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We report on metal (Cr, Ni, or Pd)-induced solid-phase crystallization (MISPC) of plasma-enhanced chemical-vapor-deposited
hydrogenated amorphous silicon at annealing temperatures ≤600 °C. MISPC is found to significantly reduce the thermal budget
of crystallization at annealing temperatures as low as ∼400 °C. The lowest achievable annealing temperature is found to depend
on the metal type. The metal type is also found to influence grain size and the conductivity of the polycrystalline silicon.
Received: 21 June 1999 / Accepted: 20 October 1999 / Published online: 23 February 2000 相似文献
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