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A vertical two-terminal silicon PNPN diode is presented for use in a high-density memory cell. The device design for high-speed operations was studied with experiments and calibrated simulations, which proves that the proposed memory cell can be operated at nanosecond range. The static and dynamic power dissipations were also studied, which indicated the availability of the proposed memory cell for VLS1 applications. Moreover, the memory cell is compatible with CMOS process, has little impact from process variation, and has good reliability. 相似文献
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The importance of substrate doping engineering for extremely thin SOI MOSFETs with ultra-thin buried oxide(ES-UB-MOSFETs) is demonstrated by simulation.A new substrate/backgate doping engineering,lateral non-uniform dopant distributions(LNDD) is investigated in ES-UB-MOSFETs.The effects of LNDD on device performance,V t-roll-off,channel mobility and random dopant fluctuation(RDF) are studied and optimized.Fixing the long channel threshold voltage(V t) at 0.3 V,ES-UB-MOSFETs with lateral uniform doping in the substrate and forward back bias can scale only to 35 nm,meanwhile LNDD enables ES-UB-MOSFETs to scale to a 20 nm gate length,which is 43% smaller.The LNDD degradation is 10% of the carrier mobility both for n MOS and p MOS,but it is canceled out by a good short channel effect controlled by the LNDD.Fixing V t at 0.3 V,in long channel devices,due to more channel doping concentration for the LNDD technique,the RDF in LNDD controlled ES-UB-MOSFETs is worse than in back-bias controlled ES-UB-MOSFETs,but in the short channel,the RDF for LNDD controlled ES-UB-MOSFET is better due to its self-adaption of substrate doping engineering by using a fixed thickness inner-spacer.A novel process flow to form LNDD is proposed and simulated. 相似文献
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A two-port capacitorless PNPN device with high density,high speed and low power memory fabricated using standard CMOS technology is presented.Experiments and calibrated simulations were conducted which prove that this new memory cell has a high operation speed(ns level),large read current margin(read current ratio of 10~4×),low process variation,good thermal reliability and available retention time(190 ms).Furthermore,the new memory cell is free of the cyclic endurance/reliability problems induced by hot-carrier injection due to the gateless structure. 相似文献
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肖特基势垒二极管(SBD)具有强非线性效应、速度快及容易系统集成等特点,常用于微波、毫米波及太赫兹波的产生和检测。本文通过电子束光刻等技术制作出肖特基接触直径1 μm的二极管,并对二极管进行了直流测试和射频测试。经过直流测试,二极管的串联电阻为10.2 Ω,零偏结电容为1.76 fF,肖特基结截止频率达到了8.7 THz;相同管子的射频测试串联电阻为15.4 Ω,零偏结电容1.46 fF,肖特基结截止频率也达到了7 THz。 相似文献
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