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A liquid dewetting method for the determination of the viscoelastic properties of ultrathin polymer films has been extended to study thickness effects on the properties of ultrathin polycarbonate (PC) films. PC films with film thicknesses ranging from 4 to 299 nm were placed on glycerol at temperatures from below the macroscopic glass transition temperature (Tg) to above it with the dewetting responses being monitored. It is found that the isothermal creep results for films of the same thickness, but dewetted at different temperatures can be superposed into one master curve, which is consistent with the fact of PC being a thermorheologically simple material. Furthermore, the results show that the Tg of PC thin films is thickness dependent, but the dependence is weaker than the results for freely standing films and similar to literature data for PC films supported on rigid substrates. It was also found that the rubbery plateau region for the PC films stiffens dramatically, but still less than what has been observed for freely standing polycarbonate films. The rubbery stiffening is discussed in terms of a recently reported model that relates macroscopic segmental dynamics with the stiffening. © 2015 Wiley Periodicals, Inc. J. Polym. Sci., Part B: Polym. Phys. 2015 , 53, 1559–1566  相似文献   
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Cinnamaldehyde (CA), an active ingredient isolated from the traditional Chinese medicine Cortex Cinnamomi, has a wide range of bioactivities. To clarify the distribution characteristics of CA, a selective and sensitive method utilizing gas chromatography–mass spetrometry was initially developed for simultaneously determining the concentration of CA and its metabolite cinnamyl alcohol in rat tissues. Selected ion masses of m/z 131, 105 and 92 were chosen, and separation of the analytes was performed on a DB‐5 ms (30 m × 0.25 mm, 0.25 µm, thickness) capillary column by gas chromatography–mass spectrometry. The calibration curves demonstrated good linearity and reproducibility over the range of 20–2000 and 20–4000 ng/mL for various tissue samples. Recoveries ranged from 86.8 to 107.5%, while intra‐ and interday relative standard deviations were all <11.3%. The analysis method was successfully applied in tissue distribution studies for CA and cinnamyl alcohol. As CA and cinnamyl alcohol may inter‐convert to one another, simultaneous determination of both analytes provides a comparative and accurate data for tissue study. The concentrations of CA and cinnamyl alcohol remaining in spleen were the highest among the main organs, including heart, liver, spleen, lung, kidney and brain. In addition, there was no long‐term accumulation of CA in rat tissues. Copyright © 2014 John Wiley & Sons, Ltd.  相似文献   
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在课程群的教学中由于每门课程各自独立开展教学,缺乏知识的融合和衔接,导致学生运用综合知识解决问题的能力较弱。在课程群的教学中采用案例嵌入协同教学模式,将完整的工程案例嵌入到课程群各门课程的教学中,协同规划各门课程的教学任务,每门课程再围绕案例展开研究性教学。通过嵌入的工程案例衔接各门课程的知识点,帮助学生建构完整的知识体系,强化工程应用的概念;同时通过研究性教学,培养学生分析问题和解决问题的能力,两部分相结合,提高了学生运用综合知识解决复杂问题的能力。  相似文献   
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孙暐  吴镇扬 《信号处理》2006,22(4):559-563
根据Flether等人的研究,基于感知独立性假设的子带识别方法被用于抗噪声鲁棒语音识别。本文拓展子带方法,采用基于噪声污染假定的多带框架来减少噪声影响。论文不仅从理论上分析了噪声污染假定多带框架在识别性能上的潜在优势,而且提出了多带环境下的鲁棒语音识别算法。研究表明:多带框架不仅回避了独立感知假设要求,而且与子带方法相比,多带方法能更好的减少噪声影响,提高系统识别性能。  相似文献   
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The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported  相似文献   
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Many issues in signal processing involve the inverses of Toeplitz matrices. One widely used technique is to replace Toeplitz matrices with their associated circulant matrices, based on the well-known fact that Toeplitz matrices asymptotically converge to their associated circulant matrices in the weak sense. This often leads to considerable simplification. However, it is well known that such a weak convergence cannot be strengthened into strong convergence. It is this fact that severely limits the usefulness of the close relation between Toeplitz matrices and circulant matrices. Observing that communication receiver design often needs to seek optimality in regard to a data sequence transmitted within finite duration, we define the finite-term strong convergence regarding two families of matrices. We present a condition under which the inverses of a Toeplitz matrix converges in the strong sense to a circulant matrix for finite-term quadratic forms. This builds a critical link in the application of the convergence theorems for the inverses of Toeplitz matrices since the weak convergence generally finds its usefulness in issues associated with minimum mean squared error and the finite-term strong convergence is useful in issues associated with the maximum-likelihood or maximum a posteriori principles.  相似文献   
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