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A numerical simulation model for predicting residual stresses which arise during the solidification process of pressed glass bulb panel was developed. The solidification of a molten layer of glass between cooled parallel plates was used to model the mechanics of the buildup of residual stresses in the forming process. A thermorheologically simple thermoviscoelastic model was assumed for the material. The finite element method employed was based on the theory of shells as an assembly of flat elements. This approach calculates residual stresses layer by layer like a truly three-dimensional calculation, which is well suited for thin pressed products of complex shape. An experimental comparison was employed to verify the proposed models and methods. 相似文献
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本文基于数值方法研究了超声波振动辅助倒装芯片成型下填充填缝工艺。采用了一种基于紧耦合的流固耦合算法,对结构和流场之间的耦合运动进行了数值模拟,其中流场部分采用有限体积法对任意拉格朗日-欧拉方法的不可压缩N-S方程进行离散计算,而结构部分采用有限元法对拉格朗日坐标下的弹性动力学方程进行离散计算。在一个时间步内,结构与流场的计算区域的交界面上进行了多次的数值传递和插值,以保证满足耦合面边界条件。计算了超声波振动作为边界条件作用于结构场,而引起的流场中流体流速的变化规律,并通过实验验证了本方法的正确性。同时,监测了流场入口体积流量的变化规律,探究了超声波振幅、频率以及流体粘度等因素对流体流速的影响,为超声波振动辅助倒装芯片成型下填充工艺的应用提供了理论依据。 相似文献
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