厚度下蒸发率随着温度的升高而增大,相同温度下蒸发率随水薄膜厚度的增大而增大,蒸发率随时间呈指数形式递减.相关结果可为微热管及其他依靠内部液体相变传热的散热器件设计提供参考.     

食品分析

本文对 1 998～ 1 999年间国内食品分析进展作了简介 ,内容包括食品的元素分析、化合物分析、添加剂分析、毒物、药物残留分析、食品色香味品质分析、营养分析、快速检测、打假防伪分析、微生物检验和有关基础研究与新食源开发分析等。引入文献338篇。     

Preparation and Thermal Characterization of Diamond-Like Carbon Films

Diamond-like carbon （DLC） films are prepared on silicon substrates by microwave electron cyclotron resonance plasma enhanced chemical vapor deposition. Raman spectroscopy indicates that the films have an amorphous structure and typical characteristics. The topographies of the films are presented by AFM images. Effective thermal conductivities of the films are measured using a nanosecond pulsed photothermal reflectance method. The results show that thermal conductivity is dominated by the microstructure of the films.