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S-Al2CuMg相是Al-Cu-Mg合金中重要的强化相,但它的晶体学结构还存在争议。利用高分辨电子显微学和像的解卷处理技术,获得了Al-Cu-Mg合金中S-Al2CuMg相在[100],[010]和[001]的原子投影图,进而验证PW模型是S相正确的结构模型。另外,将动力学校正引入到S相孪晶图像的处理过程,确定了S相孪晶面的位置。像解卷处理方法首次应用于金属材料并确定了S相缺陷结构,说明该方法适用于金属材料。通过解卷处理方法可以使原本不直接对应所观察材料的高分辨晶格像转变成点分辨率达到电镜的信息分辨极限的结构像。 相似文献
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High-quality CdS quantum dots sensitized ZnO nanotube array films for superior photoelectrochemical performance
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Qian-Qian Gong 《中国物理 B》2022,31(9):98103-098103
The surface characteristics of ZnO were synthetically optimized by a self-designed simultaneous etching and W-doping hydrothermal method utilizing as-prepared ZnO nanorod (NR) array films as the template. Benefiting from the etching and regrowth process and the different structural stabilities of the various faces of ZnO NRs, the uniquely etched and W-doped ZnO (EWZ) nanotube (NT) array films with larger surface area, more active sites and better energy band structure were used to improve the photoelectrochemical (PEC) performance and the loading quality of CdS quantum dots (QDs). On the basis of their better surface characteristics, the CdS QDs were uniformly loaded on EWZ NT array film with a good coverage ratio and interface connection; this effectively improved the light-harvesting ability, charge transportation and separation as well as charge injection efficiency during the PEC reaction. Therefore, all the CdS QD-sensitized EWZ NT array films exhibited significantly enhanced PEC performance. The CdS/EWZ-7 composite films exhibited the optimal photocurrent density with a value of 12 mA· cm-2, 2.5 times higher than that of conventional CdS/ZnO-7 composite films under the same sensitization times with CdS QDs. The corresponding etching and optimizing mechanisms were also discussed. 相似文献
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运用模糊数学模型和食品安全指数IFS模型进行安全风险评估,对深圳市新鲜蔬菜批发市场、农贸市场、超市及零售店等常规渠道与其他输入渠道进行模糊评价,得出食品安全风险等级,构建了蔬菜安全风险评估层次结构模型,评估出深圳市新鲜蔬菜安全风险较高。对已有的抽样方案进行改进,设计了两套深圳市新鲜蔬菜抽样检验方案,分别适用于深圳市所有的蔬菜交易市场和销售蔬菜的超市、零售店以及蔬菜产地、蔬菜加工厂的样本抽取及实验室试样的制备。 相似文献
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高清晰度低成本LED流光式全彩色显示系统 总被引:1,自引:0,他引:1
根据"视觉暂留原理"而研发的"流光式LED全彩色显示屏"原理应用巧妙、成本低廉、360°无视线障碍是该结构的明显特点;球型、盘型、柱型的数十万乃至近千万的象素点分辨率更是令人关注的亮点。 相似文献
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通常中小功率塑封管的烧结方去有银泥、银浆、导电胶、共晶法等.前三种最大的特点是成本低效率高,但高低温热性能、电耐久性.工艺重复性差.共晶法技术难度较大,成本高,但质量和一致性好.为了保证彩电等整机的质量水平,目前国外采用此法颇多,在国内,对芯片来源于国外的部分厂家,也采用了此法.由于背面金属化等方面的原因,大部分国产化芯片,目前尚不能采用此法烧结.可是要求用于彩电的塑封管,必须全部采用共晶法烧结工艺.因此,尽快解决芯片背面金属化问题势在必行. 相似文献