Comparison of Bottom-up Filling in Electroless Plating with an Addition of PEG,PPG and EPE

The bottom‐up filling capabilities of electroless copper plating bath with an addition of additives, such as polyethylene glycol (PEG), polypropylene glycol (PPG) and triblock copolymers of PEG and PPG with ethylene oxide terminal blocks termed EPE, were investigated by the cross‐sectional scanning electron microscopy (SEM) observation of sub‐micrometer trenches. Though three additives had inhibition for electroless copper deposition, the suppression degrees of three additives were different. EPE‐2000 had the strongest suppression for electroless copper deposition, and the suppression of PEG‐2000 was the weakest. The bottom‐up filling capability of electroless copper was investigated in a plating bath containing different additives with the concentration of 2.0 mg/L. The cross‐sectional SEM observation indicated the trenches with the width of 280 nm and the depth of 475 nm were all completely filled by the plating bath with an addition of EPE‐2000, but the trenches were not completely filled by the plating bath with an addition of PEG‐2000 or PPG‐2000, and some voids appeared. Linear sweep voltammetry measurement indicated that three additives all inhibited the cathodic reduction reaction and the anodic oxidation reaction, and the inhibition of EPE‐2000 was the strongest among three additives, which agreed with that of the deposition rate of electroless copper. Significant differences in surface roughness of deposited copper film were observed by UV‐visible near‐infrared for different suppressors, and the bright and smooth of deposited copper film were in accordance with the inhibition of three additives.     

间硝基苯甲酸稀土配合物的热分解

用TG-DTA,高温X-射线衍射研究了稀土间硝基苯甲酸配合物LnL_3·nH_2O(n=2,Ln=La→Lu+Y;n=0,Ln=Sc,HL=间硝基苯甲酸)的热分解行为,DSC测定其脱水相变过程中的热力学函数,同时用透射电镜观察了热分解产物的超微性。     

稀土与甘氨酰－L－亮氨酸的配位作用

用ｐＨ电位法测定了生理条件下（３７℃，Ｉ＝０．１５ｍｏｌ／Ｌ）和２５℃，Ｉ＝０．１０ｍｏｌ／Ｌ时甘氨酰－Ｌ－亮氨酸的质子化常数及其稀土配合物稳定常数，结果表明稀土可与该配体形成１：１配合物，并且配合物稳定性呈现明显“四分组效应”。讨论了钇的位置以及肽键对配合物稳定性的影响。     

稀土与甘氨酰—L—亮氨酸的配位作用

用ｐＨ电位法测定了生理条件（３７℃，Ｉ＝０．１５ｍｏｌ／Ｌ）和２５℃，Ｉ＝０．１０ｍｏｌ／Ｌ时甘氨酰Ｌ－亮氨酸的质子化常数及其稀土配合物稳定常数。结果表明稀土可与该配体形成１：１配合物，并且配合物稳定性呈现明显“四分组效应”。讨论了钇的位置以及肽键对配合物稳定性的影响。     

铽、钙的L-谷氨酸和L-苏氨酸三元配合物的研究

生物体内是多种生物分子共存的复杂环境,三元配合物广泛存在,并表现了许多重要生物功能.氨基酸是生物体内一类普遍存在的生物配体.游离氨基酸可形成多种具有生物功能的多元配合物.     

预处理石墨对合成金刚石性能的影响

 本文介绍了对合成金刚石用石墨片进行预处理的方法。研究表明，用已处理过的石墨片合成出粒度组、强度高、完整单晶多的金刚石，金刚石中Ni、Mn、Co、Si的含量明显减少，而氮的含量明显增加。并观察到触媒片两面都能均匀地生长理想的金刚石晶体。该预处理方法不仅提高金刚石的质量，而且有可能为认识石墨转化为金刚石的机理提供一些依据。     

铽芳香族羧酸配合物的热分解机理及动力学研究

本文采用TG-DTA-DTG等技术研究了铽羧酸配合物的热分解过程,通过对中间产物进行红外光谱、元素分析、确定了热分解机理。采用三种方法尝试求得了希土羧酸配合物热分解过程的活化能和焓变,发现并总结了其相变过程。     

替代元素铝和钕对La-Mg-Ni系AB3.5型贮氢合金性能的影响

用冷坩埚磁悬浮熔炼方法制备La0.7Mg0.3（Ni0.85-xCo0.15Alx）3.4（x=0.00,0.04）和La0.7-yNdyMg0.3（Ni0.81Co0.15Al0.04）3.4（y=0.10）贮氢合金,采用XRD,FESEM,EDS,P-C-T测试及三电极电化学性能测试研究合金的相结构、相成分、P-C-T曲线、电化学性能及相应电极的表面状态。Rietveld法全谱拟合表明,La0.7Mg0.3（Ni0.85Co0.15）3.4合金为多相结构,主相为Ce2Ni7型六方相,主相成分为（La,Mg）（Ni0.85Co0.15）2.9-3.3。P-C-T曲线显示随着Al和Nd的依次替代,平台压力从0.0118 MPa降低到0.0057 MPa再升高到0.0073 MPa。电化学性能测试表明,最大放电容量先从392.9 mAh.g^-1降低到363.4 mAh.g^-1再降低到343.7 mAh.g^-1,循环稳定性则从59.6%增加到73.1%再增加到79.7%。