一种新的T型栅加工技术

研制出的ＰＨＥＭＴ采用一种新的０．１μｍＴ型栅制备方法，将薄膜纵向可控变为横向可控，应用这一原理，对时间等参量进行控制，获得０．１～０．３μｍ微细金属栅条，此工艺应用于３ｍｍ器件研制，器件的直流跨导大于４００ｍＳ／ｍｍ，微波性能在４０ＧＨｚ时，Ｇｍａｘ达５．６７ｄＢ。特征频率ｆＴ可外推至７４ＧＨｚ，最高振荡频率ｆｍａｘ可达１３０ＧＨｚ。     

Fabrication of 4-Inch Nano Patterned Wafer with High Uniformity by Laser Interference Lithography

We report the fabrication of 4-inch nano patterned wafer by two-beam laser interference lithography and analyze the uniformity in detail. The profile of the dots array with a period of 800 nm divided into five regions is characterized by a scanning electron microscope. The average size in each region ranges from 270 nm to 320 nm,and the deviation is almost 4%, which is approaching the applicable value of 3% in the industrial process. We simulate the two-beam laser interference lithography system with MATLAB software and then calculate the distribution of light intensity around the 4 inch area. The experimental data fit very well with the calculated results. Analysis of the experimental data and calculated data indicates that laser beam quality and space filter play important roles in achieving a periodical nanoscale pattern with high uniformity and large area. There is the potential to obtain more practical applications.     

热超声倒装焊在制作大功率GaN基LED中的应用

设计了适合于倒装的大功率GaN基LED芯片结构,在倒装基板硅片上制作了金凸点,采用热超声倒装焊接(FCB)技术将芯片倒装在基板上.测试结果表明获得的大面积金凸点连接的剪切力最高达53.93 g/bump,焊接后的GaN基绿光LED在350 mA工作电流下正向电压为3.0 V.将热超声倒装焊接技术用于制作大功率GaN基LED器件,能起到良好的机械互连和电气互连.     

n型AlxGa1-xN材料的电学和光学性质

文章介绍了无裂纹高导电性n型A lxGa1-xN的MOCVD生长及其电学、光学和表面形貌性质。通过A lN两步生长法,有效地解决了A lxGa1-xN外延薄膜易裂的难题。并且对其生长进行优化,减少了A lxGa1-xN外延薄膜中的受主补偿缺陷,从而实现了高导电性的n型A lxGa1-xN薄膜,其载流子浓度为4.533×1018cm-3,并且电子迁移率高达77.5cm2/V.s,已经达到了目前国际上报道的先进水平。另外光学吸收谱说明A lxGa1-xN外延薄膜在302nm处具有陡峭的带边吸收,同时结合原子力显微镜分析材料的表面形貌,证实了材料表面光滑且平整。     

AlN外延薄膜的生长和特征

文章研究了AlN薄膜的晶体质量、表面形貌、应力等性质与AlN生长工艺的依赖关系。通过对低温成核厚度、成核温度和高温生长AlN所用Ⅴ／Ⅲ比的研究，制备出了具有较好晶体质量的AlN薄膜。高分辨三晶X射线衍射给出AlN薄膜的(002)和(105)的半高宽分别为16．9arcsec和615arcsec，接近国际上报道的较好结果。原子力显微镜对表面形貌的分析表明AlN薄膜的粗糙度为5．7nm。拉曼光谱表明E2(high)模向高能方向移动，说明蓝宝石上外延的AlN薄膜处于压应变状态。光学吸收谱在204nm处具有陡峭的带边吸收，也表明了AlN外延薄膜具有较好地晶体质量。     

移相腌模应用技术

一种用于大栅宽器件的移相掩膜应用技术是将移相器边缘线用作不透明掩膜，以代替铬图形。利用此移相掩膜技术，制作了特殊线长为０．１５μｍ的微细栅条和大栅宽器件。     

使用AlN/GaN超晶格势垒层生长高Al组分AlGaN/GaN HEMT结构

在蓝宝石衬底上生长了以AlN/GaN超晶格准AlGaN合金作为势垒的HEMT结构材料,并与传统AlGaN合金势垒样品进行了对比.在高Al组分(≥40%)情况下,超晶格势垒样品的表面形貌明显改进,电学性能特别是2DEG面电子浓度也有所改进.对超晶格势垒生长参数进行了初步优化,使得HEMT结构薄层电阻进一步降低,最后获得了251 Ω/□的薄层电阻. 关键词： AlGaN/GaN 结构 AlN/GaN超晶格 二维电子气 高电子迁移率晶体管     

Enhanced Photoluminescence of InGaN/GaN Green Light-Emitting Diodes Grown on Patterned Sapphire Substrate

Green InGaN/GaN based light-emitting diodes （LEDs） are fabricated both on planar and wet-etched patterned sapphire substrates by metalorganic vapour phase epitaxy （MOVPE）. Their photoluminescence （PL） properties of the two samples are studied. The results indicate that the PL integral intensity of the green LED on the patterned substrate is nearly two times of that on the planar one within the whole measured temperature range. The enhanced PL intensity in the green LED on the patterned substrate is shown completely contributed from the extraction efficiency, but not from the internal quantum efficiency. The conclusion is supported by temperature-dependent PL analysis on the two samples, and the mechanisms axe discussed.     

Characteristic improvements of thin film AlGaInP red light emitting diodes on a metallic substrate

We report a type of thin film Al Ga In P red light emitting diode(RLED) on a metallic substrate by electroplating copper(Cu) to eliminate the absorption of Ga As grown substrate.The fabrication of the thin film RLED is presented in detail.Almost no degradations of epilayers properties are observed after this substrate transferred process.Photoluminescence and electroluminescence are measured to investigate the luminous characteristics.The thin film RLED shows a significant enhancement of light output power(LOP) by improving the injection efficiency and light extraction efficiency compared with the reference RLED on the Ga As parent substrate.The LOPs are specifically enhanced by 73.5% and 142% at typical injections of 2 A/cm~2 and 35 A/cm~2 respectively from electroluminescence.Moreover,reduced forward voltages,stable peak wavelengths and full widths at half maximum are obtained with the injected current increasing.These characteristic improvements are due to the Cu substrate with great current spreading and the back reflection by bottom electrodes.The substrate transferred technology based on electroplating provides an optional way to prepare high-performance optoelectronic devices,especially for thin film types.     

Carrier transport in III–V quantum-dot structures for solar cells or photodetectors

According to the well-established light-to-electricity conversion theory,resonant excited carriers in the quantum dots will relax to the ground states and cannot escape from the quantum dots to form photocurrent,which have been observed in quantum dots without a p–n junction at an external bias.Here,we experimentally observed more than 88% of the resonantly excited photo carriers escaping from In As quantum dots embedded in a short-circuited p–n junction to form photocurrent.The phenomenon cannot be explained by thermionic emission,tunneling process,and intermediate-band theories.A new mechanism is suggested that the photo carriers escape directly from the quantum dots to form photocurrent rather than relax to the ground state of quantum dots induced by a p–n junction.The finding is important for understanding the low-dimensional semiconductor physics and applications in solar cells and photodiode detectors.